Soldering

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G02B6/4238

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4238Soldering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Self-aligned structure and method on interposer-based PIC
- Patent number 12,222,566
- Issue date Feb 11, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Optical coupling
- Patent number 12,189,195
- Issue date Jan 7, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Fiber optic connector
- Patent number 12,117,660
- Issue date Oct 15, 2024
- Knowledge Development for POF, S.L.
- David Ortiz Rojo
- G02 - OPTICS
Information Patent Grant
Semiconductor devices with vertically stacked and laterally offset...
- Patent number 12,066,671
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Grant
Photonic chip coupler connector module
- Patent number 12,068,791
- Issue date Aug 20, 2024
- Molex, LLC
- Thomas R. Marrapode
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for mounting optical components
- Patent number 11,934,026
- Issue date Mar 19, 2024
- M SQUARED LASERS LIMITED
- Gareth Thomas Maker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical coupling
- Patent number 11,852,876
- Issue date Dec 26, 2023
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Photonic die alignment
- Patent number 11,693,196
- Issue date Jul 4, 2023
- Analog Photonics LLC
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Grant
Self-aligned structure and method on interposer-based PIC
- Patent number 11,686,906
- Issue date Jun 27, 2023
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Method and apparatus for mounting optical components
- Patent number 11,675,152
- Issue date Jun 13, 2023
- M SQUARED LASERS LIMITED
- Gareth Thomas Maker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for laser alignment in photonic integrated circuits
- Patent number 11,658,459
- Issue date May 23, 2023
- MACOM Technology Solutions Holdings, Inc.
- Roe Hemenway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral mounting of optoelectronic chips on organic substrate
- Patent number 11,460,647
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Jean Benoit Héroux
- G02 - OPTICS
Information Patent Grant
Optical fiber connection component and optical device manufacturing...
- Patent number 11,422,321
- Issue date Aug 23, 2022
- Nippon Telegraph and Telephone Corporation
- Ai Yanagihara
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,372,175
- Issue date Jun 28, 2022
- Shinko Electric Industries Co., Ltd.
- Kenji Yanagisawa
- G02 - OPTICS
Information Patent Grant
Optical-to-electric-to-optical routing engine
- Patent number 11,256,049
- Issue date Feb 22, 2022
- Nokia Solutions and Networks Oy
- William dos Santos Fegadolli
- G02 - OPTICS
Information Patent Grant
Photonic die alignment
- Patent number 11,237,344
- Issue date Feb 1, 2022
- Analog Photonics LLC
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Grant
Electro-optical circuit comprising an optical transmission path, el...
- Patent number 11,169,336
- Issue date Nov 9, 2021
- Siemens Aktiengesellschaft
- Stefan Nerreter
- G02 - OPTICS
Information Patent Grant
Surface mount packaging for single mode electro-optical module
- Patent number 11,092,762
- Issue date Aug 17, 2021
- ElectroPhotonic-IC Inc.
- Gudmundur A. Hjartarson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lens-less laser micro-package assembly
- Patent number 11,086,088
- Issue date Aug 10, 2021
- II-VI DELAWARE, INC.
- Bernd Huebner
- G02 - OPTICS
Information Patent Grant
Optical device and manufacturing method of optical device
- Patent number 10,976,509
- Issue date Apr 13, 2021
- Fujitsu Optical Components Limited
- Kohei Shibata
- G02 - OPTICS
Information Patent Grant
Systems and methods for data communication
- Patent number 10,949,372
- Issue date Mar 16, 2021
- The Boeing Company
- Eric Y. Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical module structure and fabrication method for optical module...
- Patent number 10,921,534
- Issue date Feb 16, 2021
- Huawei Technologies Co., Ltd.
- Zhen Dong
- G02 - OPTICS
Information Patent Grant
Lateral mounting of optoelectronic chips on organic substrate
- Patent number 10,914,901
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Jean Benoit Héroux
- G02 - OPTICS
Information Patent Grant
Integrated heater structures in a photonic integrated circuit for s...
- Patent number 10,895,702
- Issue date Jan 19, 2021
- Google LLC
- Kevin Yasumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical-electrical interposers
- Patent number 10,859,776
- Issue date Dec 8, 2020
- The Regents of the University of California
- Sung-Joo Ben Yoo
- G02 - OPTICS
Information Patent Grant
Integrated circuit packages including an optical redistribution layer
- Patent number 10,816,742
- Issue date Oct 27, 2020
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Grant
Laser diode edge assembly structure for three-dimensional active al...
- Patent number 10,809,469
- Issue date Oct 20, 2020
- CLOUD LIGHT TECHNOLOGY LIMITED
- Vincent Wai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies, optical connectors and methods of bonding optical eleme...
- Patent number 10,746,937
- Issue date Aug 18, 2020
- Corning Incorporated
- Douglas Llewellyn Butler
- G02 - OPTICS
Information Patent Grant
Optically aligned hybrid semiconductor device and method
- Patent number 10,678,005
- Issue date Jun 9, 2020
- Elenion Technologies, LLC
- David Henry Kinghorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interfaces with solder that passively aligns optical socket
- Patent number 10,678,006
- Issue date Jun 9, 2020
- Hewlett Packard Enterprise Development LP
- Paul Kessler Rosenberg
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250102748
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- G02 - OPTICS
Information Patent Application
Optical Coupling
- Publication number 20250085492
- Publication date Mar 13, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
OPTICAL RECEIVING MODULE ASSEMBLY
- Publication number 20250076601
- Publication date Mar 6, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Won-Bae KWON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Self-Aligned Structure and Method on Interposer-based PIC
- Publication number 20250012983
- Publication date Jan 9, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...
- Publication number 20240393552
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20240369785
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
PHOTONIC CHIP COUPLER CONNECTOR MODULE
- Publication number 20240372631
- Publication date Nov 7, 2024
- Molex, LLC
- Thomas R. MARRAPODE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SELF-ALIGNED STRUCTURE AND METHOD ON INTERPOSER-BASED PIC
- Publication number 20240345340
- Publication date Oct 17, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...
- Publication number 20240319457
- Publication date Sep 26, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
THERMAL MANAGEMENT IN AN OPTICAL SUB-ASSEMBLY
- Publication number 20240288643
- Publication date Aug 29, 2024
- Lumentum Technology UK Limited
- Andrew STRANGE
- G02 - OPTICS
Information Patent Application
UNDERFILL DAM FOR PHOTONIC PACKAGING
- Publication number 20240272385
- Publication date Aug 15, 2024
- Cisco Technology, Inc.
- Li CHEN
- G02 - OPTICS
Information Patent Application
Optical Coupling Adapter for Fiber-To-Chip Integration
- Publication number 20240272389
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
OPTICAL WAFER-LEVEL PACKAGE
- Publication number 20240184066
- Publication date Jun 6, 2024
- Cisco Technology, Inc.
- Norbert SCHLEPPLE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...
- Publication number 20240168245
- Publication date May 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- G02 - OPTICS
Information Patent Application
Optical Coupling
- Publication number 20240118505
- Publication date Apr 11, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
OPTICAL CIRCUIT BOARD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE U...
- Publication number 20240094485
- Publication date Mar 21, 2024
- KYOCERA CORPORATION
- Akifumi SAGARA
- G02 - OPTICS
Information Patent Application
VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL) INTEGRATION ON A PHO...
- Publication number 20240019646
- Publication date Jan 18, 2024
- Meta Platforms Technologies, LLC
- Zhaoming ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE
- Publication number 20240004151
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Application
OPTICAL CIRCUIT BOARD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE U...
- Publication number 20230408777
- Publication date Dec 21, 2023
- KYOCERA CORPORATION
- Yoshinori NAKATOMI
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20230341641
- Publication date Oct 26, 2023
- FUJITSU OPTICAL COMPONENTS LIMITED
- Takeshi Matsumoto
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING OPTICAL COMPONENTS
- Publication number 20230341646
- Publication date Oct 26, 2023
- M Squared Lasers Limited
- Gareth Thomas MAKER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-Aligned Structure and Method on Interposer-based PIC
- Publication number 20230333333
- Publication date Oct 19, 2023
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
SELF-ALIGNED BURIED HETERO STRUCTURE LASER STRUCTURES AND INTERPOSER
- Publication number 20230258884
- Publication date Aug 17, 2023
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20230228957
- Publication date Jul 20, 2023
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Qian SHAO
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20230221511
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING OF LIGHT SOURCE AND PHOTONIC INTEGRATED CIRCUIT
- Publication number 20230106911
- Publication date Apr 6, 2023
- UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
- Peter O'Brien
- G02 - OPTICS
Information Patent Application
PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230077877
- Publication date Mar 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan KUNG
- G02 - OPTICS
Information Patent Application
FIBER OPTIC CONNECTOR
- Publication number 20230023827
- Publication date Jan 26, 2023
- KNOWLEDGE DEVELOPMENT FOR POF, S.L.
- David ORTIZ ROJO
- G02 - OPTICS
Information Patent Application
EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE
- Publication number 20220357538
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- G02 - OPTICS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned structure and method on interposer-based PIC

Optical coupling

Fiber optic connector

Semiconductor devices with vertically stacked and laterally offset...

Photonic chip coupler connector module

Method and apparatus for mounting optical components

Optical coupling

Photonic die alignment

Self-aligned structure and method on interposer-based PIC

Method and apparatus for mounting optical components

Techniques for laser alignment in photonic integrated circuits

Lateral mounting of optoelectronic chips on organic substrate

Optical fiber connection component and optical device manufacturing...

Optical module

Optical-to-electric-to-optical routing engine

Photonic die alignment

Electro-optical circuit comprising an optical transmission path, el...

Surface mount packaging for single mode electro-optical module

Lens-less laser micro-package assembly

Optical device and manufacturing method of optical device

Systems and methods for data communication

Optical module structure and fabrication method for optical module...

Lateral mounting of optoelectronic chips on organic substrate

Integrated heater structures in a photonic integrated circuit for s...

Optical-electrical interposers

Integrated circuit packages including an optical redistribution layer

Laser diode edge assembly structure for three-dimensional active al...

Assemblies, optical connectors and methods of bonding optical eleme...

Optically aligned hybrid semiconductor device and method

Optical interfaces with solder that passively aligns optical socket

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Optical Coupling

OPTICAL RECEIVING MODULE ASSEMBLY

Self-Aligned Structure and Method on Interposer-based PIC

METHOD FOR FABRICATING EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-D...

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

PHOTONIC CHIP COUPLER CONNECTOR MODULE

SELF-ALIGNED STRUCTURE AND METHOD ON INTERPOSER-BASED PIC

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...

THERMAL MANAGEMENT IN AN OPTICAL SUB-ASSEMBLY

UNDERFILL DAM FOR PHOTONIC PACKAGING

Optical Coupling Adapter for Fiber-To-Chip Integration

OPTICAL WAFER-LEVEL PACKAGE

INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...

Optical Coupling

OPTICAL CIRCUIT BOARD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE U...

VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL) INTEGRATION ON A PHO...

EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE

OPTICAL CIRCUIT BOARD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE U...

OPTICAL DEVICE AND BUMP ARRANGEMENT METHOD

METHOD AND APPARATUS FOR MOUNTING OPTICAL COMPONENTS

Self-Aligned Structure and Method on Interposer-based PIC

SELF-ALIGNED BURIED HETERO STRUCTURE LASER STRUCTURES AND INTERPOSER

OPTICAL MODULE

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

OPTICAL COUPLING OF LIGHT SOURCE AND PHOTONIC INTEGRATED CIRCUIT

PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

FIBER OPTIC CONNECTOR

EMBEDDED SILICON PHOTONICS CHIP IN A MULTI-DIE PACKAGE