Flash memory is a non-volatile computer storage technology that can be electrically erased and reprogrammed. Flash memory is typically written in blocks and allocated, garbage collected and erased in larger super blocks or S-Blocks.
Flash memory comprises a plurality of cells, with each cell being configured to store one, two or more bits per cell. SLC is an abbreviation of “Single-Level Cell”, which denotes a configuration in which each cell stores one bit. SLC is characterized not only by fast transfer speeds, low power consumption and high cell endurance, but also by relatively high cost. MLC is an abbreviation of “Multi-level Cell”, which denotes a configuration in which each cell stores two or more bits per cell. The acronym MLC is often used to denote a Flash memory having cells that store two bits per cell. That same acronym MLC is also used, however, to designated Flash memory having cells configured to store three bits per cell (also called “TLC” or Triple or Three Level Cell) or even a greater number of bits per cell. When MLC is used to designate a memory that stores two bits in each cell, such an MLC Flash memory may be characterized by somewhat slower transfer speeds, higher power consumption and lower cell endurance than a Single-Level Cell memory. Such MLC memories, however, enjoy a comparatively lower manufacturing cost per bit than do SLC memories.
In MLC NAND Flash memory, the same physical page of memory cells may be used to store two or more logical pages of data, with each cell being configured to store 2 or more bits. When two bits per cell are stored, a first bit of a lower page is stored first, and then the next bit or bits of one or more higher-order pages are stored. The lower page is programmed first, followed by the higher-order page or pages. When programming the upper page, programming voltages are applied to the same cells that already store valid data in the lower page. Should power fail during the programming of the higher-order page or pages, the stored data in the lower page may be irrecoverably corrupted, as may be the data intended to be stored in the higher-order page or pages. This problem is compounded by the fact that the host may have already received an acknowledgment from the data storage device indicating that the data stored in the lower page has already been saved to the Flash memory.
Within the scope of the present disclosure, the acronym “MLC” expressly denotes a Flash memory comprising cells that store two or more bits per cell. In the case wherein such MLC Flash memory is configured to store two bits per cell, data is stored in a lower page and a corresponding upper page. In the case wherein such MLC Flash memory is configured to store three or more bits per cell, data is stored in a lower page and one or more corresponding higher-order pages. The phrase “higher-order pages” is expressly intended to cover the upper page and/or the upper page and one or more pages of higher order.
The page register 204 may be configured to enable the controller 202 to read data from and store data to the array. According to one embodiment, the array of Flash memory devices may comprise a plurality of non-volatile memory devices in die (e.g., 128 dies), each of which comprises a plurality of blocks, such as shown at 206 in
According to one embodiment, the array of MLC non-volatile memory devices may comprise a plurality of lower pages and a corresponding plurality of higher-order pages. That is, each lower page may be associated with a corresponding single upper page or with a corresponding plurality (i.e., two or more) of higher-order pages. The MLC non-volatile memory devices may be organized in Flash Blocks 206, with each Flash Block comprising a plurality of Flash Pages (F-Pages) 207, as shown in
According to one embodiment, in the normal course of operation of the data storage device 200, as complete F-Pages are constructed (and accumulated in the write store 203 and written out to the buffer 208), they may be written out to the MLC non-volatile memory devices. According to one embodiment, it is the completed F-Pages stored in the write store 203 that are written out to the MLC non-volatile memory devices. Indeed, it may be preferable to write the completed F-Pages out from the write store 203 rather than from the buffer 208, as the write store 203 may be able to support a greater bandwidth than the buffer 208.
According to one embodiment, the buffer 208 may comprise non-volatile memory. For example, the buffer 208 may comprise memory that is non-volatile and that is characterized as having high access, read and write speeds. According to one embodiment, the buffer 208 may comprise Magnetic Random Access Memory (MRAM). Other memory types may also be used. MRAM may exhibit performance that similar to that of SRAM, a density comparable to DRAM and low power consumption. Moreover, MRAM is not known to degrade over time. Although relatively costly, MRAM is well suited to the task of the buffer 208; namely, to store a power-safe copy of lower page data at least until the corresponding higher-order page(s) have been safely stored in the Flash Blocks 206. It is to be noted, however that, as of this writing, the cost of implementing the buffer 208 in MRAM is still less costly than the conventional use of super-capacitors or the use of an array of discrete capacitors. In the implementation in which the buffer 208 comprises non-volatile memory such as MRAM, the data written thereto that has not yet been safely stored in the Flash Blocks 206 (such as lower page data whose corresponding higher-order page(s) were not stored to Flash before a power-fail event) may be read out from the buffer 208 by the controller 202 and stored in the Flash Blocks 206 upon restoration of the power to the data storage device 200. That is, the controller 202 may be further configured to read data from the buffer 208 and write at least a portion of the read data to the non-volatile memory devices of the Flash Blocks 206, after power is restored to the data storage device 200 subsequent to a loss of power thereto.
According to one embodiment, the buffer 208 may be configured to be at least sufficiently large to enable recovery from lower page corruption after a power loss to the data storage device. The size of the buffer 208, therefore, may vary with, for example, the number of pages between lower and higher-order pages, the size of the F-Pages, the number of planes and dies of the data storage device. For example, the size of the buffer 208 may vary from a few MB to a few hundreds of MB, although other implementations may utilize other sizes to good effect. According to one embodiment, the buffer 208 may comprise a plurality of buffers for each die, as each die completes its programming at a different time. This enables multiple pages per die to be managed independently, leading to an efficient configuration of the buffer 208. The buffer 208 may, for example, be implemented as a plurality of buffers from which the controller 202 allocates space, stores data and de-allocates space, as the higher-order page(s) of corresponding lower pages are stored in the Flash Blocks 206. Such a buffer configuration is well suited to buffering the stream of write data from host write commands until the probability of lower page corruption upon power fail is acceptably small or zero. According to one embodiment, the controller 202 may be configured to generate and send a write acknowledgement to the host 218 after (e.g., as soon as) the accumulated data is written to the allocated space in the buffer. That is, from the host's perspective, the data may be considered to have been safely stored in Flash as soon as it is stored in the buffer 208. According to one embodiment, the MLC non-volatile devices may be run in lower-page only mode or in “SLC” mode. In that case, since there are no higher-order pages to contend with, de-allocation of space in the buffer 208 may be carried out as soon as the page in MLC lower-page only mode or the page in SLC mode is programmed and need not be delayed while waiting for any higher-ordered pages to be programmed.
Indeed, during normal operation, as write commands are received from the host 218 and executed by the controller 502, the data to be written to the MLC non-volatile memory devices (i.e., Flash Blocks 206) may be written to both the volatile memory buffer 504 and to the MLC non-volatile memory devices. According to one embodiment, the controller 502 may be configured to accumulate data to be written (as directed by write commands issued by the host 218, for example) internally (in a write store 203, for example) until a complete F-page is constructed. Alternatively and according to one embodiment, a partial F-Page may be packed with a predetermined coded value and considered to be complete. Completed F-Pages may then be written both to the volatile memory buffer 504 and to the MLC non-volatile memory devices. According to one embodiment, the data may also be accumulated, written and stored in units of S-Pages 402 or any other data organization unit. Indeed, the volatile memory buffer 504 may be configured to store write data organized differently than S-Pages 402, depending upon the specific implementation. According to one embodiment, therefore, in addition to writing the accumulated data (or a portion thereof) to volatile memory buffer 504, the accumulated data (or a portion thereof) may be written to one or more lower and/or upper pages of the MLC non-volatile memory devices (the Flash Blocks 206). According to one embodiment, previously-allocated space in the volatile memory buffer 504 may be de-allocated and the de-allocated space therein reused for new write data when all higher-order pages corresponding to a previously-programmed lower page have been written in the MLC non-volatile memory devices and thus may be considered to be effectively corruption-safe. That is, the controller 202 may be configured to keep lower page data in the volatile memory buffer 504 at least until the upper page or high-order pages corresponding to the lower page have been programmed in the MLC non-volatile memory devices.
In the event of a power loss, the backup power source 506 may supply power at least to the controller 502, the volatile memory buffer 504 and/or the non-volatile memory 508. During the time the controller 502, the volatile memory buffer 504 and/or the non-volatile memory 508 are powered by the backup power source 506, the controller 502 may cause data stored in the volatile memory buffer 504 to be copied to the non-volatile memory 508, thereby saving the data that has not yet been saved to the MLC non-volatile memory devices in a corruption safe manner, thereby enabling the controller to acknowledge the write to the host 218. When power to the MLC non-volatile memory devices is restored, the data saved in the non-volatile memory 508 may be programmed into the MLC non-volatile memory devices.
It is to be noted that the non-volatile memory 508 may, according to one embodiment, be written to only in the event of a power failure. Moreover, by powering only the controller 502, the volatile memory buffer 504 and the non-volatile memory 508 in the event of a power failure, comparatively less power is required than would be required to also power the dies of the MLC non-volatile memory devices (e.g., Flash Blocks 206). It is to be noted that the non-volatile memory 508 may draw its power from the controller 502 that is powered by the backup power source 506. According to one embodiment, the non-volatile memory 508 may comprise MRAM. According to one embodiment, the backup power source 506 need only be coupled to the controller 502 and to the volatile memory buffer 504. In addition, by using the volatile memory buffer 504 as the primary write location in the data path and the non-volatile memory 508 in the event of a power failure, the wear on the non-volatile memory 508 is reduced.
According to one embodiment and as shown in
As shown in and described relative to
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the present disclosure. Indeed, the novel methods, devices and systems described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the present disclosure. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the present disclosure. For example, those skilled in the art will appreciate that in various embodiments, the actual structures may differ from those shown in the figures. Depending on the embodiment, certain of the steps described in the example above may be removed, others may be added. Also, the features and attributes of the specific embodiments disclosed above may be combined in different ways to form additional embodiments, all of which fall within the scope of the present disclosure. Although the present disclosure provides certain preferred embodiments and applications, other embodiments that are apparent to those of ordinary skill in the art, including embodiments which do not provide all of the features and advantages set forth herein, are also within the scope of this disclosure. Accordingly, the scope of the present disclosure is intended to be defined only by reference to the appended claims.
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