| Brochure (in German) "Die LIGA Technik", by MicroParts, Gesellschaft, 1990. |
| E. W. Becker, et al., "Fabrication on Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography Galvano-forming, and Plastic Molding (LIGA process)", Microelectronic Engineering, vol. 4, No. 1, May 1986, pp. 35-36. |
| W. Ehrfeld, et al., "Fabrication of Microstructures Using the LIGA Process", Proc. IEEE Micro Robots and Teleoperators Workshop, Nov. 9-11, 1987, pp. 1-11. |
| P. Hagmann, et al., "Fabrication of Microstructures of Extreme Structural Heights by Reaction Injection Moulding", International Polymer Processing IV, 1989, pp. 188-195. |
| W. Ehrfeld, et al., "Microfabrication of Sensors and Actuators for Microrobots", Proc. IEEE International Workshop on Intelligent Robots and Systems, Tokyo, Japan, Oct. 31-Nov. 2, 1988, pp. 3-7. |
| W. Ehrfeld, "Three Dimensional Microfabrication Using Synchrotron Radiation," International Symposium on X-Ray Synchrotron Radiation and Advances Science and Technology, Feb. 15-16, 1990, pp. 121-141. |
| W. Ehrfeld, et al., "LIGA Process: Sensor Construction Techniques Via X-Ray Lithography," Technical Digest, IEEE Solid State Sensor and Actuator Workshop, 1988, pp. 1-4. |
| H. Guckel, et al., "Deep X-Ray and UV Lithographies for Micromechanics", Technical Digest, IEEE Solid State Sensor and Actuator Workshop, Hilton Head, S.C., Jun. 4-7, 1990, pp. 118-122. |
| H. Guckel, et al., "Microstructure Sensors," International Electron Devices Meeting (IEDM), San Francisco, Calif. Dec. 1990. |
| H. Guckel, et al., "Fabrication of Assembled Micromechanical Components via Deep X-Ray Lithography", Proceedings of IEEE Micro Electro Mechanical Systems (MEMS) 1991, Nara, Japan, Jan. 30-Feb. 2 1991. |
| W. Meny, et al., "The LIGA Technique--a Novel Concept for Microstructures and the Combination with Si-Technologies by Injection Molding", Proceedings of IEEE Micro Electro Mechanical Systems (MEMS) 1991, Nara, Japan, Jan. 30-Feb. 2, 1991, pp. 69-73. |
| PiRL: Polyimide Release Layer, brochure from Brewer Science, Inc. |
| Roger T. Howe, et al., "Silicon Micromechanics: Sensors and Actuators on a Chip", IEEE Spectrum, Jul. 1990, pp. 29-35. |