METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS THEREFORE

Abstract

A method for manufacturing a semiconductor device includes: forming a lower gate electrode over a substrate; forming a sacrifice film over the substrate such that the lower gate electrode is overlapped with the sacrifice film; forming a semiconductor film over the sacrifice film such that the semiconductor film crosses over the lower gate electrode; removing the sacrifice film; forming a lower gate insulating film in an empty space between the lower gate electrode and the semiconductor film, the empty space being obtained by removing the sacrifice film; forming an upper gate insulating film over the semiconductor film; and forming an upper gate electrode over the upper gate insulating film, the upper gate electrode being electrically connected to the lower gate electrode.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show process drawings illustrating a manufacturing method of a semiconductor device according to the invention.

FIGS. 2A and 2B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIGS. 3A and 3B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIGS. 4A and 4B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIGS. 5A and 5B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIGS. 6A and 6B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIGS. 7A and 7B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIGS. 8A and 8B show process drawings illustrating the manufacturing method of the semiconductor device according to the invention.

FIG. 9 is a cross sectional view illustrating a cross section taken in line B-B′ of FIG. 8B.

FIGS. 10A to 10C illustrate examples of electronic apparatus which uses the semiconductor device to which the invention is applied.

Claims

1. A method of manufacturing a semiconductor device comprising: forming a lower gate electrode over a substrate;forming a sacrifice film over the substrate such that the lower gate electrode is overlapped with the sacrifice film;forming a semiconductor film on the sacrifice film such that the semiconductor film crosses over the lower gate electrode;removing the sacrifice film;forming a lower gate insulating film in an empty space between the lower gate electrode and the semiconductor film, the empty space being obtained by removing the sacrifice film;forming an upper gate insulating film over the semiconductor film; andforming an upper gate electrode over the upper gate insulating film, the upper gate electrode being electrically connected to the lower gate electrode.

2. The method of manufacturing the semiconductor device according to claim 1, the lower gate insulating film being formed by applying a liquid material.

3. The method of manufacturing the semiconductor device according to claim 1, the upper gate insulating film being formed by applying a liquid material.

4. The method of manufacturing the semiconductor device according to claim 1, each of the gate insulating films including a thermally-oxidized film of the semiconductor film.

5. A method of manufacturing a semiconductor device comprising: forming a lower gate electrode over a substrate;forming a sacrifice film over the substrate such that the sacrifice film overlaps with the lower gate electrode;forming a semiconductor film over the sacrifice film such that the semiconductor film crosses over the lower gate electrode;forming an empty space between the lower gate electrode and the semiconductor film by removing the sacrifice film;forming a gate insulating film in the empty space and over the semiconductor film at a same process; andforming an upper gate electrode over a portion of the gate insulating film that is formed over the semiconductor film, the upper gate electrode being electrically connected to the lower gate electrode.

6. The method of manufacturing the semiconductor device according to claim 1, the lower gate electrode being formed by a liquid ejection method.

7. The method of manufacturing the semiconductor device according to claim 1, the sacrifice film being formed of an organic film.

8. The method of manufacturing the semiconductor device according to claim 1, wherein the sacrifice film is made of a material which can obtain a desired selected ratio with regard to the substrate or a primary insulating film formed on the substrate, the lower gate electrode film and the semiconductor film when the sacrifice film is removed.

9. The method of manufacturing the semiconductor device according to claim 1, the sacrifice film being formed by a liquid ejection method.

10. The method of manufacturing the semiconductor device according to claim 1, the semiconductor film being formed by a liquid ejection method.

11. The method of manufacturing the semiconductor device according to claim 1, a source area and a drain area being formed in the semiconductor film by an ion implantation using the upper gate electrode as a mask.