for positioning, orientation or alignment

Industry

CPC
H01L21/68

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanding apparatus
- Patent number 12,255,087
- Issue date Mar 18, 2025
- Disco Corporation
- Tomohito Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Joined body, holding device, and electrostatic chuck
- Patent number 12,251,923
- Issue date Mar 18, 2025
- NITERRA CO., LTD.
- Osamu Yoshimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated cleaning process for substrate etching
- Patent number 12,255,055
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Yi Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Robot apparatus, systems, and methods for transporting substrates i...
- Patent number 12,255,089
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Jeffrey C. Hudgens
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,255,092
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,255,063
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holder and operating method of the same
- Patent number 12,255,085
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Xudong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring substrate in vacuum chamber
- Patent number 12,255,090
- Issue date Mar 18, 2025
- T-Robotics Co., Ltd.
- Soo Jong Lee
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Printing system assemblies and methods
- Patent number 12,251,946
- Issue date Mar 18, 2025
- Kateeva, Inc.
- Robert B. Lowrance
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna member and apparatus for treating substrate
- Patent number 12,255,050
- Issue date Mar 18, 2025
- Semes Co., Ltd.
- Yoon Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support device for supporting a substrate, method of processing a s...
- Patent number 12,255,088
- Issue date Mar 18, 2025
- Applied Materials Italia S.R.L.
- Daniele Andreola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor processing apparatus and method utilizing electrostat...
- Patent number 12,255,091
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck device
- Patent number 12,249,492
- Issue date Mar 11, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Masaki Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor wafer with wafer chuck havin...
- Patent number 12,249,493
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level micro-device tethers
- Patent number 12,249,532
- Issue date Mar 11, 2025
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,249,533
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Yoshinori Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for performing film forming process on substrate and meth...
- Patent number 12,247,287
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Manabu Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate transport apparatus and substrate transport method
- Patent number 12,249,527
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Isamu Taoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection method for seized traveling lift pins in wafer processing...
- Patent number 12,249,534
- Issue date Mar 11, 2025
- ASM IP Holding B.V.
- Eric Shero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder for use in a lithographic apparatus
- Patent number 12,249,535
- Issue date Mar 11, 2025
- ASML Netherlands B.V.
- Niek Jacobus Johannes Roset
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etch apparatus
- Patent number 12,249,520
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting assembly and substrate processing apparatus
- Patent number 12,249,536
- Issue date Mar 11, 2025
- Wonik IPS Co., Ltd.
- Hyun Jong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate flipping in vacuum for dual sided PVD sputtering
- Patent number 12,249,537
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Harish V Penmethsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,249,531
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250095999
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250096018
- Publication date Mar 20, 2025
- SEMES CO., LTD.
- Changhwa JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEMS AND METHODS USING VIRTUAL MACHINE ARCH...
- Publication number 20250096019
- Publication date Mar 20, 2025
- ASM IP HOLDING B.V.
- Eric Steinseifer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT APPARATUS HAVING HEATING PART
- Publication number 20250096031
- Publication date Mar 20, 2025
- DEVICEENG CO., LTD.
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096158
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY COMPOSITION FOR CORROSION RESISTANCE
- Publication number 20250092491
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Chien-Min Liao
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RETICLE CARRIER AND ASSOCIATED METHODS
- Publication number 20250093789
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TERMINAL CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATIN...
- Publication number 20250096496
- Publication date Mar 20, 2025
- Jae Oh BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK
- Publication number 20250098036
- Publication date Mar 20, 2025
- BOBOO HI-TECH CO., LTD.
- Yun Hwi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS TESTER
- Publication number 20250093398
- Publication date Mar 20, 2025
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS TESTER
- Publication number 20250093399
- Publication date Mar 20, 2025
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS TESTER
- Publication number 20250093400
- Publication date Mar 20, 2025
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20250096001
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junsang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Tool Alignment Device And Method
- Publication number 20250096025
- Publication date Mar 20, 2025
- DIODES INCORPORATED
- Bartosz Kielban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPORT APPARATUS AND ADAPTER PENDANT
- Publication number 20250096029
- Publication date Mar 20, 2025
- BROOKS AUTOMATION US, LLC
- Dana L. ATWOOD
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS AND METHODS FOR HANDLING SEMICONDUCTOR PART CARRIERS
- Publication number 20250096030
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Ren-Hau WU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
POSITIONING DEVICE AND MOUNTING DEVICE USING SAME
- Publication number 20250096016
- Publication date Mar 20, 2025
- TORAY ENGINEERING CO., LTD.
- Kenji HAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250096023
- Publication date Mar 20, 2025
- SCREEN Holdings Co., Ltd.
- Joji KUWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Structure for Thermal Processing Systems
- Publication number 20250096032
- Publication date Mar 20, 2025
- Mattson Technology, Inc.
- Manuel Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250096097
- Publication date Mar 20, 2025
- Hana Micron Inc.
- Jae-Sung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...
- Publication number 20250096171
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096181
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Changbo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVEL SEALING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20250096014
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Meng Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK FOR ACQUIRING A WARPED WORKPIECE
- Publication number 20250096021
- Publication date Mar 20, 2025
- Core Flow Ltd.
- Boaz NISHRI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20250096026
- Publication date Mar 20, 2025
- Shinko Electric Industries Co., Ltd.
- Keita Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PEELING DEVICE, SUBSTRATE PEELING METHOD, AND METHOD OF M...
- Publication number 20250096027
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND HEATING UNIT
- Publication number 20250096028
- Publication date Mar 20, 2025
- SEMES CO., LTD.
- Ju Mi LEE
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Expanding apparatus

Processing method of wafer

Joined body, holding device, and electrostatic chuck

Integrated cleaning process for substrate etching

Robot apparatus, systems, and methods for transporting substrates i...

Substrate processing apparatus

Semiconductor packages and methods of forming the same

Substrate processing system and substrate processing method

Wafer holder and operating method of the same

Apparatus for transferring substrate in vacuum chamber

Printing system assemblies and methods

Wafer bonding system and method of using the same

Antenna member and apparatus for treating substrate

Support device for supporting a substrate, method of processing a s...

Semiconductor processing apparatus and method utilizing electrostat...

Electrostatic chuck device

Method for manufacturing semiconductor wafer with wafer chuck havin...

Multi-level micro-device tethers

Substrate processing apparatus

Apparatus for performing film forming process on substrate and meth...

Substrate transport apparatus and substrate transport method

Detection method for seized traveling lift pins in wafer processing...

Substrate holder for use in a lithographic apparatus

Semiconductor package and method manufacturing the same

Wet etch apparatus

Substrate supporting assembly and substrate processing apparatus

Substrate flipping in vacuum for dual sided PVD sputtering

Method for forming semiconductor structure

Package structure, RDL structure comprising redistribution layer ha...

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEMS AND METHODS USING VIRTUAL MACHINE ARCH...

SUBSTRATE TREATMENT APPARATUS HAVING HEATING PART

SEMICONDUCTOR PACKAGE

ALLOY COMPOSITION FOR CORROSION RESISTANCE

RETICLE CARRIER AND ASSOCIATED METHODS

ELECTRICAL TERMINAL CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATIN...

METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK

ELECTRONICS TESTER

ELECTRONICS TESTER

ELECTRONICS TESTER

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

METHOD OF PROCESSING A SUBSTRATE

Semiconductor Manufacturing Tool Alignment Device And Method

TRANSPORT APPARATUS AND ADAPTER PENDANT

APPARATUS AND METHODS FOR HANDLING SEMICONDUCTOR PART CARRIERS

POSITIONING DEVICE AND MOUNTING DEVICE USING SAME

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

Support Structure for Thermal Processing Systems

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

INTEGRATED CIRCUIT STRUCTURE AND METHOD

METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

BEVEL SEALING SYSTEM AND METHOD OF USING THE SAME

CHUCK FOR ACQUIRING A WARPED WORKPIECE

SUBSTRATE FIXING DEVICE

SUBSTRATE PEELING DEVICE, SUBSTRATE PEELING METHOD, AND METHOD OF M...

SUBSTRATE TREATING APPARATUS AND HEATING UNIT