Claims
- 1. A method of mounting a semiconductor laser device to a heatsink comprises;
- (a) providing a reference mark on the heatsink corresponding to the desired location of a lasing spot;
- (b) placing the marked heatsink on a heating stage;
- (c) applying solder to the heatsink and wetting the solder to the heatsink by activating the heating stage to an appropriate temperature;
- (d) allowing the solder to solidify;
- (e) placing the laser device on the solidified solder;
- (f) applying current to the device sufficient to cause lasing;
- (g) aligning the lasing spot of the laser device with the reference mark on the heatsink; and,
- (h) bonding the laser device to the heatsink while maintaining the alignment.
- 2. The method of claim 1 wherein after the bonding of step (h), the alignment is rechecked and if misalignment is found, the solder is reliquified and steps (f), (g), and (h) are repeated.
- 3. The method of claim 1 wherein step (g) is accomplished through the use of magnification into a television camera and monitor, which camera is sensitive to the wavelength of light emitted by the laser device.
Government Interests
The Government has rights in this invention pursuant to a Government Contract.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2052140 |
Jan 1981 |
GBX |