Number | Date | Country | Kind |
---|---|---|---|
63-292329 | Nov 1988 | JPX | |
1-5421 | Jan 1989 | JPX | |
1-139720 | Jun 1989 | JPX |
This application is a continuation of U.S. patent application Ser. No. 08/057,415, filed on May 6, 1993, now abandoned, a continuation of U.S. patent application Ser. No. 07/819,674, filed on Jan. 13, 1992, now abandoned, a continuation of U.S. patent application Ser. No. 07/439,608, filed on Nov. 21, 1989, now abandoned.
Number | Name | Date | Kind |
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4532702 | Gigante et al. | Aug 1985 | |
4595601 | Horioka et al. | Jun 1986 | |
4595608 | King et al. | Jun 1986 | |
4617087 | Iyer et al. | Oct 1986 | |
4670967 | Hazuki | Jun 1987 | |
4777061 | Wu et al. | Oct 1988 | |
4902645 | Ohba | Feb 1990 | |
4904621 | Loewenstein et al. | Feb 1990 | |
5043299 | Chang et al. | Aug 1991 |
Number | Date | Country |
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0157052 | Oct 1985 | EPX |
61-248525 | Nov 1986 | JPX |
Entry |
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J. Dieleman, F.H.M. Sanders, Solid State Technology, p. 191, Apr. 1984; "Plasma Effluent Etching: Selective and Non-Damaging". |
Wolf, S., Silicon Processing for the VLSI Era, vol. 1, pp. 388-389, 392-394, Lattice Press, 1986. |
Moriya, T., A Planar Metallization Process--Its Appl. to Tri-Level Aluminum Interconnection, IEDM 83, pp. 550-553, 1983, IEEE. |
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Number | Date | Country | |
---|---|---|---|
Parent | 57415 | May 1993 | |
Parent | 819674 | Jan 1992 | |
Parent | 439608 | Nov 1989 |