Devices or means for detecting lapping completion

Industry

CPC
B24B37/013

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BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/013Devices or means for detecting lapping completion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Machine vision as input to a CMP process control algorithm
- Patent number 12,257,665
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Benjamin Cherian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing system with capacitive shear sensor
- Patent number 12,233,505
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- B24 - GRINDING POLISHING
Information Patent Grant
Output signal processing apparatus for eddy current sensor
- Patent number 12,179,310
- Issue date Dec 31, 2024
- Ebara Corporation
- Atsushi Abe
- G01 - MEASURING TESTING
Information Patent Grant
System using film thickness estimation from machine learning based...
- Patent number 12,169,925
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thickness measurement of substrate using color metrology
- Patent number 12,148,148
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Dominic J. Benvegnu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layered windows for use in chemical-mechanical planarization...
- Patent number 12,138,735
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Channel cut polishing machine
- Patent number 12,134,164
- Issue date Nov 5, 2024
- UChicago Argonne, LLC
- Elina Kasman
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,131,923
- Issue date Oct 29, 2024
- Ebara Corporation
- Yuta Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated dry-in dry-out dual side polishing of silicon substrates...
- Patent number 12,094,740
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Manoj A. Gajendra
- B08 - CLEANING
Information Patent Grant
Determination of substrate layer thickness with polishing pad wear...
- Patent number 12,090,599
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus, polishing method and method for outputting vis...
- Patent number 12,083,646
- Issue date Sep 10, 2024
- Ebara Corporation
- Hiroaki Shibue
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 12,076,830
- Issue date Sep 3, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Optical thickness control during a chemical mechanical polishing pr...
- Patent number 12,059,769
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Trained neural network in in-situ monitoring during polishing and p...
- Patent number 12,057,354
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of detecting non-conforming substrate processing events dur...
- Patent number 12,036,635
- Issue date Jul 16, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 12,011,800
- Issue date Jun 18, 2024
- BRUKER NANO INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Performing planarization process controls in semiconductor fabrication
- Patent number 12,009,221
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chunhung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method, polishing agent and cleaning agent for polishing
- Patent number 11,986,920
- Issue date May 21, 2024
- Kioxia Corporation
- Mikiya Sakashita
- B24 - GRINDING POLISHING
Information Patent Grant
Motor torque endpoint during polishing with spatial resolution
- Patent number 11,980,995
- Issue date May 14, 2024
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
Single bodied platen housing a detection module for CMP systems
- Patent number 11,975,421
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Filtering during in-situ monitoring of polishing
- Patent number 11,969,855
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Optical film-thickness measuring apparatus and polishing apparatus
- Patent number 11,951,588
- Issue date Apr 9, 2024
- Ebara Corporation
- Masaki Kinoshita
- G01 - MEASURING TESTING
Information Patent Grant
Consumable part monitoring in chemical mechanical polisher
- Patent number 11,931,860
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Thomas H. Osterheld
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for cleaning process monitoring
- Patent number 11,926,017
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Charlie Wang
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method of cleaning an optical film-thickness measuring system
- Patent number 11,919,048
- Issue date Mar 5, 2024
- Ebara Corporation
- Nobuyuki Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,897,080
- Issue date Feb 13, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system with platen for substrate edge control
- Patent number 11,890,717
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Jay Gurusamy
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,883,922
- Issue date Jan 30, 2024
- Ebara Corporation
- Yuki Watanabe
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS
- Publication number 20250041987
- Publication date Feb 6, 2025
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS FOR MECHANICAL POLISHING
- Publication number 20250018522
- Publication date Jan 16, 2025
- SYBRIDGE TECHNOLOGIES U.S.INC.
- J. Louie MENESES
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
- Publication number 20250010424
- Publication date Jan 9, 2025
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL
- Publication number 20250001546
- Publication date Jan 2, 2025
- GLOBALWAFERS CO., LTD.
- Yung Hsing Chu
- B24 - GRINDING POLISHING
Information Patent Application
EDDY CURRENT SENSOR, EDDY CURRENT SENSOR ASSEMBLY, AND POLISHING AP...
- Publication number 20240399536
- Publication date Dec 5, 2024
- EBARA CORPORATION
- Katsuya MINATOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...
- Publication number 20240383095
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chung Chen
- B24 - GRINDING POLISHING
Information Patent Application
PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING
- Publication number 20240371646
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Jimin ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DETECTING A WRONG WORKPIECE WHICH IS NOT AN OBJECT TO BE...
- Publication number 20240359285
- Publication date Oct 31, 2024
- EBARA CORPORATION
- Yuki WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING END POINT DETECTION METHOD IN POL...
- Publication number 20240342854
- Publication date Oct 17, 2024
- EBARA CORPORATION
- Hiroki NAKAMURA
- B24 - GRINDING POLISHING
Information Patent Application
OPTICAL THICKNESS CONTROL DURING A CHEMICAL MECHANICAL POLISHING PR...
- Publication number 20240308020
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Hsi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20240286242
- Publication date Aug 29, 2024
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240278380
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Shinro OTA
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FO...
- Publication number 20240261929
- Publication date Aug 8, 2024
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ENDPOINT WINDOW
- Publication number 20240253176
- Publication date Aug 1, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Yu-Chung SU
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF CREATING CORRELATION RELATIONAL FORMULA FOR DETERMINING P...
- Publication number 20240246191
- Publication date Jul 25, 2024
- SUMCO CORPORATION
- Yuki NAKANO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240238934
- Publication date Jul 18, 2024
- EBARA CORPORATION
- Shinro OTA
- B24 - GRINDING POLISHING
Information Patent Application
EQUIPMENT, APPARATUS AND METHOD OF CHEMICAL MECHANICAL POLISHING (CMP)
- Publication number 20240227112
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- SEUNGJUN LEE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND METHOD OF MONITORING A POLISHING PROCESS USING TH...
- Publication number 20240227113
- Publication date Jul 11, 2024
- SK enpulse Co., Ltd.
- Joonho AN
- B24 - GRINDING POLISHING
Information Patent Application
LIGHT INTENSITY ADJUSTMENT METHOD FOR OPTICAL FILM THICKNESS MEASUR...
- Publication number 20240207997
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20240207996
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Yasumasa HIROO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD
- Publication number 20240189959
- Publication date Jun 13, 2024
- EBARA CORPORATION
- Keisuke NAMIKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PROCESS APPARATUS
- Publication number 20240181593
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Wonkeun CHO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, AND POLISHING APPARATUS
- Publication number 20240181594
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD OF WORKPIECE
- Publication number 20240165766
- Publication date May 23, 2024
- Disco Corporation
- Mato HATTORI
- B24 - GRINDING POLISHING
Information Patent Application
OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR
- Publication number 20240118070
- Publication date Apr 11, 2024
- EBARA CORPORATION
- Katsuya MINATOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...
- Publication number 20240116152
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL
- Publication number 20240100646
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Jay Gurusamy
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHO...
- Publication number 20240075580
- Publication date Mar 7, 2024
- EBARA CORPORATION
- Toshifumi KIMBA
- B24 - GRINDING POLISHING
Information Patent Application
LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...
- Publication number 20240071841
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sumin PARK
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...
- Publication number 20240062364
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Sivakumar Dhandapani
- G06 - COMPUTING CALCULATING COUNTING

Devices or means for detecting lapping completion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Machine vision as input to a CMP process control algorithm

Polishing pad and method of fabricating semiconductor device using...

Polishing system with capacitive shear sensor

Output signal processing apparatus for eddy current sensor

System using film thickness estimation from machine learning based...

Thickness measurement of substrate using color metrology

Multi-layered windows for use in chemical-mechanical planarization...

Technique for training neural network for use in in-situ monitoring...

Channel cut polishing machine

Polishing apparatus and polishing method

Automated dry-in dry-out dual side polishing of silicon substrates...

Determination of substrate layer thickness with polishing pad wear...

Polishing apparatus, polishing method and method for outputting vis...

Polishing method and polishing apparatus

Optical thickness control during a chemical mechanical polishing pr...

Trained neural network in in-situ monitoring during polishing and p...

Methods of detecting non-conforming substrate processing events dur...

Chemical-mechanical polishing system with a potentiostat and pulsed...

Performing planarization process controls in semiconductor fabrication

Polishing method, polishing agent and cleaning agent for polishing

Motor torque endpoint during polishing with spatial resolution

Single bodied platen housing a detection module for CMP systems

Filtering during in-situ monitoring of polishing

Optical film-thickness measuring apparatus and polishing apparatus

Consumable part monitoring in chemical mechanical polisher

Method and apparatus for cleaning process monitoring

Method of cleaning an optical film-thickness measuring system

Polishing apparatus

Polishing system with platen for substrate edge control

Substrate processing apparatus

Patents Applicationslast 30 patents

POLISHING APPARATUS

SYSTEMS AND METHODS FOR MECHANICAL POLISHING

POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD

DOUBLE-SIDED POLISHING OF SEMICONDUCTOR WAFERS WITH DYNAMIC CONTROL

EDDY CURRENT SENSOR, EDDY CURRENT SENSOR ASSEMBLY, AND POLISHING AP...

MULTI-LAYERED WINDOWS FOR USE IN CHEMICAL-MECHANICAL PLANARIZATION...

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

METHOD OF DETECTING A WRONG WORKPIECE WHICH IS NOT AN OBJECT TO BE...

POLISHING APPARATUS AND POLISHING END POINT DETECTION METHOD IN POL...

OPTICAL THICKNESS CONTROL DURING A CHEMICAL MECHANICAL POLISHING PR...

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

POLISHING METHOD AND POLISHING APPARATUS

DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FO...

POLISHING PAD WITH ENDPOINT WINDOW

METHOD OF CREATING CORRELATION RELATIONAL FORMULA FOR DETERMINING P...

POLISHING APPARATUS AND POLISHING METHOD

EQUIPMENT, APPARATUS AND METHOD OF CHEMICAL MECHANICAL POLISHING (CMP)

POLISHING PAD AND METHOD OF MONITORING A POLISHING PROCESS USING TH...

LIGHT INTENSITY ADJUSTMENT METHOD FOR OPTICAL FILM THICKNESS MEASUR...

SUBSTRATE POLISHING APPARATUS

POLISHING PAD, POLISHING APPARATUS, AND POLISHING METHOD

POLISHING PROCESS APPARATUS

POLISHING METHOD, AND POLISHING APPARATUS

GRINDING METHOD OF WORKPIECE

OUTPUT SIGNAL PROCESSING DEVICE FOR EDDY-CURRENT SENSOR

SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING...

POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL

SURFACE PROPERTY MEASURING SYSTEM, SURFACE PROPERTY MEASURING METHO...

LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...

SYSTEM USING FILM THICKNESS ESTIMATION FROM MACHINE LEARNING BASED...