The present invention refers to a method for generating high density registration maps for masks.
Furthermore, the present invention refers to a system for generating high density registration maps for masks.
Furthermore, the present invention refers to a computer program product disposed on a non-transitory computer readable medium.
A mask (may also be referred to as a photomask or reticle) is a device that physically stores a pattern. The pattern is transferred to a wafer by lithography.
Mask registration metrology and mask inspection have traditionally been decoupled from one another due to their inherently conflicting requirements.
Mask registration is usually implemented using a stepping approach and involves positioning the reticle under the imaging optics for a period of time to image through focus steps. During registration measurement, the position of the reticle is held to tight absolute accuracy bounds by regulating the temperature of the measurement chamber very tightly and using high precision displacement metrology. Such an approach while guaranteeing tight bounds on absolute accuracy does not lend itself to a high throughput thus limiting the number of points on the reticle that can be measured.
For example, U.S. Pat. No. 8,582,113 discloses a device for determining the position of a structure on an object in relation to a coordinate system. The object is placed on a measuring table which is movable in one plane. At least one optical arrangement is provided which comprises an illumination apparatus for reflected light illumination and/or transmitted light illumination.
Additionally, several other US patents, like U.S. Pat. No. 8,248,618, U.S. Pat. No. 8,352,886 or U.S. Pat. No. 7,823,295, disclose devices or methods for determining the positions of structures on a mask.
On the other hand, mask inspection is implemented with a scanning approach using a Time Delay Integration (TDI) sensor. Absolute position accuracy is less important during mask inspection since the primary motive is to detect and classify defects on the mask. Image swaths from a mask inspection are also divided up into sub-patches which are realigned algorithmically to remove low-frequency image shifts (such as those due to temperature fluctuations) further reducing absolute accuracy.
Mask inspection systems are disclosed in U.S. Pat. No. 8,855,400, US patent application US 2014/0217298, U.S. Pat. No. 8,498,468 or U.S. Pat. No. 7,564,545 B2.
Especially, U.S. Pat. No. 8,624,971 discloses an inspection system for inspecting a surface of a wafer/mask/reticle. A modular array can include a plurality of TDI sensor modules, each TDI sensor module having a TDI sensor and a plurality of localized circuits for driving and processing the TDI sensor. The plurality of TDI sensor modules can be positioned to capture a same inspection region or different inspection regions. Spacing of the sensor modules can be arranged to provide 100% coverage of the inspection region in one pass or for fractional coverage requiring two or more passes for complete coverage.
The present systems or methods for mask registration metrology or mask inspection systems do not provide full mask registration map measurements. Metrology systems alone are not fast enough to cover the full mask. On the other hand, inspection systems alone are not accurate enough for registration metrology. The old method fails due to the need for a higher density registration map of a reticle which is in turn due to the increasing demands on both overlay and CD uniformity on wafer as feature sizes shrink. As a result, with limited number of samples from registration metrology, either good masks get rejected or bad masks get accepted due to insufficient coverage of the reticle.
It therefore is an object of the invention to provide a method for full mask registration map measurement which is fast enough to cover the full mask and accurate enough for registration metrology.
This object is achieved by a method for generating high density registration maps for masks comprising the following steps (note steps d) and e)+f) are interchangeable):
generating in a data preparation software module from the pattern design database of a mask and from a noise model of a registration tool a plurality of anchor points and a recipe for the registration tool;
generating in the data preparation software module from the pattern design database a mask and from a noise model of an inspection tool a plurality of sample points and a recipe for the inspection tool;
generating weights in the data preparation module for each anchor point;
measuring positions of the anchor points in a mask coordinate system with the registration tool according to the generated recipe;
scanning the full (or partial) area of the mask with the inspection system and extract a position measurement for each patch;
measuring positions of the anchor points in the mask coordinate system with respect to sample points on a same or adjacent swaths with the inspection tool according to the generated recipe; and
passing the measured positions of the anchor points and the measured positions of the sample points to a data fusion module, to determine a corrected set of registration measurement points under the influence of the generated weights of each anchor point on adjacent sample points. Note that data fusion module can be embedded into the inspection tool or as a separate module.
Also note the method further comprises passing the information about the anchor point measurement including position and image render parameters from the registration tool to the inspection tool for improved accuracy.
It is a further an object of the invention to provide a system for full mask registration map measurement which is fast enough to cover the full mask and accurate enough for registration metrology.
This object is achieved by a system for generating high density registration maps for masks, the system includes a data preparation software module which generates a plurality of anchor points, a plurality of sample points, a plurality of weights and at least one first recipe and at least one second recipe, a registration tool connected to the data preparation module to determine data for positions of the anchor points on the mask with regard to the at least one first recipe, an inspection tool connected to the data preparation module to determine data for positions of the sample points on the mask with regard to the at least one second recipe, a data fusion software module connected to the registration tool, the inspection tool and the data preparation software module in order to generate with the weights at least one registration map with a corrected set of registration points.
Note the registration tool can provide additional data learned from the mask (e.g., image rendering model) to the inspection too (or data fusion module) for improved accuracy.
The advantage of the inventive method and system is a higher density registration map of a reticle is obtained which in turn covers the increasing demands on both overlay and CD uniformity as feature sizes shrink. As a result, the entire mask is inspected to be within the mask registration error budget leading to no good masks get rejected and no bad masks get accepted.
According to one embodiment of the method, a graphical representation of the registration map of the mask is displayed on a display. The graphical representation shows the corrected set of registration points, wherein each registration point is provided with an error bar.
In an embodiment, the sample points, the anchor points and the weights are determined based on expected measurement error on both metrology and inspection tools. In a preferred embodiment, the generated number of anchor points is less than the generated number of sample points. Preferably, approximately 103 anchor points are generated and/or approximately 106 sample points are generated. The generated sample points may be up to 108 or even larger.
In an embodiment, the sample points, measured by the inspection tool, are cast over the entire mask by the data fusion module, according to the generated weights, into a mask coordinate frame as established by the registration tool to obtain the registration map of the mask. Preferably, the previously determined weights are used to determine the influence of a specific anchor point on the adjacent sample points in the mask coordinate frame. Preferably, bounds are established for potential errors between sample points according to a predetermined interpolation scheme. Preferably, the predetermined interpolation is realized by using influence functions.
In an embodiment, a user can regrid the displayed registration map over the sample points over a different set of points. Preferably, the different set of points is on a regularly spaced grid
In an embodiment of the inventive system for generating high density registration maps for masks, the data preparation module has at least a first input for providing mask design data in order to search for the appropriate anchor points as well as sample points. The design data for anchor and sample points are rendered in the registration tool and the inspection tool for position measurement. A second input of the data preparation module provides a noise model for the registration tool and the inspection tool.
According to a preferred embodiment of the invention, a first recipe module is connected to an anchor point output of the data preparation module and connected to an input of the registration tool. A second recipe module is connected to a sample point output of the data preparation software module and connected to an input of the inspection tool.
In an embodiment, the data fusion software module is configured to take the data of the measured positions of the anchor points via the output of the registration tool. Via the output of the inspection tool the data of the measured sample points are taken. A corrected set of registration points is generated along with the weights. According to a possible embodiment of the invention, a display is connected to the data fusion module for displaying bounded interpolation errors between anchor points over the entire mask.
In an embodiment, the number of anchor points is less than the number of sample points.
According to a further aspect of the invention, a computer program product is provided, which is disposed on a non-transitory computer readable medium. The computer program product comprises computer executable process steps operable to control a computer to: obtain positions of a plurality of anchor points in a mask coordinate system measured by a registration tool according to a predetermined recipe for the registration tool; obtain positions of a plurality of sample points as well as anchor points in the mask coordinate system measured by an inspection tool according to a predetermined recipe for the inspection tool; and calculate a correction function for sample points from the weight of anchor points and measured positions of the anchor points in both metrology and inspection tools. The correction function is applied to the sample points to provide a corrected registration map for the full mask.
In an embodiment, the weights, the recipe for the registration tool and the recipe for the inspection tool are obtained from a data preparation software module.
In an embodiment, the data of the measured positions of the anchor points and the measured positions of the sample points are used to generate along with the weights a corrected set of registration points bounded interpolation errors between anchor points over the entire mask.
The invention seeks to enable full mask registration map measurement. Metrology systems are not fast enough to cover the full mask. Inspection systems are not accurate enough for registration metrology. The invention proposes a way to combine both a metrology system and an inspection system in order to gain full mask registration mapping of masks.
The key advantage of the invention is the ability of the customer to obtain densely populated registration maps without any additional inspection or registration overhead and using existing capital equipment. The only additional requirement is that of the data preparation module and the data fusion module. The pre-processing and post-processing is realized with adequate software modules along with modifications to existing software of the registration tool and the inspection tool to enable the data gathering as required.
A novel feature of the present invention is the creation of a high-density registration map using a combination of (a few) anchor points from a mask registration tool and a larger number of sample points from the mask inspection tool. Furthermore, a novel feature is the use of a data preparation module (pre-processor) allowing the determination of appropriate locations (positions) of anchor points and sample points and the weights for the influence functions of the anchor points to achieve maximum accuracy in the final dense registration map. The use of a data fusion module (post-processor) is new, which casts the sample points in the coordinate frame of the mask imparted by the registration tool. The algorithms are used to bound interpolation errors between anchor points, and thus the entire mask is new. This permits the decoupling of the selection of anchor points which might be dependent on the mask design and the output data which might be use-case dependent.
High density registration maps of masks are becoming very important as the features (structures) on masks continue to shrink and requirements on wafer overlay become tighter. The registration of the masks with respect to one another affects both CD uniformity and overlay and hence is a key metric in ensuring adequate yields in a semiconductor fabrication. In addition, the emergence of multi-patterning has placed significant demands on mask overlay even within a single layer. The use of these high-density registration maps is multi-pronged. The invention allows a feedback to the mask writer. Furthermore, the acceptance or rejection as well as the qualification of a mask for the fabrication is enhanced. A feedforward of the mask to the scanner is possible. Additionally, it allows to determine the placement of patterns on EUV mask blanks.
Below, the invention and its advantages will be further described with reference to the accompanying figures in which:
In the figures like reference numerals are used for like elements or elements of like function. Furthermore, for the sake of clarity, only those reference numerals are shown in the figures which are necessary for discussing the respective figure.
In order to avoid an undue lengthiness of the specification it is not necessary to describe the well-known prior art coordinate measuring machine or metrology system (such as the IPRO-series of KLA Tencor), which is fully incorporated therein. For example, IPRO6 is a mask registration metrology tool designed to accurately measure and verify pattern placement performance of masks for the 1X nm node. It offers comprehensive characterization of mask pattern placement error, which is a direct contributor to intra-field wafer overlay error.
The same applies for the mask inspection tool (such as the TERON™ series of KLA Tencor) which is fully incorporated therein. The Teron™ reticle defect inspection system provides technologies to support IC fabs with mask monitoring of mask degradation and detecting yield-critical mask defects, such as haze growth defects or contamination in patterned and open areas. The Teron™ series mask defect inspection system can generate registration data as well as inspection data. The registration data from such a system is large in number (on the order of a million points per mask), but typically more limited in absolute accuracy than the registration tool.
As shown in the schematic embodiment of the inventive system 100 for generating high density registration maps for masks of
It should be noted that neither the anchor points 5 nor the sample points need to be on uniformly spaced grids. The locations of these points as well as the weights 17 are determined by an evaluation of the expected measurement error on each of the metrology an inspection tools at those locations as well as consideration for overlay hotspots, etc. over a care area 7 of the mask 2.
In the embodiment shown in
The registration tool 20 has an augmented software to generate registration data for the anchor points 5. The anchor points 5 are typically about a thousand in number, but the registration tool 20 can measure their location to the demanding accuracies required by the next few nodes of semiconductors.
The mask coordinate frame is established by the registration tool 20. Simultaneously, bounds are also established for potential errors between sample points according to a predetermined interpolation scheme. The customer can then choose to regrid the registration map over the sample points over a different set of points (on a regularly spaced grid, for example).
A data fusion module 40 is connected to the registration tool 20, the inspection tool 30 and the data preparation module 10. The weights 17 were previously determined by the data preparation module 10. The weights 17 are used as influence functions (see
As an output from the registration tool 20 one could obtain a graphical representation 27 of the registration of the anchor points 5 as disclosed in
The data fusion module 40, as shown in
Two possible weights (influence functions) are shown in
It is believed that the method and system of the present disclosure and many of its attendant advantages will be understood by the foregoing description, and it will be apparent that various changes may be made in the form, construction and arrangement of the components without departing from the disclosed subject matter or without sacrificing all of its material advantages. The form described is merely explanatory.
This application is filed under 35 U.S.C. §120 and §365(c) as a continuation of International Patent Application Serial No. PCT/US15/24060, filed on Apr. 2, 2015, which application claims the benefit under 35 U.S.C. 119(e) of U.S. Provisional Patent Application No. 61/974,001 filed on Apr. 2, 2014, which applications are incorporated herein by reference in their entirety.
Number | Date | Country | |
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61974001 | Apr 2014 | US |
Number | Date | Country | |
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Parent | PCT/US2015/024060 | Apr 2015 | US |
Child | 14795576 | US |