METHOD OF PRODUCING A SLAB TYPE TWO-DIMENSIONAL PHOTONIC CRYSTAL STRUCTURE

Abstract

A first main face 1a of a substrate 1 of a dielectric single crystal is etched to form recesses 4 in the substrate 1. A second main face 1b of the substrate 1 is mechanically processed to form a slab 10, so that the recesses 4 pass through the substrate 1 to form through holes 11.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1( a), 1(b), 1(c), 1(d) and 1(e) are cross sectional views showing respective steps of forming recesses 4 in a substrate 1 of a dielectric single crystal.

FIG. 2( a), 2(b), 2(c) 2(d) and 2(e) are cross sectional views showing respective steps of forming a guard film 6A and a temporary supporting film 8 on a base substrate 5.

FIGS. 3 (a), (b), (c) and (d) are cross sectional views showing the respective steps of forming through holes 11 in the substrate of dielectric single crystal and of forming spaces 12 on the back side of the substrate 1.

FIG. 4( a), 4(b) and 4(c) are cross sectional views showing respective steps of forming an electrode 14A on the substrate of dielectric single crystal of FIG. 3 (d).

FIG. 5 is a cross sectional view showing a slab-type and two-dimensional photonic crystal structure 16A obtained according to the present invention.

FIG. 6 is a cross sectional view showing a slab-type and two-dimensional photonic crystal structure 16B obtained according to the present invention.

FIG. 7 is a cross sectional view showing a slab-type and two-dimensional photonic crystal structure 16C obtained according to the present invention.

BEST MODES FOR CARRYING OUT THE INVENTION

A photonic crystal is a multi-dimension and periodic structure having a periodicity comparable with a wavelength of light with a plurality of media having different refractive indices. The photonic crystal has a band structure of light similar to that of electron. Specific structure thus provides photonic band gap of light. The photonic crystal having the photonic band gap functions as an insulator of light.

Linear defects can be introduced into a photonic crystal having photonic band-gap for deteriorating its periodicity. It is thereby possible to form waveguide mode in a frequency region of the band-gap and to provide an optical waveguide confining light.

A slab-type two-dimensional photonic crystal 15 is defined as follows. That is, to a dielectric slab, low dielectric pillars are provided at an appropriate two-dimensional period. Each dielectric pillar has a refractive index lower than that of the dielectric slab and has a shape of a column or an equilateral polygon. The dielectric slab is provided between a upper clad and a lower clad to provide the photonic crystal. The upper and lower clads have a refractive index lower than that of the dielectric slab.

The method of forming an optical waveguide in the crystal is not particularly limited. For example, so-called oxide clad two-dimensional slab-type photonic crystal is preferable because it is possible to easily produce the crystal of a large area. The oxide clad two-dimensional type photonic crystal is produced as follows. A thin film of a semiconductor of a high refractive index (refractive index of about 3 to 3.5) is formed on a dielectric material (oxide or polymer) of a low refractive index, in which a two-dimensional photonic crystal structure is fabricated.

Further, so-called air-bridge type two-dimensional slab photonic crystal may be applied. According to this type, the upper and lower clads of the photonic crystal are composed of air layers.

The dielectric single crystal includes quartz, lithium niobate single crystal, lithium tantalate single crystal, single crystal of lithium niobate-lithium tantalate solid solution, lithium borate single crystal and langasite single crystal. The substrate of the dielectric single crystal may be either of a Z-plate, X-plate (Y-plate) or the off-set plate of Z-plate or X-plate (Y-plate).

Further, it is necessary that the through holes are arranged to form regular lattices. Although the shape of the lattice is not particularly limited, triangular lattice and regular quadratic lattice are listed. Further, air filled in the through holes is a kind of a dielectric material so that the through holes can function as the dielectric pillars. Further, solid or gaseous dielectric material other than air may be filled into the through holes to form the dielectric pillars each filled with the material.

The present invention will be described in detail, referring to the attached drawings.

First, as shown in FIG. 1(a), a substrate 1 (for example a wafer) of a dielectric single crystal is prepared. A metal film 2 is formed on the whole of a first main face 1a of the substrate 1. Although the kind of the metal film is not particularly limited as far as it has resistance against an etchant or a etching gas of the substrate, it may be listed multilayered films of underlying Cr layer and Au layer laminated thereon, multilayered films of underlying Ti layer and Au layer laminated thereon, tungsten film and molybdenum film. The method of film formation is not particularly limited, and sputtering and vapor deposition are listed.

The method of etching the metal film 2 and the substrate 1 of dielectric single crystal is not particularly limited, and includes dry etching and wet etching. Wet etching is preferred.

The method of etching the metal film itself is known. For example, aqueous solution of iodine and potassium iodide is preferred as an etchant for gold, and aqueous solution of ammonium cerium nitrate and perchloric acid is preferred as an etchant for chromium. Further, in the case that gold and chromium are etched at the same time, aqueous solution of ammonium cerium nitrate, perchloric acid and hydrochloric acid is preferred. In the case of dry etching, Cl₂ is preferred as an etchant for gold and mixture of CCl₄ and O₂ is preferred as an etchant for chromium.

The method itself of etching a dielectric single crystal is also known. For example, the etchant includes solution of hydrogen fluoride, solution of ammonium hydrogen fluoride, buffered fluoric acid solution (mixture of ammonium hydrogen fluoride and ammonium fluoride), solution of sodium hydroxide and the like. The etching gas includes CF₄, SF₆ and the like.

Preferably, a resist 3 is formed on the metal film 2 (FIG. 1 (b)). The method of forming the resist 3 is not limited, and includes photolithography using a stepper. The metal film 2 and dielectric single crystal 1 are then etched by dry etching or wet etching to form recesses 4 (FIG. 1 (c)). Unnecessary resist 3 is then removed with an organic solvent (FIG. 1 (d)). The metal film 2A is removed to obtain a substrate 1 of a dielectric single crystal 1 with the recesses 4 formed therein, as shown in FIG. 1 (e). For example, molybdenum film can be removed with mixed acid of nitric acid and phosphoric acid.

The patterning of the resist can be performed by conventional exposure process. A contact aligner may be used upon the exposure.

The material of the resist is needed to be resistive against the etchant for the metal film. Such material includes novolak resin type positive resist, main-chain scission (degradation) type positive resist, cyclized polyisoprene-azide compound series negative resist, phenol resin-azide compound series negative resist, dissolution-inhibition type electron rays positive resist and cross-linked type negative resist.

The method of processing the base body 5 will be described.

As shown in FIG. 2 (a), a metal film 6 is formed on a first main face 5a of the base body 5 for supporting the dielectric slab. The kind of the metal film on the base body is not particularly limited, and includes multilayered films of underlying Cr layer and Au layer laminated thereon, multilayered films of underlying Ti layer and Au layer laminated thereon, tungsten film and molybdenum film. The method of film formation is not particularly limited, and sputtering and vapor deposition are listed.

A resist 7 is then formed on the metal film 6 (FIG. 2 (b)). Photolithography and wet etching are applied to perform the patterning of the metal film to form a guard film 6A (FIG. 2 (c)). Unnecessary resist 7 is then removed with an organic solvent.

A temporary supporting film 8 is formed on the base body 5 and the guard film 6A. The supporting film 8 is to be removed at the subsequent step to make the thin film of the dielectric single crystal distant from the underlying base body. A second main face 5b of the base body is then fixed on a polishing jig for forming a face for adhesion with the substrate of the dielectric single crystal. The temporary supporting film is then ground until the supporting film on the guard film disappears (FIG. 5 (c)).

Although the material of the supporting film is not particularly limited, SiO₂, Ta₂O₅ and Ti are listed. Further, although the material of the guard film is not particularly limited as far as it has resistance against an etchant for the temporary supporting film, molybdenum and tungsten can be listed.

Further, the method of grinding the temporary supporting film and the guard film is not particularly limited, loose abrasive and polishing pad of unwoven cloth sheet may be listed.

The substrate 1 of dielectric single crystal is then ground at the main face 1b so that the recesses are opened to both of the main faces. That is, as shown in FIG. 3 (a), the guard film 6A and the supporting film 8 of the base body 5 are opposed to the main face 1a of the substrate 1. An adhesive is then interposed between them and cured to form an adhesive layer 9. The kind of the adhesive is not particularly limited, and includes a ultraviolet curable adhesive and a thermal curable adhesive.

After the base body 5 is adhered with and fixed onto the substrate 1 of dielectric single crystal, the second main face 5b of the base body 5 is adhered to and fixed on a polishing jig. The second main face 1b of the substrate 1 is then ground using a grinder and fixed abrasive to reduce the thickness of the substrate 1. The ground main face of the substrate 1 is subsequently polished so that the substrate 1 is further thinned. Finally, the substrate is finished using loose abrasive and polishing pad of unwoven cloth sheet to form a slab 10 of dielectric single crystal. Many through holes 11 are regularly formed in the slab 10 (FIG. 3 (b)).

The method of the mechanical processing may preferably be, but not limited to, the grinding and polishing described above. Further, the kind of the polishing process may preferably be, but not limited to, polishing using diamond abrasive. Further, the final thickness of the dielectric slab is not limited, and is decided depending on the specification of a target slab-type and two dimensional photonic crystal structure. However, as an example, the thickness of the dielectric slab may preferably be 0.1 to 1.0 μm.

From the state shown in FIG. 3 (b), the adhesive layer 9 and temporary supporting film 8 under the dielectric slab 10 was removed by etching. That is, an etchant is flown through the through holes 11 formed in the dielectric slab 10. Such etchant is not limited and includes hydrofluoric acid and ammonium hydrogen fluoride.

The adhesive layer 9A is removed as shown in FIG. 3 (c) and the supporting film 8 is removed by this etching process to form a space 12 (FIG. 3 (d)). As a result, spaces are provided over and under the dielectric slab 11 which functions as a device having the slab-type and two-dimensional photonic crystal structure.

After the polished face of the dielectric slab 10 is washed with an organic solvent, a metal film 14 is formed over the whole of the polished face, as shown in FIG. 4 (a). The metal film 14 is also formed direct under the through hole 11. The kind of the metal film 14 is not particularly limited, and includes multilayered films of underlying Cr layer and Au layer laminated thereon, multilayered films of underlying Ti layer and Au layer laminated thereon, aluminum film and tungsten film. The method of forming the metal film 14 is not particularly limited, and sputtering and vapor deposition are listed.

The metal film is then patterned by conventional photolithography and subjected to wet etching to from the target electrode pattern 14A and to remove the electrode 14 on the substrate 5 (FIG. 4 (c)). Unnecessary resist 15 is then removed with an organic solvent to obtain a slab-type and two-dimensional photonic crystal structure 16A, as shown in FIG. 5.

Further, in the device 16A shown in FIG. 5, a dielectric material is filled in the through holes 11 to provide dielectric pillars 18 shown in FIG. 6. Such dielectric material includes novolak resin and epoxy resin.

Further, as shown in a device 16C of FIG. 7, the number of the through holes 11 between the electrode 14A and optical waveguide region may be increased. This kind of design is not particularly limited and may be variously changed.

Although the shape of the dielectric slab is not limited as far as a target electromagnetic wave can propagate in slab mode, the thickness of the slab may preferably be 5 μm or smaller and more preferably be 3 μm or smaller.

The optical waveguide structure of the present invention may be applied to various kinds of functional devices.

That is, in addition to conventional optical waveguide, the optical waveguide structure may be applied to a device utilizing Pockels effect, a device utilizing plasma effect caused by injection of current, a device utilizing EO effects due to quantum well structure, a device utilizing TO effects due to change of heater temperature, a directional coupler, Mach-Zehnder optical waveguide and an optical modulator.

The structure of the present invention is effective for electromagnetic waves. It is thus possible to obtain similar results as those of light wave in other electromagnetic waves by adjusting the material of the substrate and the period length “d”. Such electromagnetic waves include microwave and terahertz wave.

EXAMPLES

The slab-type and two-dimensional photonic crystal structure 16A was produced according to the procedure described above referring FIGS. 1 to 5.

(Formation of Recesses in the Substrate 1)

The recesses 4 were formed in the dielectric substrate 1, according to the procedure described above referring to FIG. 1.

Specifically, it was prepared a circular wafer 1 made of lithium niobate single crystal having a thickness of 0.5 mm and a diameter of 3 inches. A molybdenum film 2 of a thickness of 0.1 μm was formed by sputtering as a mask over the whole of the first main face 1a of the dielectric substrate 1. The molybdenum film 2 was subjected to patterning by photolithography using a stepper and dry etching to produce a mask 2A.

The dielectric substrate 1 was then etched by wet etching using buffered fluoric acid heated at 65° C. to a thickness of 1 μm. Unnecessary resist 3 was removed with an organic solvent, and the mask 2A of molybdenum was removed with mixture of nitric acid and phosphoric acid, as shown in FIG. 1 (e)).

(Processing of Base Body)

A molybdenum film 6 was formed by sputtering to a thickness of 2 μm over the whole of the first main face 5a of the base body 5, for supporting the dielectric slab. The molybdenum film was then patterned by conventional photolithography and wet etching to form a guard film 6A. Mixture of nitric acid and phosphoric acid heated at 40° C. was used for the wet etching. Unnecessary resist 7 was then removed with an organic solvent and SiO₂ film was formed by sputtering at a thickness of 2.5 μm. The SiO₂ film was removed with buffered phosphoric acid in the subsequent step so that a space is formed between the dielectric slab and the base body. Further, The second face 5b of the base body 5 was then fixed on a polishing jig for forming a face for adhesion with the dielectric substrate. The laminated films of SiO₂ and molybdenum were then ground to a thickness of 1.5 μm using loose abrasive and polishing pad of unwoven cloth sheet (FIG. 2 (e)).

(Adhesion and Mechanical Processing of Substrate 1 and Base Body 5)

An organic adhesive forming an adhesive layer was applied on the main face 5a of the base body 5, and the main face 5a was adhered to the main face 1a of the substrate 1 with the recesses formed thereon. A pressure was applied onto the base body 5 and the dielectric substrate 1 with a pressing machine so that the thickness of the adhesive layer was reduced to 0.4 μm. The body 5 and substrate 1 were held in atmosphere at 200° C. for 1 hour to solidify the adhesive so that the base body and the dielectric substrate were adhered with each other.

After the base body 5 was adhered to and fixed on the dielectric substrate 1, the second main face 5b of the base body was adhered to and fixed on a polishing jig. The second main face 1b of the dielectric substrate 1 was ground with a grinder having fixed abrasive so that the thickness of the dielectric substrate 1 was reduced to 50 μm. Further, the thus ground main face 1b of the dielectric substrate 1 was then polished with diamond abrasive to further reduce the thickness of the dielectric substrate 1 to 2 μm. Finally, the dielectric substrate 1 was finished with loose abrasive and polishing pad of unwoven cloth sheet to reduce the thickness to 0.5 μm so that the recesses were opened to both main faces to form the through holes 11 (FIG. 3 (b)).

The thus integrated assembly was then immersed in buffered fluoric acid heated at 40° C. to supply buffered fluoric acid through the through holes 11 formed by the grinding. The SiO₂ layer 8 on the base body 5 was thus removed (FIG. 3 (d)).

After the thus polished face of the dielectric slab was washed with an organic solvent, aluminum film having a thickness of 0.02 μm was formed over the whole of the polished face by sputtering (FIG. 4 (a)). The aluminum film was patterned by conventional photolithography and then subjected to wet etching using phosphoric acid etchant heated at 40° C. to obtain target electrode pattern (FIG. 4 (b)). Unnecessary resist 15 was then removed with an organic solvent and the thus obtained assembly was cut into respective chips with a dicing saw. The photonic crystal device was thus obtained (FIG. 5).

The thus obtained slab-type and two-dimensional photonic crystal structure was proved to be available as a slab-type and two-dimensional photonic crystal device.

Claims

1. A method of producing a slab type two-dimensional photonic crystal structure comprising a slab of a dielectric single crystal and a lattice column comprising through holes; said method comprising the steps of: forming recesses in a substrate of a dielectric single crystal by etching a first main face of said substrate of said dielectric single crystal; andforming a slab by mechanically processing a second main face of said substrate so that said recesses pass through said slab to form said through holes.

2. The method of claim 1, further comprising the step of fixing said substrate on a base body at said first main face after said recesses are formed on said first main face of said substrate, wherein said mechanical processing is performed after said substrate is fixed onto said base body.

3. The method of claim 1, further comprising the step of filling a dielectric material into said through holes to form dielectric pillars.