Number | Date | Country | Kind |
---|---|---|---|
3808667 | Mar 1988 | DEX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/DE89/00163 | 3/15/1988 | 4/2/1990 | 4/2/1990 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO89/08927 | 9/21/1989 |
Number | Name | Date | Kind |
---|---|---|---|
3658618 | Gramann | Apr 1972 | |
3708851 | Vladik | Jan 1973 | |
4305097 | Doemens et al. | Dec 1981 | |
4432131 | Sadamassa et al. | Feb 1984 |
Number | Date | Country |
---|---|---|
0125632 | May 1984 | EPX |
0150882A1 | Jan 1985 | EPX |
1805174 | May 1970 | DEX |
3009985 | Sep 1981 | DEX |
3447452A1 | Jul 1985 | DEX |
3534338A1 | Apr 1987 | DEX |
57-207076 | Dec 1982 | JPX |
2156153A | Oct 1985 | GBX |
Entry |
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"Water Soluble Blister Packaging for Electrical Components", by E. G. Crosby, et al., IBM Technical Disclosure Bulletin, vol. 16, No. 6, Nov. 1973, p. 1749. |
"High-Accuracy Die-Bonding Technology for LED Array", by Hiroshi Tanabe, et al., IEEE Transactions of Components, Hybrids & Manufacturing Technology, Dec., 1985, No. 4, New York, pp. 500-504. |