for positioning, orientation or alignment

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CPC
H01L21/68

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process tool and method for handling semiconductor substrate
- Patent number 12,327,743
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fung-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier chuck and methods of forming and using thereof
- Patent number 12,327,749
- Issue date Jun 10, 2025
- Intel Corporation
- Deniz Turan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 12,327,811
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FOUP transfer device
- Patent number 12,327,746
- Issue date Jun 10, 2025
- Rorze Corporation
- Yoshiyuki Fujishiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck device, pressure calculation method and program
- Patent number 12,327,750
- Issue date Jun 10, 2025
- Horiba Stec, Co., Ltd.
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive parallel assembly method
- Patent number 12,327,751
- Issue date Jun 10, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grip-based transport speeds for transporting objects at a manufactu...
- Patent number 12,325,140
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Khai T. Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment-assisting tray, alignment-control apparatus and alignment...
- Patent number 12,327,742
- Issue date Jun 10, 2025
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motion device with magnetic levitation for wafer loading and unloading
- Patent number 12,327,752
- Issue date Jun 10, 2025
- YinGuan Semiconductor Technology Co., LTD.
- Huoliang Wu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillating secondary stage for frame-mode overlay metrology
- Patent number 12,327,741
- Issue date Jun 10, 2025
- KLA Corporation
- Izhar Agam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suction gripper for warped workpiece
- Patent number 12,327,753
- Issue date Jun 10, 2025
- Core Flow Ltd.
- Roie Taboch
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor processing apparatus and method
- Patent number 12,327,748
- Issue date Jun 10, 2025
- PIOTECH INC.
- Zhuo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,327,755
- Issue date Jun 10, 2025
- Kokusai Electric Corporation
- Naofumi Ohashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Redistribution layer structure
- Patent number 12,322,686
- Issue date Jun 3, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large die wafer, large die and method of forming the same
- Patent number 12,322,707
- Issue date Jun 3, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate
- Patent number 12,322,598
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate inspection system and method of use thereof
- Patent number 12,322,616
- Issue date Jun 3, 2025
- JNK TECH
- Youngjin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond method for fixing dies
- Patent number 12,322,639
- Issue date Jun 3, 2025
- Yen Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical indexer for multi-station process module
- Patent number 12,322,641
- Issue date Jun 3, 2025
- Lam Research Corporation
- Michael Nordin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Height adjustable semiconductor wafer support
- Patent number 12,322,643
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming Shing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder for use in a lithographic apparatus
- Patent number 12,321,104
- Issue date Jun 3, 2025
- ASML Netherlands B.V.
- Thomas Poiesz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual zone heaters for metallic pedestals
- Patent number 12,322,617
- Issue date Jun 3, 2025
- Lam Research Corporation
- Sairam Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 12,322,632
- Issue date Jun 3, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination processes and fabrication of thin film devices thereby
- Patent number 12,322,635
- Issue date Jun 3, 2025
- Purdue Research Foundation
- Chi Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,322,638
- Issue date Jun 3, 2025
- Disco Corporation
- Yoshinori Kakinuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,322,640
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT
- Publication number 20250191944
- Publication date Jun 12, 2025
- Axcelis Technologies, Inc.
- Yusef Nouri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE STRUCTURE OF AN ELECTROSTATIC CHUCK AND METHOD FOR FORMING...
- Publication number 20250191955
- Publication date Jun 12, 2025
- Feedback Technology Corp.
- Tsung-Feng Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CHUCK DEVICE AND COOLING PLATE
- Publication number 20250191956
- Publication date Jun 12, 2025
- HORIBA STEC, CO., LTD.
- Esteban GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PELLICLE REMOVAL TOOL
- Publication number 20250191952
- Publication date Jun 12, 2025
- PHOTRONICS, INC.
- Hilario Ar-Miguel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CLAMP FORCE ELECTROSTATIC CHUCK FOR NON-FLAT SUBSTRATES
- Publication number 20250191957
- Publication date Jun 12, 2025
- Entegris, Inc.
- Steven Donnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250191960
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyun Sun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250191963
- Publication date Jun 12, 2025
- Kokusai Electric Corporation
- Toshiki FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD
- Publication number 20250191964
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Takehiro SHINDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR INCLUDING PURGE GAS FLOW PASSAGE
- Publication number 20250191965
- Publication date Jun 12, 2025
- MICO CERAMICS LTD.
- Jung-Chul Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-AXIS OPERATION APPARATUS IN ISOTROPIC ARRANGEMENT
- Publication number 20250189350
- Publication date Jun 12, 2025
- GALLANT MICRO. MACHINING CO., LTD.
- TUN-CHIH SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE FOR SEMICONDUCTOR EQUIPMENT, METHOD OF OPERATING A SE...
- Publication number 20250189347
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Gyoseon Choo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Semiconductor Device Fabrication Involving Porous Silico...
- Publication number 20250194125
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR
- Publication number 20250191954
- Publication date Jun 12, 2025
- NGK Insulators, Ltd.
- Yutaka UNNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic Chuck Assembly for Plasma Processing Apparatus
- Publication number 20250191958
- Publication date Jun 12, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...
- Publication number 20250194165
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Changwoo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20250191905
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
- Publication number 20250191940
- Publication date Jun 12, 2025
- SPTS TECHNOLOGIES LIMITED
- Phil WALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
- Publication number 20250191941
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED COMPRESSION WASHER FOR BONDING CERAMIC PLATE AND METAL...
- Publication number 20250191953
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Eric A. PAPE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...
- Publication number 20250191959
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND USER INTERFACE FOR EDGE RING WEAR COMPENSATION
- Publication number 20250191962
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Tom A. KAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250192008
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR
- Publication number 20250193971
- Publication date Jun 12, 2025
- NGK Insulators, Ltd.
- Naoki YOSHITAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GRIPPING APPARATUS
- Publication number 20250191961
- Publication date Jun 12, 2025
- EBARA CORPORATION
- SATOSHI AO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTANCE MEASUREMENT METHOD, DISTANCE MEASUREMENT SYSTEM, AND SUBST...
- Publication number 20250180381
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Tomohiro YAMANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20250181941
- Publication date Jun 5, 2025
- NOVA LTD
- EITAN ROTHSTEIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF ADDITIVELY MANUFACTURING HIGH-PURITY SILICON, METHOD OF A...
- Publication number 20250178234
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Takayuki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process tool and method for handling semiconductor substrate

Carrier chuck and methods of forming and using thereof

Ion implantation with annealing for substrate cutting

Semiconductor device and manufacturing method thereof

FOUP transfer device

Electrostatic chuck device, pressure calculation method and program

Massive parallel assembly method

Grip-based transport speeds for transporting objects at a manufactu...

Alignment-assisting tray, alignment-control apparatus and alignment...

Motion device with magnetic levitation for wafer loading and unloading

Method of manufacturing display device using semiconductor light em...

Oscillating secondary stage for frame-mode overlay metrology

Suction gripper for warped workpiece

Semiconductor processing apparatus and method

Substrate processing apparatus, method of manufacturing semiconduct...

Redistribution layer structure

Package structure with underfill

Chip package and manufacturing method thereof

Large die wafer, large die and method of forming the same

Method of processing substrate

Substrate inspection system and method of use thereof

Hybrid bond method for fixing dies

Mechanical indexer for multi-station process module

Height adjustable semiconductor wafer support

Substrate holder for use in a lithographic apparatus

Dual zone heaters for metallic pedestals

Substrate alignment systems and related methods

Delamination processes and fabrication of thin film devices thereby

Processing apparatus

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT

SURFACE STRUCTURE OF AN ELECTROSTATIC CHUCK AND METHOD FOR FORMING...

ELECTROSTATIC CHUCK DEVICE AND COOLING PLATE

PELLICLE REMOVAL TOOL

HIGH CLAMP FORCE ELECTROSTATIC CHUCK FOR NON-FLAT SUBSTRATES

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD

SUSCEPTOR INCLUDING PURGE GAS FLOW PASSAGE

MULTI-AXIS OPERATION APPARATUS IN ISOTROPIC ARRANGEMENT

SENSOR DEVICE FOR SEMICONDUCTOR EQUIPMENT, METHOD OF OPERATING A SE...

Methods of Semiconductor Device Fabrication Involving Porous Silico...

CERAMIC SUSCEPTOR

Electrostatic Chuck Assembly for Plasma Processing Apparatus

UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

Integrated Devices in Semiconductor Packages and Methods of Forming...

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE

ENCAPSULATED COMPRESSION WASHER FOR BONDING CERAMIC PLATE AND METAL...

SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...

SYSTEM, METHOD, AND USER INTERFACE FOR EDGE RING WEAR COMPENSATION

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

CERAMIC SUSCEPTOR

SUBSTRATE GRIPPING APPARATUS

PLANARIZATION METHOD OF WAFER

DISTANCE MEASUREMENT METHOD, DISTANCE MEASUREMENT SYSTEM, AND SUBST...

METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING

METHOD OF ADDITIVELY MANUFACTURING HIGH-PURITY SILICON, METHOD OF A...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER