for positioning, orientation or alignment

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CPC
H01L21/68

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Edge seal for lower electrode assembly
- Patent number 12,368,025
- Issue date Jul 22, 2025
- Lam Research Corporation
- David Schaefer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer taping apparatus and method
- Patent number 12,368,063
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Yi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method, apparatus, and system for dynamically controlling an electr...
- Patent number 12,368,067
- Issue date Jul 22, 2025
- ASML Netherlands B.V.
- Yixiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamellar ceramic structure
- Patent number 12,368,029
- Issue date Jul 22, 2025
- Lam Research Corporation
- Joel Philip Hollingsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape affixing apparatus
- Patent number 12,368,064
- Issue date Jul 22, 2025
- Tokyo Seimitsu Co., Ltd.
- Kiyotaka Kizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loader device and substrate transport system
- Patent number 12,365,095
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyun Jae Kang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,368,068
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Yuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information processing apparatus for teaching transfer position of...
- Patent number 12,367,602
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Tadashi Enomoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 12,369,431
- Issue date Jul 22, 2025
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer device including housing provided with fan
- Patent number 12,368,069
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Kousei Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus, substrate processing apparatus, subst...
- Patent number 12,368,059
- Issue date Jul 22, 2025
- Ebara Corporation
- Shuji Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for correcting non-ideal wafer topography
- Patent number 12,368,066
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Mu Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,368,145
- Issue date Jul 22, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,202
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Fumihiro Kamimura
- B08 - CLEANING
Information Patent Grant
Electrostatic chuck and semiconductor processing apparatus
- Patent number 12,362,217
- Issue date Jul 15, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic sintered body comprising magnesium aluminate spinel
- Patent number 12,358,806
- Issue date Jul 15, 2025
- Heraeus Covantics North America LLC
- Luke Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device using stationary laser...
- Patent number 12,362,204
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Ji Hoon Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick and placement of semiconductor chips based on nozzleless self-...
- Patent number 12,362,205
- Issue date Jul 15, 2025
- University of Southern California
- Eun Sok Kim
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
OHT vehicle and method of controlling operation of same
- Patent number 12,362,214
- Issue date Jul 15, 2025
- Semes Co., Ltd.
- Sung Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and semiconductor fabrication method us...
- Patent number 12,362,216
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Daehyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and methods of use
- Patent number 12,362,218
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and transfer substrate for...
- Patent number 12,362,220
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus and method
- Patent number 12,362,152
- Issue date Jul 15, 2025
- SPTS Technologies Limited
- Maxime Varvara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam etching chamber with etching by-product redistributor
- Patent number 12,362,154
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20250239477
- Publication date Jul 24, 2025
- AUO Corporation
- Kuan-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD LOCK DEVICE
- Publication number 20250239465
- Publication date Jul 24, 2025
- Canon ANELVA Corporation
- Jun MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...
- Publication number 20250239475
- Publication date Jul 24, 2025
- JSW Aktina System Co., Ltd.
- Takahiro FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20250239480
- Publication date Jul 24, 2025
- NGK Insulators, Ltd.
- Shota YAMAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICRO DEVICE PANEL
- Publication number 20250239470
- Publication date Jul 24, 2025
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS
- Publication number 20250239476
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Takamitsu TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A SPATIAL DEPOSITION TOOL
- Publication number 20250239479
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- Joseph AuBuchon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANTI-SLIP COMPOSITIONS AND COMPONENTS FOR SEMICONDUCTOR WAFER HANDL...
- Publication number 20250237944
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chung-Ming Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250239478
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kota HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS
- Publication number 20250239493
- Publication date Jul 24, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD INCL...
- Publication number 20250232987
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Boi IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF
- Publication number 20250233008
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE APPARATUS, CONVEYANCE METHOD, AND SEMICONDUCTOR APPARATU...
- Publication number 20250232996
- Publication date Jul 17, 2025
- JSW Aktina System Co., Ltd.
- Teruaki SHIMOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING SEMICONDUCTOR WAFER AND DIE HANDLING
- Publication number 20250233005
- Publication date Jul 17, 2025
- CIENA CORPORATION
- Martin Caron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEMENT MEMBER
- Publication number 20250233009
- Publication date Jul 17, 2025
- KYOCERA CORPORATION
- Koji AKASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER POSITIONING AND CORRECTION METHOD, SYSTEM, AND DEVICE
- Publication number 20250232999
- Publication date Jul 17, 2025
- Hito Robotic System Inc.
- RONGSHENG LYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20250233001
- Publication date Jul 17, 2025
- TOTO LTD.
- Yuki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARTUS FOR DETECTING POSITION OF WAFER AND OPERATING METHOD THEREOF
- Publication number 20250233006
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyungrim Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME
- Publication number 20250233003
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Sangyoung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE, ELECTROSTATIC CHUCK DEVICE, AND MANUFACTURING METHOD OF BASE
- Publication number 20250233010
- Publication date Jul 17, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Yuya Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20250233011
- Publication date Jul 17, 2025
- ZEUS CO., LTD.
- Woon KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND PROCESSING METHOD
- Publication number 20250232967
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDER DEVICE HAVING HEATING FUNCTION
- Publication number 20250232989
- Publication date Jul 17, 2025
- SKY TECH INC.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Edge seal for lower electrode assembly

Wafer taping apparatus and method

Method, apparatus, and system for dynamically controlling an electr...

Lamellar ceramic structure

Tape affixing apparatus

Loader device and substrate transport system

Method of manufacturing semiconductor device

Information processing apparatus for teaching transfer position of...

Methods of forming semiconductor packages

Method of selectively transferring semiconductor device

Substrate transfer device including housing provided with fan

Package structure and manufacturing method thereof

Substrate cleaning apparatus, substrate processing apparatus, subst...

System and method for correcting non-ideal wafer topography

Display apparatus and manufacturing method thereof

Supporting InFO packages to reduce warpage

Substrate processing method and substrate processing apparatus

Electrostatic chuck and semiconductor processing apparatus

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package having a semiconductor device bonded to a cir...

Ceramic sintered body comprising magnesium aluminate spinel

Method of manufacturing semiconductor device using stationary laser...

Pick and placement of semiconductor chips based on nozzleless self-...

OHT vehicle and method of controlling operation of same

Plasma processing apparatus and semiconductor fabrication method us...

Substrate holder and methods of use

Method for manufacturing display device, and transfer substrate for...

Plasma etching apparatus and method

Ion beam etching chamber with etching by-product redistributor

Monolithic chip stacking using a die with double-sided interconnect...

Patents Applicationslast 30 patents

ULTRA-THIN PACKAGED COMPONENT

LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...

LOAD LOCK DEVICE

CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...

MEMBER FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

METHOD OF FABRICATING MICRO DEVICE PANEL

ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS

METHODS OF OPERATING A SPATIAL DEPOSITION TOOL

ANTI-SLIP COMPOSITIONS AND COMPONENTS FOR SEMICONDUCTOR WAFER HANDL...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS

SEMICONDUCTOR PACKAGE

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD INCL...

PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF

CONVEYANCE APPARATUS, CONVEYANCE METHOD, AND SEMICONDUCTOR APPARATU...

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

MANAGING SEMICONDUCTOR WAFER AND DIE HANDLING

PLACEMENT MEMBER

DIE CLEANING SYSTEMS AND RELATED METHODS

WAFER POSITIONING AND CORRECTION METHOD, SYSTEM, AND DEVICE

ELECTROSTATIC CHUCK

APPARTUS FOR DETECTING POSITION OF WAFER AND OPERATING METHOD THEREOF

JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME

BASE, ELECTROSTATIC CHUCK DEVICE, AND MANUFACTURING METHOD OF BASE

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

PROCESSING SYSTEM AND PROCESSING METHOD

WAFER HOLDER DEVICE HAVING HEATING FUNCTION