Industry
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CPC
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G03F7/00
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Sub Industries
G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation
G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
G03F7/0007Filters
G03F7/001Phase modulating patterns
G03F7/0012Processes making use of the tackiness of the photolithographic materials
G03F7/0015Production of aperture devices, microporous systems or stamps
G03F7/0017for the production of embossing, cutting or similar devices; for the production of casting means
G03F7/002using materials containing microcapsules; Preparing or processing such materials
G03F7/0022Devices or apparatus
G03F7/0025characterised by means for coating the developer
G03F7/0027characterised by pressure means
G03F7/003characterised by storage means for the light sensitive material
G03F7/0032characterised by heat providing or glossing means
G03F7/0035Multiple processes
G03F7/0037Production of three-dimensional images
G03F7/004Photosensitive materials
G03F7/0041providing an etching agent upon exposure
G03F7/0042with inorganic or organometallic light-sensitive compounds not otherwise provided for
G03F7/0043Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
G03F7/0044involving an interaction between the metallic and non-metallic component
G03F7/0045with organic non-macromolecular light-sensitive compounds not otherwise provided for
G03F7/0046with perfluoro compounds
G03F7/0047characterised by additives for obtaining a metallic or ceramic pattern
G03F7/0048characterised by the solvents or agents facilitating spreading
G03F7/008Azides
G03F7/0085characterised by the non-macromolecular additives
G03F7/012Macromolecular azides Macromolecular additives
G03F7/0125characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
G03F7/016Diazonium salts or compounds
G03F7/0163Non ionic diazonium compounds
G03F7/0166characterised by the non-macromolecular additives
G03F7/021Macromolecular diazonium compounds Macromolecular additives
G03F7/0212characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
G03F7/0215Natural gums; Proteins
G03F7/0217Polyurethanes; Epoxy resins
G03F7/022Quinonediazides
G03F7/0223Iminoquinonediazides; Para-quinonediazides
G03F7/0226characterised by the non-macromolecular additives
G03F7/023Macromolecular quinonediazides Macromolecular additives
G03F7/0233characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
G03F7/0236Condensation products of carbonyl compounds and phenolic compounds
G03F7/025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds
G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds
G03F7/0275with dithiol or polysulfide compounds
G03F7/028with photosensitivity-increasing substances
G03F7/0285Silver salts
G03F7/029Inorganic compounds Onium compounds Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
G03F7/0295Photolytic halogen compounds
G03F7/031Organic compounds not covered by group G03F7/029
G03F7/032with binders
G03F7/0325the binders being polysaccharides
G03F7/033the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
G03F7/035the binders being polyurethanes
G03F7/037the binders being polyamides or polyimides
G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
G03F7/0381using a combination of a phenolic resin and a polyoxyethylene resin
G03F7/0382the macromolecular compound being present in a chemically amplified negative photoresist composition
G03F7/0384with ethylenic or acetylenic bands in the main chain of the photopolymer
G03F7/0385using epoxydisednovolak resin
G03F7/0387Polyamides or polyimides
G03F7/0388with ethylenic or acetylenic bands in the side chains of the photopolymer
G03F7/039Macromolecular compounds which are photodegradable
G03F7/0392the macromolecular compound being present in a chemically amplified positive photoresist composition
G03F7/0395the macromolecular compound having a backbone with alicyclic moieties
G03F7/0397the alicyclic moiety being in a side chain
G03F7/04Chromates
G03F7/06Silver salts
G03F7/063Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer
G03F7/066Organic derivatives of bivalent sulfur
G03F7/07used for diffusion transfer
G03F7/075Silicon-containing compounds
G03F7/0751used as adhesion-promoting additives or as means to improve adhesion
G03F7/0752in non photosensitive layers or as additives
G03F7/0754Non-macromolecular compounds containing silicon-to-silicon bonds
G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
G03F7/0758with silicon- containing groups in the side chains
G03F7/085Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
G03F7/09characterised by structural details
G03F7/091characterised by antireflection means or light filtering or absorbing means
G03F7/092characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
G03F7/093characterised by antistatic means
G03F7/094Multilayer resist systems
G03F7/095having more than one photosensitive layer
G03F7/0952comprising silver halide or silver salt based image forming systems
G03F7/0955one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds
G03F7/0957with sensitive layers on both sides of the substrate
G03F7/105having substances
G03F7/11having cover layers or intermediate layers
G03F7/115having supports or layers with means for obtaining a screen effect or for obtaining better contact in vacuum printing
G03F7/12Production of screen printing forms or similar printing forms
G03F7/14Production of collotype printing forms
G03F7/16Coating processes Apparatus therefor
G03F7/161using a previously coated surface
G03F7/162Coating on a rotating support
G03F7/164using electric, electrostatic or magnetic means; powder coating
G03F7/165Monolayers
G03F7/167from the gas phase, by plasma deposition
G03F7/168Finishing the coated layer
G03F7/18Coating curved surfaces
G03F7/20Exposure Apparatus therefor
G03F7/2002with visible light or UV light, through an original having an opaque pattern on a transparent support
G03F7/2004characterised by the use of a particular light source
G03F7/2006using coherent light; using polarised light
G03F7/2008characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
G03F7/201characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
G03F7/2012using liquid photohardening compositions
G03F7/2014Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards
G03F7/2016Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
G03F7/2018Masking pattern obtained by selective application of an ink or a toner
G03F7/202Masking pattern being obtained by thermal means
G03F7/2022Multi-step exposure
G03F7/2024of the already developed image
G03F7/2026for the removal of unwanted material
G03F7/2028of an edge bead on wafers
G03F7/203comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
G03F7/2032Simultaneous exposure of the front side and the backside
G03F7/2035simultaneous coating and exposure; using a belt mask
G03F7/2037Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
G03F7/2039X-ray radiation
G03F7/2041in the presence of a fluid
G03F7/2043with the production of a chemical active agent from a fluid
G03F7/2045using originals with apertures
G03F7/2047Exposure with radiation other than visible light or UV light
G03F7/2049using a cantilever
G03F7/2051Exposure without an original mask
G03F7/2053using a laser
G03F7/2055for the production of printing plates; Exposure of liquid photohardening compositions
G03F7/2057using an addressed light valve
G03F7/2059using a scanning corpuscular radiation beam
G03F7/2061Electron scattering (proximity) correction or prevention methods
G03F7/2063for the production of exposure masks or reticles
G03F7/2065using corpuscular radiation other than electron beams
G03F7/213Exposing with the same light pattern different positions of the same surface at the same time
G03F7/22Exposing sequentially with the same light pattern different positions of the same surface
G03F7/24Curved surfaces
G03F7/26Processing photosensitive materials Apparatus therefor
G03F7/265Selective reaction with inorganic or organometallic reagents after image-wise exposure
G03F7/28for obtaining powder images
G03F7/30Imagewise removal using liquid means
G03F7/3007combined with electrical means
G03F7/3014combined with ultrasonic means
G03F7/3021from a wafer supported on a rotating chuck
G03F7/3028characterised by means for on-wafer monitoring of the processing
G03F7/3035from printing plates fixed on a cylinder or on a curved surface; from printing cylinders
G03F7/3042from printing plates transported horizontally through the processing stations
G03F7/305characterised by the brushing or rubbing means
G03F7/3057characterised by the processing units other than the developing unit
G03F7/3064characterised by the transport means or means for confining the different units
G03F7/3071Process control means
G03F7/3078Processing different kinds of plates
G03F7/3085from plates or webs transported vertically; from plates suspended or immersed vertically in the processing unit
G03F7/3092Recovery of material; Waste processing
G03F7/32Liquid compositions therefor
G03F7/322Aqueous alkaline compositions
G03F7/325Non-aqueous compositions
G03F7/327Non-aqueous alkaline compositions
G03F7/34Imagewise removal by selective transfer
G03F7/343Lamination or delamination methods or apparatus for photolitographic photosensitive material
G03F7/346using photosensitive materials other than non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds
G03F7/36Imagewise removal not covered by groups G03F7/30 - G03F7/34
G03F7/38Treatment before imagewise removal
G03F7/40Treatment after imagewise removal
G03F7/405Treatment with inorganic or organometallic reagents after imagewise removal
G03F7/42Stripping or agents therefor
G03F7/421using biological means only
G03F7/422using liquids only
G03F7/423containing mineral acids or salts thereof, containing mineral oxidizing substances
G03F7/425containing mineral alkaline compounds; containing organic basic compounds
G03F7/426containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
G03F7/427using plasma means only
G03F7/428using ultrasonic means only
G03F7/70Exposure apparatus for microlithography
G03F7/70008Production of exposure light
G03F7/70016by discharge lamps
G03F7/70025by lasers
G03F7/70033by plasma EUV sources
G03F7/70041by pulsed sources
G03F7/7005by multiple sources
G03F7/70058Mask illumination systems
G03F7/70066Size and form of the illuminated area in the mask plane
G03F7/70075Homogenization of illumination intensity in the mask plane, by using an integrator
G03F7/70083Non-homogeneous intensity distribution in the mask plane
G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane, angular distribution in the field plane; On-axis or off-axis settings
G03F7/701Off-axis setting using an aperture
G03F7/70108Off-axis setting using a light-guiding element
G03F7/70116Off-axis setting using a programmable means
G03F7/70125Use of illumination settings tailored to particular mask patterns
G03F7/70133Measurement of illumination distribution, in pupil plane or field plane
G03F7/70141Illumination system adjustment, alignment during assembly of illumination system
G03F7/7015Details of optical elements
G03F7/70158Diffractive optical elements
G03F7/70166Capillary or channel elements
G03F7/70175Lamphouse reflector arrangements
G03F7/70183Zoom systems
G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarization, phase or the like
G03F7/702Reflective illumination
G03F7/70208Multiple illumination paths
G03F7/70216Systems for imaging mask onto workpiece
G03F7/70225Catadioptric systems
G03F7/70233Optical aspects of catoptric systems
G03F7/70241Optical aspects of refractive systems
G03F7/7025Size or form of projection system aperture
G03F7/70258Projection system adjustment, alignment during assembly of projection system
G03F7/70266Adaptive optics
G03F7/70275Multiple projection paths, array of projection systems, microlens projection systems, tandem projection systems
G03F7/70283Masks or their effects on the imaging process
G03F7/70291Addressable masks
G03F7/703Non-planar pattern area or non-planar masks
G03F7/70308Optical correction elements, filters and phase plates for manipulating
G03F7/70316Details of optical elements
G03F7/70325Resolution enhancement techniques not otherwise provided for
G03F7/70333Focus drilling
G03F7/70341Immersion
G03F7/7035Proximity or contact printer
G03F7/70358Scanning exposure
G03F7/70366Rotary scanning
G03F7/70375Imaging systems not otherwise provided for
G03F7/70383Direct write
G03F7/70391Addressable array sources specially adapted to produce patterns
G03F7/704Scanned exposure beam
G03F7/70408Interferometric lithography; Holographic lithography; Self-imaging lithography
G03F7/70416Stereolithography, 3D printing, rapid prototyping
G03F7/70425Imaging strategies
G03F7/70433Layout for increasing efficiency, for compensating imaging errors
G03F7/70441Optical proximity correction
G03F7/7045Hybrid exposure, i.e. combining different types of exposure
G03F7/70458Mix-and-match, i.e. multiple exposures of the same area using similar types of exposure
G03F7/70466Multiple exposures
G03F7/70475Stitching
G03F7/70483Information management, control, testing, and wafer monitoring
G03F7/70491Information management and control, including software
G03F7/705Modelling and simulation from physical phenomena up to complete wafer process or whole workflow in wafer fabrication
G03F7/70508Data handling, in all parts of the microlithographic apparatus
G03F7/70516Calibration of components of the microlithographic apparatus
G03F7/70525Controlling normal operating mode
G03F7/70533Controlling abnormal operating mode
G03F7/70541Tagging
G03F7/7055Exposure light control, in all parts of the microlithographic apparatus
G03F7/70558Dose control
G03F7/70566Polarisation control
G03F7/70575Wavelength control
G03F7/70583Speckle reduction
G03F7/70591Testing optical components
G03F7/706Aberration measurement
G03F7/70608Wafer resist monitoring
G03F7/70616Wafer pattern monitoring
G03F7/70625Pattern dimensions
G03F7/70633Overlay
G03F7/70641Focus
G03F7/7065Defect inspection
G03F7/70658Electrical
G03F7/70666using aerial image
G03F7/70675using latent image
G03F7/70683using process control mark
G03F7/70691Handling of masks or wafers
G03F7/707Chucks
G03F7/70708being electrostatic; Electrostatically deformable vacuum chucks
G03F7/70716Stages
G03F7/70725control
G03F7/70733Handling masks and workpieces
G03F7/70741Handling masks outside exposure position
G03F7/7075Handling workpieces outside exposure position
G03F7/70758Drive means
G03F7/70766Reaction force control means
G03F7/70775Position control
G03F7/70783Stress or warp of chucks, mask or workpiece
G03F7/70791Large workpieces
G03F7/708Construction of apparatus
G03F7/70808Construction details
G03F7/70816Bearings
G03F7/70825Mounting of individual elements
G03F7/70833Mounting of optical systems
G03F7/70841Constructional issues related to vacuum environment
G03F7/7085Detection arrangement
G03F7/70858Environment aspects
G03F7/70866of mask or workpiece
G03F7/70875Temperature
G03F7/70883of optical system
G03F7/70891Temperature
G03F7/709Vibration
G03F7/70908Hygiene
G03F7/70916Pollution mitigation, i.e. mitigating effect of contamination or debris
G03F7/70925Cleaning
G03F7/70933Purge
G03F7/70941Stray fields and charges
G03F7/7095Materials
G03F7/70958Optical materials and coatings
G03F7/70966Birefringence
G03F7/70975Assembly, maintenance, transport and storage of apparatus
G03F7/70983Optical system protection
G03F7/70991Connection with other apparatus