Patent Application
20240250487
The invention generally relates to a resistance soldering, and more particularly relates to a method for attaching a metallic component, such as an electrical terminal to a conductive pad printed on a glass surface.
Resistance soldering is a process of heating a solder by passing an electrical current through a resistive electrode. This process has been used to solder electrical terminals to electrically conductive pads printed on glass surfaces. Prior resistance soldering devices typically required the object being soldered, e.g., electrical connectors and terminals, to be an electrically conductive element to complete the electrical heating circuit in the resistance soldering device. As electrical connectors and terminals become smaller, establishing a robust electrical contact between the resistance solder device and the electrical component becomes more difficult. On larger terminals with two independent electrical contact points, differences in resistance in the terminal can cause poor solder quality due to variance in temperature across the terminal. Therefore, a resistance soldering device that eliminates these issues to provide a more robust soldering process is desired.
The subject matter discussed in the background section should not be assumed to be prior art merely because of its mention in the background section. Similarly, a problem mentioned in the background section or associated with the subject matter of the background section should not be assumed to have been previously recognized in the prior art. The subject matter in the background section merely represents different approaches, which in and of themselves may also be inventions.
According to one or more aspects of the present disclosure, a resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed is provided. The resistance soldering device includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors.
In one or more embodiments of the resistance soldering device according to the previous paragraph, the bridge has a fixed end connected to the first electrical conductor and a free end configured to directly contact the first surface of the electrical terminal and wherein the second electrical conductor contacts the bridge at a location closer to the free end than the fixed end.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the bridge deflects the second electrical conductor, thereby providing a contact spring force between the bridge and the second electrical conductor.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the bridge deflects the second electrical conductor defines a V-shaped notch at a contact point between the second electrical conductor and the bridge.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the electrode is a first electrode and wherein the resistance soldering device further comprises a second electrode and a mechanism holding the first and second electrodes, the mechanism being configured to vary a distance between free ends of the first and second electrodes, thereby putting the first and second electrodes in position to contact two distinct points on the first surface of the electrical terminal.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the electrode further comprises a thermally conductive foot in thermal communication with the bridge and is configured to contact two distinct points on the first surface of the electrical terminal.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the thermally conductive foot is configured to be removeable from the resistance soldering device and replaceable with another thermally conductive foot defining a different pair of projections configured to contact the electrical terminal at two different points.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the resistance soldering device further includes a temperature measuring device.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the resistance soldering device further includes a pneumatic tube connected to an air movement device configured to cool the electrical terminal.
In one or more embodiments of the resistance soldering device according to any one of the previous paragraphs, the resistance soldering device further includes a spring device configured to apply a compressive force between the electrode and the first surface of the electrical terminal.
According to one or more aspects of the present disclosure, a method of resistance soldering includes the steps of:
In one or more embodiments of the method according to the previous paragraph, the electrode is a first electrode. The resistance soldering device further includes a second electrode. Step e) further includes contacting the first and second electrodes on two distinct points on the first surface of the electrical terminal.
In one or more embodiments of the method according to any one of the previous paragraphs, the resistance soldering device further a mechanism holding the first and second electrodes. Step e) further includes varying a distance between free ends of the first and second electrodes via the mechanism.
In one or more embodiments of the method according to any one of the previous paragraphs, the electrode includes a thermally conductive foot defining a pair of projections sized, shaped, and arranged to contact the electrical terminal on at least two different points and configured to contact the first surface of the electrical terminal. Step e) further includes contacting the pair of projections on two distinct points on the first surface of the electrical terminal.
In one or more embodiments of the method according to any one of the previous paragraphs, the thermally conductive foot is configured to be removeable from the resistance soldering device and replaceable with another thermally conductive foot defining a different pair of projections configured to contact a different electrical terminal configuration on at least two different points. The method further comprises:
In one or more embodiments of the method according to any one of the previous paragraphs, the electrode includes a temperature measuring device. The method further includes:
In one or more embodiments of the method according to any one of the previous paragraphs, the resistance soldering device further includes a cooling device configured to cool the electrical terminal. The method further includes:
In one or more embodiments of the method according to any one of the previous paragraphs, the cooling device is a tube connected to an air movement device.
In one or more embodiments of the method according to any one of the previous paragraphs, the resistance soldering device further includes a spring device configured to apply a compressive force between the electrode and the electrical terminal. The method further includes:
In one or more embodiments of the method according to any one of the previous paragraphs, the spring device is a helical compression spring.
The present invention will now be described, by way of example with reference to the accompanying drawings, in which:
In the drawings, different versions of the elements of the various embodiments share the last two digits of the reference numbers.
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the various described embodiments. However, it will be apparent to one of ordinary skill in the art that the various described embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.
The foot 20 defines a pair of projections 22 that are configured to contact the first surface 2 of the electrical terminal 1. This pair of projections 22 are sized, shaped, and arranged to contact 1 at least two different points on the first surface 2 of the electrical terminal.
The foot 20 is configured to be removeable from the device 10 and replaceable with another thermally conductive foot (not shown) having a different design that defines a different configuration of the pair of projections that contact at least two different points of the electrical terminal configuration. This is particularly beneficial to adapt the device 10 for using with electrical terminals having different sizes or physical configurations.
The device 10 includes a temperature measuring device 24, such as a thermocouple device, that may be used to measure and control the temperature of the electrode 12 to ensure the temperature of the solder layer 4 on the second surface 3 is melted by raising the temperature of the terminal 1 above the liquidus temperature of the solder material when the electrode 12 contacts the first surface 2 of the terminal 1 and applies heat to the terminal 1.
The device 10 also includes a cooling device 26 that is configured to cool the electrical terminal 1, and particularly the solder layer 4 on the second surface 3, below the solidus temperature of the solder material after the device 10 has melted the solder layer 4. The cooling device 26 cools the electrical terminal 1 by blowing an air stream that is less than the solidus temperature of the solder material onto the electrical terminal 1. As shown in
The device further includes a housing 28 and spacers 30 within the housing 28 to maintain the proper spacing of the first and second conductors 14, 16, the cooling tube 26, and the electrode 12 within the device 10.
The device additionally includes a spring device 32, such as a helical compression spring, configured to apply a compressive force between the electrode 12 and the electrical terminal 1.
As seen in
Without subscribing to any particular theory of operation, the electrode 12 is heated to a first desired temperature, e.g., a temperature at or above the liquidus temperature of the solder material in the solder layer 4 of the terminal 1, by turning on the power supply and applying an electrical current through the bridge via the first and second conductors 14, 16. The power supply may be turned on by a human operator by activation of a switch or by an electronic controller. Once the temperature measuring device 24 indicates that the temperature of the electrode 12 reaches the desired temperature, the electrode 12 is brought into contact with the first surface 2 of the terminal 1 and a compressive force is applied to the terminal by the electrode 12 thorough the action of the spring device 32. The electrode 12 is brought into contact with the first surface 2 of the terminal 1 by the human operator or a robotic device controlled by the electronic controller and held in place until the solder layer 4 on the second surface 3 melts. After the solder layer 4 has melted, the power supply is turned off. The cooling device 26 is then activated to cool the solder layer 4 to a second desired temperature that is less than the solidus temperature of the solder material. Application of the compressive force by the springe device is preferably maintained while cooling the terminal 1 to decrease the likelihood that the terminal 1 may move before the solder layer 4 has solidified. After the solder layer 4 has reached the second desired temperature and has solidified, the electrode is removed from the first surface 2 of the terminal 1. Removal of electrode 12 from the terminal 1 may be performed by the human operator or the robotic device under control of the electronic controller.
A non-limiting example of a method 200 of resistance soldering is presented in
Accordingly, a resistance soldering device 10, 100 and a method 200 of resistance soldering is provided. The resistance soldering device 10, 100 and the method 200 provide the benefit of eliminating the need to have two electrical contact points on the object being soldered, i.e., the terminal 1, by closing the resistive heating circuit within the device 10, 100. By having a closed circuit within the electrode 12, 112, heat can be generated at the electrode 12, 112 and transferred to the terminal 1 being soldered. Additionally, except for residual heat from the soldering process, the device 10, 100 only becomes hot enough to melt solder when electrical power is supplied to the device 10, 100 when an operator or controller actives the power supply.
Although the present disclosure is not so limited, the following numbered examples demonstrate one or more aspects of the disclosure.
While this invention has been described in terms of the preferred embodiments thereof, it is not intended to be so limited, but rather only to the extent set forth in the claims that follow. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to configure a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments and are by no means limiting and are merely prototypical embodiments.
Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the following claims, along with the full scope of equivalents to which such claims are entitled.
As used herein, ‘one or more’ includes a function being performed by one element, a function being performed by more than one element, e.g., in a distributed fashion, several functions being performed by one element, several functions being performed by several elements, or any combination of the above.
It will also be understood that, although the terms first, second, etc. are, in some instances, used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first contact could be termed a second contact, and, similarly, a second contact could be termed a first contact, without departing from the scope of the various described embodiments. The first contact and the second contact are both contacts, but they are not the same contact.
The terminology used in the description of the various described embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term “and/or” as used herein refers to and encompasses all possible combinations of one or more of the associated listed items. It will be further understood that the terms “includes,” “including,” “comprises,” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
As used herein, the term “if” is, optionally, construed to mean “when” or “upon” or “in response to determining” or “in response to detecting,” depending on the context. Similarly, the phrase “if it is determined” or “if [a stated condition or event] is detected” is, optionally, construed to mean “upon determining” or “in response to determining” or “upon detecting [the stated condition or event]” or “in response to detecting [the stated condition or event],” depending on the context.
Additionally, while terms of ordinance or orientation may be used herein these elements should not be limited by these terms. All terms of ordinance or orientation, unless stated otherwise, are used for purposes distinguishing one element from another, and do not denote any particular order, order of operations, direction or orientation unless stated otherwise.
This application is a divisional application of U.S. patent application Ser. No. 17/159,421, titled “Resistance Soldering Device and Method of Using Said Device” and filed on Jan. 27, 2021, which claims the benefit of U.S. Provisional Patent Application No. 62/983,782, titled “Resistance Soldering Device and Method of Using Said Device” and filed Mar. 2, 2020, the entire disclosure of each of which is hereby incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 62983782 | Mar 2020 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17159421 | Jan 2021 | US |
| Child | 18601294 | US |
