Claims
- 1. A method of manufacturing an electrical connector for use in a downhole tool, the method comprising placing a dielectric body around a conductor, thereby forming an electrical connector, wherein the dielectric body comprises a composition, and the composition comprises a polyetherketoneketone or a derivative of a polyetherketoneketone.
- 2. The method of claim 1, wherein the composition comprises a polyetherketoneketone or a derivative of a polyetherketoneketone having a structure represented by a formula (I):
- 3. The method of claim 1, wherein the composition comprises a polyetherketoneketone or a derivative of a polyetherketoneketone having a structure represented by a formula (II):
- 4. The method of claim 1, comprising placing the dielectric body around the conductor by molding the dielectric body around the conductor.
- 5. The method of claim 4, further comprising the step of subjecting the resultant electrical connector to a post-mold annealing process.
- 6. The method of claim 4, comprising molding the dielectric body around the conductor by use of a molding technique selected from the group consisting of extrusion, injection molding, pressure molding, compression molding, and casting.
- 7. The method of claim 1, wherein the composition further comprises a filler.
- 8. The method of claim 7, wherein the filler is selected from the group consisting of glass fibers, glass spheres, and polyamide fibers.
- 9. The method of claim 7, wherein the filler is selected from the group consisting of silicates, fiberglass, calcium sulfate, asbestos, boron fibers, ceramic fibers, aluminum hydroxide, barium sulfate, calcium carbonate, fluorographite, magnesium carbonate, silica, alumina, aluminum nitride, borax, pearlite, zinc terephthalate, Buckyballs, graphite, talc, mica, synthetic Hectorite, silicon carbide platelets, wollastonite, calcium terephthalate, silicon carbide whiskers, and fullerene tubes.
- 10. The method of claim 7, wherein the composition comprises the filler in an amount of about 1% to about 50% by weight of the total composition.
- 11. The method of claim 7, wherein the composition comprises the filler in an amount of about 5% to about 35% by weight of the total composition.
- 12. The method of claim 7, wherein the composition comprises the filler in an amount of about 20% to about 30% by weight of the total composition.
- 13. The method of claim 1, wherein the conductor comprises an alloy selected from the group consisting of beryllium copper alloy, nickel silver alloy, nickel titanium alloy, and stainless steel.
- 14. The method of claim 1, wherein the composition further comprises a blending polymer selected from the group consisting of polyetherketone, polyetheretherketone, polysulfones, polyether sulfones, polyetherimides, polyphenylene sulfides, polyphthalamide, thermoplastic polyimide, polysulfone/polycarbonate alloy, and liquid crystalline polymers.
- 15. The method of claim 1, wherein the composition further comprises a blending polymer in an amount of about 2% by weight to about 20% by weight of the total composition.
- 16. The method of claim 1, wherein the composition further comprises a blending polymer in an amount of about 5% by weight to about 15% by weight of the total composition.
- 17. The method of claim 1, wherein the composition further comprises a blending polymer in an amount of about 7% by weight to about 10% by weight of the total composition.
- 18. The method of claim 1, wherein the electrical connector is selected from the group consisting of a single-pin connector, a multi-pin connector, a male connector, a female connector, a rotatable connector, and a hermaphroditic connector.
- 19. A method of manufacturing an electrical connector for use in a downhole tool, the method comprising molding a dielectric body around a conductor, wherein the dielectric body comprises a composition, and the composition comprises a polyetherketoneketone or a derivative of a polyetherketoneketone, wherein the composition is characterized by an improved thermal stability.
- 20. The method of claim 19, wherein comprising molding the dielectric body around the conductor by a molding technique selected from the group consisting of extrusion, injection molding, pressure molding, compression molding, and casting.
- 21. An electrical connector for use in a downhole tool comprising a dielectric body and a conductor, wherein the dielectric body comprises a composition that comprises a polyetherketoneketone or a derivative of a polyetherketoneketone, and the electrical connector is adapted for use in a downhole tool.
- 22. The electrical connector of claim 21, wherein the dielectric body is molded around the conductor.
- 23. The electrical connector of claim 21, wherein the composition comprises a polyetherketoneketone or a derivative of a polyetherketoneketone having a structure represented by a formula (I):
- 24. The electrical connector of claim 21, wherein the composition comprises a polyetherketoneketone or a derivative of a polyetherketoneketone having a structure represented by a formula (II):
- 25. The electrical connector of claim 21, wherein the dielectric body is molded around the conductor by a molding technique selected from the group consisting of extrusion, injection molding, pressure molding, compression molding, and casting.
- 26. The electrical connector of claim 21, wherein the electrical connector is selected from the group consisting of a single-pin connector, a multi-pin connector, a male connector, a female connector, a rotatable connector, and a hermaphroditic connector.
- 27. The electrical connector of claim 21, wherein the composition further comprises a filler selected from the group consisting of glass fibers, glass spheres, and polyamide fibers.
- 28. The electrical connector of claim 21, wherein the composition further comprises a blending polymer selected from the group consisting of polyetherketone, polyetheretherketone, polysulfones, polyether sulfones, polyetherimides, polyphenylene sulfides, polyphthalamide, thermoplastic polyimide, polysulfone/polycarbonate alloy, and liquid crystalline polymers.
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit under 35 U.S.C. §119(e) of U.S. provisional patent application No. 60/279,618, filed Mar. 29, 2001, the contents of which are incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60279618 |
Mar 2001 |
US |