Claims
- 1. A metbod of manufacturing an inkjet recording head, comprising:
- immersing a nozzle plate in an electrolyte to form an ink-repelant layer formed of an eutectoid plating layer on at least a surfice of said nozzle plate;
- then heating nozzle plate with ink-repellent layer to form an ink-repellant coating;
- applying pressure to said nozzle plate to prevent warping of said nozzle plate; and
- then fixing said nozzle plate to a substrate.
- 2. The method according to claim 1, wherein said heating step and said step of applying pressure are performed simultaneously.
- 3. The method according to claim 1, wherein said forming step comprises the step of forming a fluorine-containing high molecular coating.
- 4. The method according to claim 1, wherein said forming step comprises the step of forming a fluorine-containing high molecule eutectoid plating.
- 5. The method according to claim 1, wherein step of applying pressure comprises the step of applying a pressure of at least 100 gf/cm.sup.2.
- 6. The method according to claim 1, wherein said fixing step comprises the step of adhering said nozzle plate to said substrate.
- 7. A method as claimed in claim 1, wherein said electrolyte is obtained by diffusing grains of high-polymer resin and metal ions.
- 8. A method as claimed in claim 1, wherein said electrolyte is obtained by diffusing grains of high-polymer resin and nickel ions.
- 9. A method of manufacturing a nozzle plate for an ink jet recording head, comprising:
- forming an ink-repellant coating film on a front surface of said nozzle plate inner surfaces of nozzle holes formed in said nozzle plate, and on a portion of said nozzle holes which is contiguous with a rear surface of said nozzle plate;
- then heating said ink-repellant coating film formed on said nozzle plate;
- applying pressure to said nozzle plate to prevent warping of said nozzle plate; and
- then fixing said nozzle plate to a substrate;
- wherein said forming step comprises:
- applying resist tape onto predetermined areas of said rear surface of said nozzle plate so as to expose peripheral portions on said rear surface leading to said nozzle holes and inner surfaces of said nozzle holes; and
- dipping said nozzle plate into an electrolyte solution to produce an eutectoid plated surface on said front surface of said nozzle plate, said inner surface of said nozzle holes, and on said rear surface of said nozzle plate at areas other than said predetermined covered areas by said resist tape.
- 10. The method according to claim 9, wherein said step of applying pressure to said nozzle plate and said heating step are performed simultaneously.
- 11. The method according to claim 9, wherein said fixing step comprises the steps of:
- removing said resist tape; and
- adhering said nozzle plate onto said substrate.
- 12. The method according to claim 9, wherein said forming step comprises the step of forming said ink-repellent coating film comprising a fluorine-containing high molecular coating.
- 13. The method according to claim 9, wherein said forming step comprises the step of forming said ink-repellent coating film comprising a fluorine-containing high molecule eutectoid plating.
- 14. The method according to claim 9, wherein said step of applying pressure comprises the step of applying a pressure of at least 100 gf/cm.sup.2.
Priority Claims (2)
Number |
Date |
Country |
Kind |
3-89522 |
Mar 1991 |
JPX |
|
4-93720 |
Mar 1992 |
JPX |
|
Parent Case Info
This is a Continuation of application Ser. No. 08/127,480, filed Sep. 28, 1993, now pending.
US Referenced Citations (11)
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Continuations (1)
|
Number |
Date |
Country |
Parent |
127480 |
Sep 1993 |
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