The present disclosure relates to methods and apparatuses utilizing continuous substrates for manufacturing articles, and more particularly, methods and apparatuses for applying viscous fluid, such as adhesives, to an advancing substrate.
Along an assembly line, various types of articles, such as for example, diapers and other absorbent articles, may be assembled by adding components to and otherwise modifying an advancing, continuous web of material. For example, in some processes, advancing webs of material are combined with other advancing webs of material. In other examples, individual components created from advancing webs of material are combined with advancing webs of material, which in turn, are then combined with other advancing webs of material. Webs of material and component parts used to manufacture diapers may include: backsheets, topsheets, absorbent cores, front and/or back ears, fastener components, and various types of elastic webs and components such as leg elastics, barrier leg cuff elastics, and waist elastics. Once the desired component parts are assembled, the advancing web(s) and component parts are subjected to a final knife cut to separate the web(s) into discrete diapers or other absorbent articles. The discrete diapers or absorbent articles may also then be folded and packaged.
Various methods and apparatuses may be used for attaching different components to the advancing web and/or otherwise modify the advancing web. For example, some production operations are configured to apply relatively high viscosity fluids, such as hot melt adhesives, to an advancing web. In some instances, the production operations are configured to apply hot melt adhesives to an advancing web in pre-determined patterns. These operations may include the use of systems and methods such as slot die coating, direct gravure, offset gravure and reverse gravure roll coating processes that are extensively described in the art. However, current systems and methods for applying patterned adhesives to an advancing substrate may have certain limitations.
Some current systems are configured with apparatuses and methods that apply adhesives and other fluids to a substrate in patterns with relatively high resolution and high speeds without being limited by the speed of on/off cycling of switching valves used to interrupt the flow of fluid to the slot die of the fluid applicator. For example, some systems may include patterned roll positioned adjacent a slot die applicator, wherein the patterned roll may be separated from the slot die applicator by a gap distance. During operation, a substrate having an unconstrained caliper that is greater than the gap distance may be advanced between the patterned roll and the slot die applicator. As the substrate advances between the patterned roll and the slot die applicator fluid is discharged from the slot die applicator onto the substrate in a pattern that corresponds with the pattern on the patterned roll. In some configurations, the ability to achieve fine resolution of on/off patterned discharged of adhesive on an advancing substrate is dependent upon the gap distance relative to the unconstrained caliper of the substrate.
Consequently, it would be beneficial to provide apparatuses and methods that can monitor and/or control the gap distances between patterned rolls and slot die applicators with relatively high resolution and high speeds while taking into account various system operating conditions.
Aspects of the present disclosure involve methods and apparatuses for applying fluids onto an advancing substrate. Embodiments of a fluid application apparatus are discussed below in the context of applying adhesives to an advancing substrate having an unconstrained caliper, Hs, and having a first surface disposed opposite of a second surface. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when the first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances the second surface of the substrate past the slot opening of the slot die applicator. The substrate carrier may include a base surface and a pattern element. And the pattern element includes a pattern surface and protrudes outward from the base surface. The substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate. Embodiments of apparatuses for applying fluids onto an advancing substrate herein may be configured to monitor; establish; maintain; and/or change the desired minimum distance, Hg, before and/or during operation.
In one embodiment, a method for applying a fluid to a substrate in a pattern comprises the steps of: providing a slot die applicator comprising a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; providing a substrate carrier comprising a pattern element, wherein the pattern element comprises a pattern surface; positioning the slot die applicator adjacent the substrate carrier to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip; advancing the substrate to the substrate carrier, the substrate having a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, wherein the unconstrained caliper, Hs, of the substrate is greater than minimum distance, Hg; advancing the second surface of the substrate past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; discharging fluid from the slot opening of the slot die applicator onto the second surface of the substrate in a pattern area having a shape that corresponds with a shape of the pattern surface on the substrate carrier by advancing the pattern surface of the pattern element past the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and moving the first lip and the second lip of the slot die applicator either away from or toward the pattern surface to maintain the minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip.
In another embodiment, a method for applying a fluid to a substrate in a pattern comprises the steps of: providing a slot die applicator comprising a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; providing a substrate carrier comprising a pattern element, wherein the pattern element comprises a pattern surface; positioning the slot die applicator adjacent the substrate carrier; advancing the substrate to the substrate carrier, the substrate having a first surface disposed opposite of a second surface; sensing a caliper of the substrate; moving the first lip and the second lip of the slot die applicator either away from or toward the pattern surface to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip, wherein the minimum distance, Hg, is less than the sensed caliper of the substrate; advancing the second surface of the substrate past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and discharging fluid from the slot opening of the slot die applicator onto the second surface of the substrate in a pattern area having a shape that corresponds with a shape of the pattern surface on a substrate carrier by advancing the pattern surface of the pattern element past the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier.
In yet another embodiment, a method for applying a fluid to a substrate in a pattern comprises the steps of: providing a slot die applicator connected with a motor, the slot die applicator comprising a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip; providing a substrate carrier comprising a pattern element, wherein the pattern element comprises a pattern surface; operating the motor to move the first lip and second lip into contact with the pattern surface; subsequently operating the motor to move the first lip and second lip away from the pattern surface to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip; sensing motor feedback device counts as the motor moves the first lip and second lip away from the pattern surface, and correlating the motor feedback device counts with the minimum distance, Hg; advancing the substrate to the substrate carrier, the substrate having a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, wherein the unconstrained caliper, Hs, of the substrate is greater than minimum distance, Hg; advancing the second surface of the substrate past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; discharging fluid from the slot opening of the slot die applicator onto the second surface of the substrate in a pattern area having a shape that corresponds with a shape of the pattern surface on a substrate carrier by advancing the pattern surface of the pattern element past the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier; and moving the first lip and the second lip of the slot die applicator either away from or toward the pattern surface to maintain the minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip.
FIG. 4A1 is a detailed view of the substrate carrier of
FIG. 4A2 is a detailed view of the pattern surface of the pattern element from FIG. 4A1 deflected by a force or forces applied to the pattern surface.
The following term explanations may be useful in understanding the present disclosure: “Absorbent article” is used herein to refer to consumer products whose primary function is to absorb and retain soils and wastes. Non-limiting examples of absorbent articles include diapers, training pants, pull-on pant-type diapers, refastenable diapers or pant-type diapers, incontinence briefs and undergarments, diaper holders and liners, feminine hygiene garments such as panty liners, absorbent inserts, and the like.
“Diaper” is used herein to refer to an absorbent article generally worn by infants and incontinent persons about the lower torso.
The term “disposable” is used herein to describe absorbent articles which generally are not intended to be laundered or otherwise restored or reused as an absorbent article (e.g., they are intended to be discarded after a single use and may also be configured to be recycled, composted or otherwise disposed of in an environmentally compatible manner).
The term “disposed” is used herein to mean that an element(s) is formed (joined and positioned) in a particular place or position as a macro-unitary structure with other elements or as a separate element joined to another element.
As used herein, the term “joined” encompasses configurations whereby an element is directly secured to another element by affixing the element directly to the other element, and configurations whereby an element is indirectly secured to another element by affixing the element to intermediate member(s) which in turn are affixed to the other element.
The term “substrate” is used herein to describe a material which is primarily two-dimensional (i.e. in an XY plane) and whose thickness (in a Z direction) is relatively small (i.e. 1/10 or less) in comparison to its length (in an X direction) and width (in a Y direction). Non-limiting examples of substrates include a layer or layers or fibrous materials, films and foils such as plastic films or metallic foils that may be used alone or laminated to one or more web, layer, film and/or foil. As such, a web is a substrate.
The term “nonwoven” refers herein to a material made from continuous (long) filaments (fibers) and/or discontinuous (short) filaments (fibers) by processes such as spunbonding, meltblowing, and the like. Nonwovens do not have a woven or knitted filament pattern.
The term “machine direction” (MD) is used herein to refer to the direction of material flow through a process. In addition, relative placement and movement of material can be described as flowing in the machine direction through a process from upstream in the process to downstream in the process.
The term “cross direction” (CD) is used herein to refer to a direction that is generally perpendicular to the machine direction.
The terms “elastic” and “elastomeric” as used herein refer to any material that upon application of a biasing force, can stretch to an elongated length of at least about 110% of its relaxed, original length (i.e. can stretch to 10% more than its original length), without rupture or breakage, and upon release of the applied force, recovers at least about 40% of its elongation. For example, a material that has an initial length of 100 mm can extend at least to 110 mm, and upon removal of the force would retract to a length of 106 mm (40% recovery). The term “inelastic” refers herein to any material that does not fall within the definition of “elastic” above.
The term “extensible” as used herein refers to any material that upon application of a biasing force, can stretch to an elongated length of at least about 110% of its relaxed, original length (i.e. can stretch to 10%), without rupture or breakage, and upon release of the applied force, shows little recovery, less than about 40% of its elongation.
The terms “activating”, “activation” or “mechanical activation” refer to the process of making a substrate, or an elastomeric laminate more extensible than it was prior to the process.
“Live Stretch” includes stretching elastic and bonding the stretched elastic to a substrate. After bonding, the stretched elastic is released causing it to contract, resulting in a “corrugated” substrate. The corrugated substrate can stretch as the corrugated portion is pulled to about the point that the substrate reaches at least one original flat dimension. However, if the substrate is also elastic, then the substrate can stretch beyond the relaxed length of the substrate prior to bonding with the elastic. The elastic is stretched at least 25% of its relaxed length when it is bonded to the substrate.
As used herein, the term “unconstrained caliper” refers to the caliper of the substrate measured according to Edana WSP 120.1 (05), with a circular presser foot having a diameter of 25.40±0.02 mm and an applied force of 2.1 N (i.e. a pressure of 4.14±0.21 kPa is applied).
As used herein, the term “compliant” refers to any material with a durometer hardness of 90 or less as measured according to ASTM International Designation: D2240-05 (Reapproved 2010) for Type M durometers.
As used herein, the term “non-compliant” refers to any material with a hardness value greater than 100 HRBW as defined on the Rockwell B Scale in the American National Standard Designation.
Aspects of the present disclosure involve methods and apparatuses utilizing continuous substrates for manufacturing articles, and more particularly, methods and apparatuses for applying fluids onto an advancing substrate. Particular embodiments of the apparatuses and methods disclosed herein provide for the application of viscous fluids, such as adhesives, and in some embodiments, the application of adhesives in pre-determined patterns to an advancing substrate. Embodiments of a fluid application apparatus are discussed in more detail below in the context of applying adhesives to an advancing substrate having an unconstrained caliper, Hs, and having a first surface disposed opposite of a second surface. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when the first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances the second surface of the substrate past the slot opening of the slot die applicator. It is to be appreciated that the apparatus and processes disclosed herein may be used to apply various types of fluids and adhesives in various different patterns to an advancing substrate other than those described and depicted herein.
As discussed in more detail below, the substrate carrier may include a base surface and a pattern element. The pattern element includes a pattern surface and protrudes outward from the base surface. As such, in substrate carriers configured with a base surface, the pattern surface and the base surface are separated by a distance, Hp. In addition, the substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate, wherein a sum of the distance, Hp, and distance, Hg, is greater than the unconstrained caliper, Hs, of the substrate. Thus, as the substrate carrier advances the second surface of the substrate past the slot opening, the pattern element is advanced such that the pattern surface repeatedly advances past the first lip, the slot opening, and the second lip of the slot die applicator. In turn, the substrate is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate is intermittently compressed, adhesive discharged from the slot die applicator is applied onto the second surface of the advancing substrate in an area having a shape that is substantially the same as a shape defined by the pattern surface. In some embodiments, the pattern element and/or the base surface of the substrate carrier may also be compliant or compressible. And as such, the pattern element and/or the base surface of the substrate carrier may be intermittently compressed as the substrate advances between the slot die applicator and the pattern surface. As such, the pattern surface of the pattern element may deflect away from the slot die applicator as the substrate and the pattern element advance past the first lip, the slot opening, and the second lip of the slot die applicator. And as the pattern surface is intermittently deflected away from the slot die applicator, adhesive discharged from the slot die applicator is applied onto the second surface of the advancing substrate. As mentioned above, the adhesive is thus applied to the substrate in an area having a shape that is substantially the same as a shape defined by the pattern surface.
Based on the foregoing operational description, it is to be appreciated that a desired minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip may be established based on various operating parameters. Such operating parameters may include, for example, the type of substrate material; the unconstrained caliper, Hs, of the substrate; the type fluid to be discharged from the slot die applicator; the substrate carrier material; and/or pattern shape. Once the desired minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip is established, it may be desired to monitor; maintain; and/or change the desired minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip during operation. As discussed in more detail below, embodiments of apparatuses for applying fluids onto an advancing substrate may be configured to monitor; establish; maintain; and/or change the desired minimum distance, Hg, before and/or during operation. For example, the slot die applicator and/or the substrate carrier may be adapted to move relative to each other. In some embodiments, the slot die applicator may be connected with a drive mechanism configured to move the slot die applicator away from and toward the substrate carrier. As such, the drive mechanism may be configured to move slot die applicator back and forth to establish; maintain; and/or change the desired minimum distance, Hg, before and/or during operation. In some embodiments, the drive mechanism may include one or more motors connected indirectly or directly with the slot die applicator. As discussed in more detail below, the drive mechanism may be configured to move the slot die applicator based on various parameters, such as for example, a temperature, T, of the slot die applicator; motor feedback device counts; torque of the motor, and/or a measured distance, Md, between the pattern surface of the pattern element and the first lip and the second lip.
The apparatuses and methods disclosed herein may include substrate carriers having various configurations, such as disclosed for example in U.S. Pat. No. 8,186,296 and U.S. Patent Publication Nos. 2014/0148774A1; 2014/0144579A1; 2014/0148323A1; and 2014/0148773A1. For example, in some embodiments the substrate carrier may be configured as a roller. In other embodiments, the substrate carrier may include an endless belt. The substrate carriers may also utilize various outer surface arrangements. For example, the base surface may be configured as a continuous surface and the substrate carrier may include a plurality of discrete pattern elements separated from each other by the continuous surface. In such a configuration, each pattern element may include a pattern surface and each pattern element may protrude outward from the continuous surface such that each pattern surface is separated from the continuous surface by the distance, Hp. In another example, the pattern surface may be configured as a continuous surface and the base surface may include a plurality of discrete base surfaces separated from each other by the pattern element. In such a configuration, the pattern element may protrude outward from each of the base surfaces such that each base surface is separated from the continuous surface by the distance, Hp. It is to be appreciated that the pattern surface of the pattern element may be configured in various different shapes and sizes and may be configured to define various different patterns. As such, adhesive may be transferred from the slot die applicator to define various patterns on a substrate.
As mentioned above, apparatuses and methods of the present disclosure may be utilized to apply adhesives to continuous substrates used in the manufacture of absorbent articles. Such substrates may be utilized in absorbent article components such as, for example: backsheets, topsheets, absorbent cores, front and/or back ears, fastener components, and various types of elastic webs and components such as leg elastics, barrier leg cuff elastics, and waist elastics. Exemplary descriptions of absorbent article components and substrates are provided below with reference to
Although much of the present disclosure is provided in the context of manufacturing absorbent articles, it is to be appreciated that the apparatuses and methods disclosed herein may be applied to the manufacture of other types of articles and products manufactured from continuous substrates. Examples of other products include absorbent articles for inanimate surfaces such as consumer products whose primary function is to absorb and retain soils and wastes that may be solid or liquid and which are removed from inanimate surfaces such as floors, objects, furniture and the like. Non-limiting examples of absorbent articles for inanimate surfaces include dusting sheets, pre-moistened wipes or pads, pre-moistened cloths, paper towels, dryer sheets and dry-cleaning clothes such. Additional examples of products include absorbent articles for animate surfaces whose primary function is to absorb and contain body exudates and, more specifically, devices which are placed against or in proximity to the body of the user to absorb and contain the various exudates discharged from the body. Non-limiting examples of incontinent absorbent articles include diapers, training and pull-on pants, adult incontinence briefs and undergarments, feminine hygiene garments such as panty liners, absorbent inserts, and the like, toilet paper, tissue paper, facial wipes or clothes, and toilet training wipes. Still other examples of products may include packaging components and substrates and/or containers for laundry detergent and coffee, which may be produced in pellets or pouches and may be manufactured in a converting or web process or even discrete products produced at high speed such as high-speed bottling lines, cosmetics, razor blade cartridges, and disposable consumer batteries.
It is to be appreciated that the slot die applicator 102 shown in
Various types of substrate carriers 104 may be used in accordance with the apparatuses and methods herein. For example,
As discussed in more detail below, as the substrate carrier 104 advances the substrate 106 past the slot die applicator 102, fluid discharged from the slot die applicator is deposited onto the substrate in a pattern substantially matching the shapes of the pattern surfaces on the substrate carrier. For example,
As previously mentioned, as the substrate carrier 104 advances the substrate 106 past the slot die applicator 102, fluid 130 discharged from the slot die applicator 102 is deposited onto the substrate 106 in a pattern substantially matching the shape of the pattern surface 126 on the substrate carrier 104. For example,
As previously mentioned, the substrate carrier may be constructed in various ways such that the base surface and/or pattern elements may or may not include compliant materials. In some configurations, the compliant material(s) may be compressible to allow a pattern surface of a pattern element to deflect away from the slot die applicator. Thus, the substrate carrier may be configured such that deflection of the pattern surface away from the slot die applicator compresses the pattern element and/or base surface as the substrate and the pattern element advance past the first lip, the slot opening, and the second lip of the slot die applicator.
For example, FIGS. 4A1 and 4A2 show a detailed view of the substrate carrier 104 in the form of a roller 120, such as from
It is to be appreciated that substrate carrier may be configured in various ways other than discussed with reference to FIGS. 4A1 and 4A2. For example, the substrate carrier 104 may be in the form of a roller 120, such as from
As previously mentioned, the methods and apparatuses herein include a substrate carrier adapted to advance a substrate past a slot die applicator.
With continued reference to
With continued reference to
R2=R1+Hg−Hs
In such a scenario, the compressed distance, Hc, may also be equal to or substantially equal to the unconstrained caliper, Hs.
Still referring to
R2=R1+Hg−Hc
With continued reference to
Still referring to
As mentioned above, it is to be appreciated that various forms and configurations of substrate carriers may be used with the presently disclosed methods and apparatuses, such as disclosed for example in U.S. Pat. No. 8,186,296 and U.S. Patent Publication Nos. 2014/0148774A1; 2014/0144579A1; 2014/0148323A1; and 2014/0148773A1.
As mentioned above and based on the foregoing operational description, it is to be appreciated that the apparatuses and methods herein may be configured to monitor; establish; maintain; and/or change the desired minimum distance, Hg, between the pattern surface 126 of the uncompressed pattern element 122 and the first lip 116 and the second lip 118 before and/or during operation. As such, the slot die applicator 102 and/or the substrate carrier 104 may be adapted to move relative to each other. For example, as shown in
It is to be appreciated that the drive mechanism 500 may be configured in various ways. For example, as shown in
It is to be appreciated that the controller 506 may include one or more computer systems. The computer system may, for example, include one or more types of programmable logic controller (PLC), programmable automation controller (PAC), and/or personal computer (PC) running software and adapted to communicate over a network using a protocol. Some embodiments may utilize industrial programmable controllers such as the Siemens S7 series, Rockwell ControlLogix, SLC or PLC 5 series, or Mitsubishi Q series and employ communication protocols including serial communications, DeviceNet, ControlNet, Sercos, TCP/IP, Ethernet/IP, Modbus, ModbusTCP, Profibus, ProfiNet, EtherCAT, I/O Link, and SSCNet. The aforementioned embodiments may use a personal computer or server running a control algorithm such as Rockwell SoftLogix or National Instruments Labview or may be any other device capable of receiving inputs from sensors, performing calculations based on such inputs and generating control actions through servomotor controls, electrical actuators or electro-pneumatic, electrohydraulic, and other actuators. Process and product data may be stored directly in the controller or may be located in a separate data historian. In some embodiments, the historian is a simple data table in the controller. In other embodiments, the historian may be a relational or simple database. Common historian applications include Rockwell Automation Factory Talk Historian, General Electric Proficy Historian, OSI PI, or any custom historian that may be configured from Oracle, SQL or any of a number of database applications. It is also to be appreciated that various types of controllers and inspection sensors can be configured in various ways and with various algorithms to provide various types of data and perform various functions, for example, such as disclosed in U.S. Pat. Nos. 5,286,543; 5,359,525; 6,801,828; 6,820,022; 7,123,981; 8,145,343; 8,145,344; and 8,244,393; and European Patent No. EP 1528907B1.
With continued reference to
Before operation, the drive mechanism 500 may be used in various ways to establish the desired minimum distance, Hg, between the pattern surface 126 of the uncompressed pattern element 122 and the first lip 116 and the second lip 118. In an example scenario, the controller 506 may operate the motor 502 to move the slot die applicator 102 toward the substrate carrier 104, wherein the first lip 116 and second lip 118 are moved into contact with a pattern surface 126. Current supplied to the motor 502 can be monitored by the controller 506 and may be correlated with motor output torque. As such, the motor output torque may be used to provide an indication as to when the first lip 116 and second lip 118 are moved into contact with a pattern surface 126. Subsequently, the controller may operate the motor 502 to move the slot die applicator 102 away from or toward the substrate carrier 104 to establish the desired minimum distance, Hg, as detected based on motor feedback device counts from the motor feedback device 502a and/or the position sensor 508. It is to be appreciated that sensed torque of the motor 502 may be used as a basis to move the first lip 116 and the second lip 118 of the slot die applicator 102 either away from or toward the pattern surface 126 during operation.
As previously mentioned, the drive mechanism 500 may also be used during operation to monitor; establish; maintain; and/or change the desired minimum distance, Hg, between the pattern surface 126 of the uncompressed pattern element 122 and the first lip 116 and the second lip 118 based on various parameters.
In some configurations, the drive mechanism 500 may be manually operated by a user to move the slot die applicator 102 to adjust the desired minimum distance, Hg. In some configurations, the controller 500 may automatically operate the drive mechanism 500 to move the slot die applicator 102 to adjust the desired minimum distance, Hg, based on various sensed operating parameters. For example, as shown in
In another example, as shown in
It is to be appreciated that various different types of inspection sensors 512 may be used to monitor substrates and various components. For example, inspection sensors 512 may be configured as photo-optic sensors that receive either reflected or transmitted light and serve to determine the presence or absence of a specific material; metal-proximity sensors that use electromagnetic to determine the presence or absence of a ferromagnetic material; or capacitive or other proximity sensors using any of a number of varied technologies to determine the presence or absence of materials. Inspection sensors 512 may also be configured as vision systems and other sub-processing devices to perform detection and, in some cases, logic to more accurately determine the status of an inspected product. Particular examples of such inspections sensors 512 may include Cognex Insight, DVT Legend or Keyence smart cameras, component vision systems such as National Instruments PXI or PC based vision system such as Cognex VisionPro or any other vision system software which can run on a PC platform. It is to be appreciated that various types of sensors 512 may be used, such as for example, structured light sensors. Examples of such sensors may include a Keyence LJ-V7300; Cognex DS1000; SICK Ranger C; and Keyence LJ-V7000 series including a LJ-V7080 head with a LJ-V7001 controller and Automation Technology C2-2040HS-GigE. Additional examples of sensors 512 methods of operation are described in U.S. Pat. Nos. 7,460,250; 7,489,410; and 7,667,857, which are all incorporated herein by reference.
Based on the foregoing discussion, it is to be appreciated that the controller 500 may automatically operate the drive mechanism 500 to move the slot die applicator 102 to adjust the desired minimum distance, Hg, based on various parameters detected by the inspection sensor 512. For example, the inspection sensor may be configured to detect or provide an indication of the caliper and/or change in caliper of the substrate 106. Based on the sensed caliper the drive mechanism may move the first lip 116 and the second lip 118 of the slot die applicator 102 either away from or toward the pattern surface 126 to define a minimum distance, Hg, between the pattern surface 126 of the pattern element 122 and the first lip 116 and the second lip 118, wherein the minimum distance, Hg, is less than the sensed caliper of the substrate 106.
With reference to the above description and associated figures, it is to be appreciated that the apparatuses 100 herein may be used to apply adhesive 130 discharged from a slot die applicator 102 to a substrate 106 in a pattern by continuously advancing the substrate in a machine direction past a first lip 116, second lip 118, and slot opening 114 in the slot die applicator 102. The substrate 106 may be engaged with a substrate carrier 104 that may include a base surface 124 and a pattern element 122, wherein the pattern element includes a pattern surface 126. The pattern element 122 protrudes from the base surface 124 to define a distance, Hp, between the pattern surface 126 and the base surface 124. As previously mentioned, in some embodiments, the substrate carrier may include holes 136 instead of or in combination with base surfaces 126 adjacent the pattern element 122. The substrate carrier 104 is positioned adjacent the slot die applicator 102 to define a minimum distance, Hg, between the pattern surface 126 of the uncompressed pattern element 122 and the first lip 116 and the second lip 118 that is less than the unconstrained caliper, Hs, of the substrate 106. The second surface 110 of the substrate 106 may be advanced past the slot die applicator 102 while the first surface 108 of the substrate 106 is disposed on the substrate carrier 104. And the substrate 106 is intermittently compressed between the slot die applicator 102 and the pattern surface 126 of the pattern element 122 by advancing the pattern element as the pattern surface of the pattern element advances past the first lip 116, the slot opening 114, and the second lip 118 of the slot die applicator 102 while the first surface 108 of the substrate 106 is disposed on the substrate carrier 104.
As previously mentioned, the apparatuses 100 and methods herein may be used to provide for the application of adhesives in patterns to substrates and components during the manufacture of various different products, such as disclosed in for example in U.S. Pat. No. 8,186,296 and U.S. Patent Publication Nos. 2014/0148774A1; 2014/0144579A1; 2014/0148323A1; and 2014/0148773A1. For the purposes of a specific illustration,
As shown in
The absorbent article may also include an elastic waist feature 202 shown in
As shown in
The diaper 252 may be provided in the form of a pant-type diaper or may alternatively be provided with a re-closable fastening system, which may include fastener elements in various locations to help secure the diaper in position on the wearer. For example, fastener elements may be located on the first and second ears and may be adapted to releasably connect with one or more corresponding fastening elements located in the second waist region. It is to be appreciated that various types of fastening elements may be used with the diaper.
Components of the disposable absorbent article (i.e., diaper, disposable pant, adult incontinence article, sanitary napkin, pantiliner, etc.) described in this specification can at least partially be comprised of bio-sourced content as described in US 2007/0219521A1 Hird et al published on Sep. 20, 2007, US 2011/0139658A1 Hird et al published on Jun. 16, 2011, US 2011/0139657A1 Hird et al published on Jun. 16, 2011, US 2011/0152812A1 Hird et al published on Jun. 23, 2011, US 2011/0139662A1 Hird et al published on Jun. 16, 2011, and US 2011/0139659A1 Hird et al published on Jun. 16, 2011. These components include, but are not limited to, topsheet nonwovens, backsheet films, backsheet nonwovens, side panel nonwovens, barrier leg cuff nonwovens, super absorbent, nonwoven acquisition layers, core wrap nonwovens, adhesives, fastener hooks, and fastener landing zone nonwovens and film bases.
In at least one exemplary configuration, a disposable absorbent article component comprises a bio-based content value from about 10% to about 100% using ASTM D6866-10, method B, in another embodiment, from about 25% to about 75%, and in yet another embodiment, from about 50% to about 60% using ASTM D6866-10, method B.
In order to apply the methodology of ASTM D6866-10 to determine the bio-based content of any disposable absorbent article component, a representative sample of the disposable absorbent article component must be obtained for testing. In at least one embodiment, the disposable absorbent article component can be ground into particulates less than about 20 mesh using known grinding methods (e.g., Wiley® mill), and a representative sample of suitable mass taken from the randomly mixed particles.
In the context of the previous discussion, the apparatuses 100 and methods herein may be used to provide for the application adhesives in patterns to substrates and components during the manufacture of an absorbent article. For example, adhesives may be applied in various patterns to portions of any of the topsheet, backsheet films, backsheet nonwovens, absorbent core, core encapsulation webs, acquisition layer, surge layer, secondary topsheet layer, leg cuffs, waist feature, ears, and fastening elements during the manufacture of an absorbent article. In some instances, the adhesive may be a different color than that of the substrate. In some applications, the apparatuses and methods herein may be adapted to apply adhesives in absorbent core assembly processes, such as described for example in U.S. Patent Publication Nos. 2006/0021695A1; 2006/0048880A1; 2008/0215166A1; and 2010/0051166A1. In some instances, the apparatuses and methods herein may be configured to apply fluid formulations in the form of wetness indicators, such as disclosed for example in U.S. Patent Publication No. 2011/0137274A1. In yet other instances, the apparatuses and methods herein may be configured to apply fastening adhesives for feminine care articles, including sanitary napkins, panty liners, adult incontinence pads, and the like, such as disclosed for example in European Patent Publication No. EP 0745368A1.
The dimensions and values disclosed herein are not to be understood as being strictly limited to the exact numerical values recited. Instead, unless otherwise specified, each such dimension is intended to mean both the recited value and a functionally equivalent range surrounding that value. For example, a dimension disclosed as “40 mm” is intended to mean “about 40 mm.”
Every document cited herein, including any cross referenced or related patent or application and any patent application or patent to which this application claims priority or benefit thereof, is hereby incorporated herein by reference in its entirety unless expressly excluded or otherwise limited. The citation of any document is not an admission that it is prior art with respect to any invention disclosed or claimed herein or that it alone, or in any combination with any other reference or references, teaches, suggests or discloses any such invention. Further, to the extent that any meaning or definition of a term in this document conflicts with any meaning or definition of the same term in a document incorporated by reference, the meaning or definition assigned to that term in this document shall govern.
While particular embodiments of the present invention have been illustrated and described, it would be obvious to those skilled in the art that various other changes and modifications can be made without departing from the spirit and scope of the invention. It is therefore intended to cover in the appended claims all such changes and modifications that are within the scope of this invention.
This application claims the benefit of U.S. Provisional Application No. 62/007,965 filed on Jun. 5, 2014, which is incorporated herein by reference.
Number | Date | Country | |
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62007965 | Jun 2014 | US |