Claims
- 1. A method for manufacturing a substrate for a superconducting microwave component, the substrate being composed of an underlying dielectric substrate and a pair of oxide superconductor thin films formed on a pair of opposite planar surfaces of said underlying dielectric substrate, respectively, the method including the steps of:
- forming a first Tl--Ba--Ca--Cu--O compound oxide thin film on a first planar surface of said underlying dielectric substrate,
- forming a second Tl--Ba--Ca--Cu--O compound oxide thin film on a second planar surface of said underlying dielectric substrate, and
- annealing said underlying dielectric substrate coated with said first and second Tl--Ba--Ca--Cu--O compound oxide thin films in an oxygen atmosphere that contains not less than 5 mol % of thallium at a temperature in the range of 850.degree. C. to 900.degree. C. inclusive for a time in the range of one to three hours inclusive, to produce substantially uniform superconductive characteristics in said first and second Tl--Ba--Ca--Cu--O compound oxide thin films.
- 2. A method claimed in claim 1 wherein said underlying substrate is formed of a material selected from the group consisting of LaAlO.sub.3, NdGaO.sub.3 and MgO.
- 3. A method claimed in claim 1 wherein said underlying substrate is formed of a material selected from the group consisting of a sapphire and SiO.sub.2, said underlying substrate having on opposite surfaces thereof a buffer layer which makes it possible to deposit the oxide superconductor material in a good condition.
- 4. A method claimed in claim 1, additionally comprising a step of patterning one of said compound oxide superconductor films to produce a microwave component.
- 5. A method for manufacturing a substrate for a superconducting microwave component, the substrate being composed of an underlying dielectric substrate and a pair of oxide superconductor thin films formed on a pair of opposite planar surfaces of said underlying dielectric substrate, respectively, the method including the steps of:
- forming a first Tl--Ba--Ca--Cu--O compound oxide thin film on a first planar surface of a underlying dielectric substrate of LaAlO.sub.3,
- forming a second Tl--Ba--Ca--Cu--O compound oxide thin film on a second planar surface of said underlying dielectric substrate opposite to said first planar surface, and
- annealing said underlying dielectric substrate coated with said first and second Tl--Ba--Ca--Cu--O compound oxide thin films in an oxygen atmosphere that contains not less than 5 mol % of thallium at a temperature in the range of 850.degree. C. to 900.degree. C. inclusive for a time in the range of one to three hours inclusive, to produce substantially the same critical temperature and substantially the same critical current density in said first and second Tl--Ba--Ca--Cu--O compound oxide thin films.
- 6. A method claimed in claim 5, additionally comprising a step of patterning one of said compound oxide superconductor films to produce a microwave component.
Parent Case Info
This application is a continuation of application Ser. No. 08/253,602, filed Jun. 3, 1994, abandoned, which is a continuation of Ser. No. 07/885,871, filed May 20,1992, abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0 435 765 |
Mar 1991 |
EPX |
Non-Patent Literature Citations (3)
Entry |
Hammond et al., "Epitaxial Tl.sub.2 CaBa.sub.2 Cu.sub.2 O.sub.8 Thin ilms with Low 9.6 GHz Surface Resistance at High Power and Above 77 K", Applied Physics Letters, Aug. 20, 1990, vol. 57 No. 8, pp. 825-827 |
Tanaka, "High-Frequency Transmission through Bi-Sr-Ca-Cu-O Double-Sided Microstripline on a MgO Substrate", Japanese Journal of Applied Physics, Apr. 15, 1991 vol. 30, No. 4B, pp. L700-L702. |
Withers, et al., -"High-Thdcl Superconducting Thin Films for Microwave Application", Solid State Technology, Aug. 1990, vol. 33 No. 8, pp. 83-87. |
Continuations (2)
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Number |
Date |
Country |
Parent |
253602 |
Jun 1994 |
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Parent |
885871 |
May 1992 |
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