1. Field of the Invention
This invention relates generally to methods and apparatus for making magnetic heads, and more particularly to methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field.
2. Description of the Related Art
Computers often include auxiliary memory storage devices having media on which data can be written and from which data can be read for later use. A direct access storage device (e.g. a disk drive) incorporating rotating magnetic disks are commonly used for storing data in magnetic form on the disk surfaces. Data is recorded on concentric, radially spaced tracks on the disk surfaces. Magnetic heads including read sensors are then used to read data from the tracks on the disk surfaces.
The dimensions of magnetic heads are shrinking rapidly as the recording density of magnetic disks continues to increase. To ensure optimal magnetic performance, these magnetic heads require tight dimension controls at both the wafer manufacturing and slider fabrication levels. Magnetic heads are formed during the wafer manufacturing process where widths, gaps, and other dimensions of the magnetic heads are defined. During such process, a wafer is typically cut into many individual sliders, each of which carries a magnetic head and associated read sensor. The sliders are mechanically lapped or polished with use of a lapping plate to achieve a flat and smooth surface finish for good mechanical performance. The lapping also defines the proper heights for the magnetic head, especially the read sensor's height (a.k.a. the “stripe height”) for good magnetic performance.
Traditionally, slider fabrication was monitored and controlled with the use of Electrical Lapping Guides (ELGs). ELGs are typically formed at a kerf area of the wafer in between sliders for the sole purpose of lapping control. With today's magnetic heads, however, the alignment error between the ELG and the read sensor becomes significant relative to the stripe height. Therefore, the resistance of the read sensor may be utilized to directly control the lapping process to achieve a very tight read sensor resistance distribution. Achieving such tight resistance distribution, however, does not guarantee optimal magnetic performance. Most variations in read sensors (e.g. variations in the read gap thickness, mean-read-width or MRW, film quality, hard bias quality, etc.) are fixed from the wafer manufacturing prior to the lapping process. Thus, achieving tight resistance distribution only eliminates one of several variations which contribute to the degradation of magnetic performance. One of the key indicators of a read sensor's performance is its response to external magnetic fields, specifically its readback signal amplitude and asymmetry. Amplitude measures the read sensor's sensitivity to the magnetic field, and asymmetry measures the shape of the response.
Accordingly, what are needed are ways in which to control the lapping of sliders to optimize the performance of read sensors.
According to the present application, the lapping of a slider is controlled based at least in part on a readback signal amplitude which is produced from an externally applied magnetic field. A lapping plate is used to lap the slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces a magnetic field around the slider and processing circuitry monitors both a readback signal amplitude and a resistance of the read sensor. The lapping of the slider is terminated based on monitoring both the readback signal amplitude and the resistance. Preferably, the lapping of the slider is terminated when the resistance is within a predetermined resistance range and the readback signal amplitude is above a predetermined minimum amplitude threshold or reaches its peak value.
For a fuller understanding of the nature and advantages of the present invention, as well as the preferred mode of use, reference should be made to the following detailed description read in conjunction with the accompanying drawings:
According to the present application, the lapping of a slider is controlled based at least in part on a readback signal amplitude which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces a magnetic field around the slider and processing circuitry monitors the readback signal amplitude and a resistance of the read sensor. The lapping of the slider is terminated based on the monitoring of the readback signal amplitude and the resistance. Preferably, the lapping of the slider is terminated when the readback signal amplitude is above a predetermined minimum amplitude threshold (or that it has reached its peak value) and the resistance is within a predetermined resistance range.
As described above in the Background section, slider fabrication has been traditionally monitored and controlled with the use of Electrical Lapping Guides (ELGs). ELGs are typically formed at a kerf area of the wafer in between sliders for the sole purpose of lapping control. With today's magnetic heads, however, the alignment error between the ELG and the read sensor becomes significant relative to the stripe height. On the other hand, the resistance of the read sensor itself may be monitored and used to control the lapping process to achieve a very tight read sensor resistance distribution. Achieving such tight resistance distribution, however, does not guarantee optimal magnetic performance. Most variations in read sensors (e.g. variations in the read gap thickness, mean-read-width or MRW, film quality, hard bias quality, etc.) are fixed from the wafer manufacturing prior to the lapping process. Thus, achieving tight resistance distribution only eliminates one of several variations which contribute to the degradation of magnetic performance. Note that one of the key indicators of a read sensor's performance is its response to external magnetic fields, specifically its readback signal amplitude and asymmetry. Amplitude measures the read sensor's sensitivity to the magnetic field, and asymmetry measures the shape of the response.
During the lapping, an external magnetic field may be generated at the slider so that the readback signal from the read sensor can be used to control the lapping process. Using such a technique, it is generally desirable to lap the slider such that the readback signal amplitude is maximized or above a minimum threshold value. It has been noted, however, that the readback signal amplitude changes non-monotonically with the stripe height of the read sensor, which is inversely proportional to the resistance. As the lapping process removes materials from the slider, the read sensor's stripe height decreases while its resistance increases. When the stripe height is too long, most of the read sensor is screened from the external magnetic field, which results in too small of a detected readback signal amplitude. When the stripe height is too short, an opposing demagnetic field dominates which again results in too small of a readback signal amplitude. Thus, it has been observed that the maximum amplitude may only be achieved at an optimal stripe height or resistance value.
Due to the variations in read sensors, the readback signal amplitude may peak at different stripe height or resistance values from sensor to sensor. To illustrate such variations, a graph 100 in
Note also that the readback signal amplitude may not change smoothly with the stripe height during the lapping process. To illustrate, a graph 200 in
In the present embodiment, system 300 also includes an inductive coil 320 which is positioned around lapping plate 312 or slider 302. Note that the exact position of coil 320 is not important as long as the magnetic field it generates is detectable at slider 302. Coil 320 is coupled to coil driver 322, which is in turn coupled to control circuitry 326. Read sensor 305 is coupled to measuring circuitry 332, which is in turn coupled to a digitizer 328. Digitizer 328 is in turn coupled to processing circuitry 330. Digitizer 328 may include, for example, an analog-to-digital (A/D) converter for converting analog read signals from read sensor 305 into digital data. Measuring circuitry 332 provides an electrical current to read sensor 305 and preamplifies the voltage across read sensor 305. Processing circuitry 330 may utilize any suitable circuitry to process analog signals (e.g. from read sensor 305) or digital data (e.g. from digitizer 328), and preferably includes a high-speed microprocessor or digital signal processor (DSP) which operates in accordance with computer program instructions for processing digital data from digitizer 328. Processing circuitry 330 instructs control circuitry 326 in the control of mechanisms 308 and 316 and coil driver 322. Control circuitry 326 is utilized to control mechanisms 308 and 316 and coil driver 322.
Coil driver 322 is activated during the lapping process so that coil 320 produces a magnetic field 324 (“H field”) at slider 320. The magnetic field 324 produced is perpendicular to lapping plate 312 and to an air bearing surface (ABS) of slider 302. Coil driver 322 may drive coil 320 using a direct current (DC) or alternating current (AC) drive signal. Magnetic field 324 may be any suitable field strength, such as between 10 and 500 Gauss. Read sensor 305 senses this magnetic field 324 and its resistance R varies in response thereto. Since the current through read sensor 305 is fixed, the resistance R is directly proportional to the voltage which is received continuously as an analog readback signal at measuring circuitry 332. Digitizer 328 converts this analog readback signal from measuring circuitry 332 into a digital signal which is received at processing circuitry 330. Processing circuitry 330 then calculates the resistance R and part of the resistance change dR responsive to the external magnetic field. The readback signal amplitude is proportional to dR/R.
With the digital read signal data, processing circuitry 330 monitors the readback signal amplitude (dR/R) from read sensor 305. In general, processing circuitry 330 instructs control circuitry 326 to terminate lapping based on the readback signal amplitude from read sensor 305. In particular, processing circuitry 330 is programmed to identify an acceptable readback signal amplitude from read sensor 305 and to terminate the lapping process when so identified. An acceptable readback signal amplitude may be identified by comparing the readback signal amplitude with a predetermined minimum amplitude threshold, or that it has reached its peak value.
Preferably, processing circuitry 330 instructs control circuitry 326 to terminate the lapping based on both the readback signal amplitude and the resistance (R) of read sensor 305. In this case, processing circuitry 330 identifies when the resistance is within a predetermined resistance range and the readback signal amplitude is above a predetermined minimum amplitude threshold or has reached its peak value. For example, the predetermined resistance range may be 20-6000 ohms and the predetermined minimum dR/R threshold (or minimum amplitude threshold) may be a value between about 0.1-10%. The resistance of the read signal may be identified by extracting and measuring the DC component from the read signal.
As stated above, coil driver 322 may drive coil 320 using a DC or AC drive signal. Preferably, the drive signal is an AC signal at a predetermined frequency f0. Thus, coil driver 322 may apply a current I=I0 sin(2πfot) through coil 320. The predetermined frequency f0 may be any suitable frequency.
If an AC drive signal is utilized, processing circuitry 330 is configured to extract the f0 component to identify the readback signal amplitude (dR/R) of the read sensor. This may be done in any suitable fashion. Preferably, processing circuitry 330 includes a DSP to perform a Fast Fourier Transform (FFT) at the frequency f0. Alternatively, a phase-locked-loop (PLL) process may be utilized to correlate the read signal with the frequency f0. As another option, the power spectrum at the frequency f0 may be assessed to identify the readback signal amplitude of the read sensor.
Note that, with respect to the flowchart of
Beginning at a start block 902 of
The resistance R is then tested to identify whether it is within a predetermined resistance range (step 912). The predetermined resistance range may be from 20-6000 ohms, for example. If the resistance R is not within the predetermined range at step 912, then it is tested whether the resistance R is above a maximum allowable value (step 913). If the resistance R is above the maximum allowable value at step 913, the lapping is terminated (step 918); otherwise the lapping process and monitoring continues at step 906. If the resistance is within the predetermined range at step 912, the flowchart proceeds to step 914. The readback signal amplitude A, which is proportional to the resistance change dR normalized by the resistance R (namely dR/R), is tested to identify whether it is above a predetermined minimum amplitude threshold or that it has reached its peak value (step 914). The predetermined minimum amplitude threshold may be a value between about 0.1 to 10%. If the readback signal amplitude A is not above the predetermined minimum threshold, then the monitoring continues at step 906. If the readback signal amplitude A is greater than the predetermined minimum threshold, then the flowchart proceeds to step 916.
The asymmetry measurement is then tested to identify whether it falls within a predetermined asymmetry range (step 916). In general, asymmetry is defined to be within a range of −1 to +1. The predetermined asymmetry range for the present method may therefore be within the maximum possible range of −1 to +1 or within a tighter asymmetry range (e.g. between −0.5 to +0.5). If the asymmetry measurement is not within the predetermined range, then the lapping process and monitoring continues at step 906. If the asymmetry measurement is within the predetermined range, then the lapping of the slider is terminated (step 918).
Final Comments. As described herein, the lapping of a slider is controlled based at least in part on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces a magnetic field around the slider and processing circuitry monitors both a readback signal amplitude and a resistance of the read sensor. The lapping of the slider is terminated based on the monitoring of both the readback signal amplitude and the resistance. Preferably, the lapping of the slider is terminated when the resistance is within a predetermined resistance range and the readback signal amplitude is above a predetermined minimum amplitude threshold or reaches its peak value.
A slider lapping system includes a lapping plate for lapping a slider which includes at least one magnetic head with a read sensor; a moving mechanism which moves the lapping plate relative to the slider; a coil which produces a magnetic field around the slider during the lapping; processing circuitry which is operative to monitor a readback signal amplitude of the read sensor during the lapping; and control circuitry coupled to the moving mechanism and the processing circuitry, which is operative to cause the lapping to terminate based on the monitoring of the readback signal amplitude.
In a related technique, a method involves lapping a slider which includes at least one magnetic head and, during the lapping of the slider, performing the following steps: producing a magnetic field around the magnetic head; monitoring a readback signal amplitude of a read sensor of the magnetic head which varies during the lapping of the slider; generating an asymmetry measurement based on the monitored readback signal amplitude; and terminating the lapping of the slider based at least in part on the monitoring of the asymmetry measurement.
It is to be understood that the above is merely a description of preferred embodiments of the invention and that various changes, alterations, and variations may be made without departing from the true spirit and scope of the invention as set for in the appended claims. Few if any of the terms or phrases in the specification and claims have been given any special meaning different from their plain language meaning, and therefore the specification is not to be used to define terms in an unduly narrow sense.