Methods and devices for testing immersion cooling controllers

Information

  • Patent Grant
  • 11785747
  • Patent Number
    11,785,747
  • Date Filed
    Wednesday, November 2, 2022
    2 years ago
  • Date Issued
    Tuesday, October 10, 2023
    a year ago
Abstract
The present disclosure refers to methods and electronics used to test immersion cooling controllers. A representative method comprises operably connecting a simulator device to an immersion cooling controller. The simulator device is used to communicate one or more changes to the immersion cooling controller wherein the one or more changes relate to one or more sensed parameters of an immersion cooling system. The reaction of the controller to the one or more changes is compared to an expected reaction of the controller to determine whether the controller is functioning properly. The controller may be configured to control any parameter of an immersion cooling system including, but not limited to, temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is related to PCT publication WO2020/102090 filed Nov. 11, 2019 titled “Liquid Immersion Cooling Platform” owned by TMGCore, LLC which application is incorporated herein by reference.


FIELD OF THE DISCLOSURE

The present disclosure relates to testing methods using, for example, electronic equipment to test controllers used in a liquid immersion cooling system for computer components.


BACKGROUND AND SUMMARY

Immersion cooling, e.g., two-phase immersion cooling, is becoming more common as computing power increases and heat from computing components needs to be dissipated. In immersion cooling computer components and other electronics may be submerged in a dielectric or electrically non-conductive liquid in order to draw heat directly from the component into the liquid. Immersion cooling is used to reduce the total energy needed to cool computer components and may also reduce the amount of space and equipment necessary for adequate cooling.


As immersion cooling become more common the systems become more complex and controllers may be programmed to control and adjust various parameters of the system. Unfortunately, one may risk damaging valuable computer components or other components of an immersion cooling system when testing whether a controller is functioning as intended


What is needed is a solution so that immersion cooling controllers may be tested without risking harm to computer components or other equipment of the immersion cooling system. It would further be desirable if such a solution was not particularly costly, was applicable to many immersion cooling system controllers, and/or was relatively easy to implement.


Advantageously, the instant application pertains to new methods and devices which allows for testing of immersion cooling controllers outside of an immersion cooling system and is broadly applicable to many immersion cooling system controllers.


The method comprises operably connecting a simulator device to an immersion cooling controller. The simulator device is used to communicate one or more changes to the immersion cooling controller wherein the one or more changes relate to one or more sensed parameters of an immersion cooling system. The reaction of the controller to the one or more changes is compared to an expected reaction of the controller to determine whether the controller is functioning properly. The controller may be configured to control any parameter of an immersion cooling system including, but not limited to, temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof.


These and other objects, features and advantages of the exemplary embodiments of the present disclosure will become apparent upon reading the following detailed description of the exemplary embodiments of the present disclosure, when taken in conjunction with the appended claims.





BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present disclosure, together with further objects and advantages, may best be understood by reference to the following description taken in conjunction with the accompanying drawings.



FIG. 1 shows a schematic of an immersion cooling system.



FIG. 2 shows a representative manual control panel for a simulator device.



FIG. 3 shows a representative SS relay that may be used in the simulator device.





DETAILED DESCRIPTION

The following description of embodiments provides a non-limiting representative examples referencing numerals to particularly describe features and teachings of different aspects of the invention. The embodiments described should be recognized as capable of implementation separately, or in combination, with other embodiments from the description of the embodiments. A person of ordinary skill in the art reviewing the description of embodiments should be able to learn and understand the different described aspects of the invention. The description of embodiments should facilitate understanding of the invention to such an extent that other implementations, not specifically covered but within the knowledge of a person of skill in the art having read the description of embodiments, would be understood to be consistent with an application of the invention.


Immersion Cooling Systems


The methods and devices described herein are broadly applicable to testing immersion cooling system controllers regardless of the specific system. For ease of reference the methods and devices will be described with reference to controllers used in a two phase immersion cooling system. FIG. 1 shows a schematic of a representative immersion cooled computing system 110. Embodiments of the disclosed cooled computing system 110 (or computing system, system, vessel, or pressure controlled vessel, all of which can be used interchangeably) may utilize a liquid dielectric fluid 140 to cool computer component 170 by immersing the component into a bath of the fluid. As electricity is passed through the component 170, the component 170 generates heat. As the component 170 heats up, the performance of the component may be reduced or the component may be damaged to the point of failure. It is advantageous to maintain the various computing components at a stable and relatively low temperature. In some embodiments, computer component 170 may be kept at less than about 80° C., or less than about 70° C., or less than about 65° C., or less than about 60° C., or less than about 55° C. In some embodiments, computer component 170 may be maintained at greater than about 60° C., or greater than about 50° C., or greater than about 40° C., or greater than about 35° C., or greater than about 30° C. As the computer component 170 heats up, heat is transferred to the liquid dielectric fluid 140 surrounding the component 170. When the liquid dielectric fluid reaches its boiling point, it will shift from a liquid phase into a gaseous phase and rise out of the liquid bath 142. The components 170 in the bath 142 of dielectric fluid may generally be maintained at about the boiling point of the particular dielectric fluid 140 being used.


When the liquid dielectric fluid is heated to the point of vaporization at the pressure employed for a given application and becomes a gas, bubbles of the dielectric vapor will rise out of the liquid bath 142 and rise to the top of the system 110. The vapor is then cooled to be point of condensing using condenser 130. Depending on the configuration of the system 110, the heating and cooling of dielectric fluid from liquid phase to vapor phase and back, can create a convection current.


Sensors


It is often desirable to monitor one or more parameters of an immersion cooling system such as a two phase immersion cooling system. One or more parameters may be monitored through use of various sensors may be placed to ensure that the system is operating as designed. The number and type of sensors may be modified based on the type of system, user preference, and other factors. In some embodiments for a two phase immersion cooling system a sensor package may include one or more temperature sensors in the vapor space; one or more temperature sensors in the liquid space; one or more humidity sensors in the vapor space; and/or one or more pressure sensors in the vapor space. These sensor readings may be monitored by software operably connected to the controller and/or by human operators to ensure that the system is operating as desired. In some embodiments, the sensor data may be recorded or later analyzing.


Additional sensors may be incorporated within the vessel or the super structure of a two phase immersion cooling system. Such sensors could include, for example, FLIR based heat imaging cameras; VESDA or other forms of aspirating smoke detectors; and/or refrigerant leak detectors designed to detect a leak of the dielectric fluid into the surrounding environment.


In some systems the pressure controlled vessel 110 may include sensors to ensure safe operation. These sensors may include, but are not limited to, one or more of temperature sensors, fluid level sensors, pressure sensors 180, gaseous partial pressure sensors, position sensors, electrical sensors, microphones, and/or cameras to ensure and/or automate operations of the system.


Temperature sensors may include, but not limited to, sensors for measuring the temperature of the gaseous phase within the pressure controlled vessel 110, sensors for measuring the temperature of the liquid phase within the pressure controlled vessel, sensors for measuring the temperature water and/or other process fluids, and/or sensors for measuring the temperature of the other components including the computer components 170. In some systems, thermocouples, thermistors, and/or silicone sensors may be utilized to measure the temperature of computer components. In some embodiments, the system may rely on information provided by the components themselves and retrieved or monitored through the use of a generally accepted communications protocol, such as a device provided API or other programmatic interface, such JSON via HTTPT or SNMP, to determine the equipment temperature.


Immersion Cooling Controllers


The controllers that may be tested using the methods and devise herein may be configured with or without software and may be configured to receive any data generated by any of the sensors described above and make an adjustment, provide an alert, and/or take another appropriate action. Thus, a controller may be configured to adjust or control a heating element, adjust water flow or temperature, adjust a pressure, adjust a fluid level, fluid purity and/or any number of other system parameters. Such adjustments are often based on one or more sensed parameters of an immersion cooling system such as any of those described above.


Simulator Device


The present application employs a simulator device that is operably connect to an immersion cooling controller. In this manner the controller can be tested without being employed in an immersion cooling system. The simulator device is configured to communicate one or more simulated changes in the operation of an immersion cooling system to the immersion cooling controller. That is, the simulator device mimics a signal that the controller would receive if it was employed in an immersion cooling system even though it is being tested without being connected to an immersion cooling system. The one or more changes from the simulator device may simulate one or more sensed parameters of an immersion cooling system. The one or more sensed parameters may be any of those associated with any of the sensors described above that could be within an immersion cooling system, e.g., temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof. In order to determine whether the controller is functioning properly one may compare a reaction of the controller to the one or more changes to an expected reaction of the controller, i.e., the desired programmed response. In this manner one may determine whether the controller is functioning properly.



FIG. 2 shows a representative manual control panel for a simulator device. The manual control panel may be used to adjust various simulated sensed parameters and communicate the simulated changes in the operation of an immersion cooling system to the immersion cooling controller.



FIG. 3 shows a representative solid state relay switch that may be used in the simulator device. The relay may facilitate opening and/or closing one or more circuits electromechanically or electronically, Such switches, if employed, may assist in simulating one or more sensed parameters or change in parameters of an immersion cooling system and communicating the sensed or changed parameters to the controller.


In the preceding specification, various embodiments have been described with references to the accompanying drawings. It will, however, be evident that various modifications and changes may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the claims that follow. The specification and drawings are accordingly to be regarded as an illustrative rather than restrictive sense.

Claims
  • 1. A method of testing an immersion cooling controller comprising: operably connecting a simulator device to an immersion cooling controller;using the simulator device to communicate one or more changes to the immersion cooling controller wherein the one or more changes relate to one or more sensed parameters of an immersion cooling system; andcomparing a reaction of the controller to the one or more changes to an expected reaction of the controller to determine whether the controller is functioning properly;wherein the controller is configured to control one or more of temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof in an immersion cooling system.
  • 2. The method of claim 1 wherein the one or more sensed parameters comprise temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof.
US Referenced Citations (84)
Number Name Date Kind
7213391 Jones May 2007 B2
7885070 Campbell et al. Feb 2011 B2
7957145 Suzuki et al. Jun 2011 B2
7961475 Campbell et al. Jun 2011 B2
8009419 Attlesey et al. Aug 2011 B2
8014150 Campbell et al. Sep 2011 B2
8089765 Attlesey Jan 2012 B2
8194406 Campbell et al. Jun 2012 B2
8351206 Campbell et al. Jan 2013 B2
8490418 Weber et al. Jul 2013 B2
8711565 Wagoner et al. Apr 2014 B2
8867209 Campbell et al. Oct 2014 B2
8941994 Campbell et al. Jan 2015 B2
8947873 Campbell et al. Feb 2015 B2
8953317 Campbell et al. Feb 2015 B2
8953320 Campbell et al. Feb 2015 B2
8964391 Campbell et al. Feb 2015 B2
8966922 Campbell et al. Mar 2015 B2
8976526 Kulkarni et al. Mar 2015 B2
9049800 Shelnutt et al. Jun 2015 B2
9095942 Campbell et al. Aug 2015 B2
9101078 Campbell et al. Aug 2015 B2
9144179 Shelnutt et al. Sep 2015 B2
9153374 Kulkarni et al. Oct 2015 B2
9178400 Pal et al. Nov 2015 B2
9195282 Shelnutt et al. Nov 2015 B2
9223360 Attlesey et al. Dec 2015 B2
9261308 Campbell et al. Feb 2016 B2
9282678 Campbell et al. Mar 2016 B2
9313920 Campbell et al. Apr 2016 B2
9328964 Shelnutt et al. May 2016 B2
9332674 Campbell et al. May 2016 B2
9351429 Shelnutt et al. May 2016 B2
9357675 Campbell et al. May 2016 B2
9414520 Campbell et al. Aug 2016 B2
9433132 Krishnan et al. Aug 2016 B2
9516792 Krishnan Dec 2016 B2
9543787 Duchesneau Jan 2017 B2
9596787 Iyengar et al. Mar 2017 B1
9622379 Campbell et al. Apr 2017 B1
9655279 Pelletier et al. May 2017 B2
9713290 James et al. Jul 2017 B2
9773526 Shelnutt et al. Sep 2017 B2
9904811 Campbell et al. Feb 2018 B2
9912021 Andres Mar 2018 B2
9913402 Shafer et al. Mar 2018 B2
9918408 Regimbal et al. Mar 2018 B2
9921622 Shelnutt et al. Mar 2018 B2
9974212 Ichinose et al. May 2018 B2
9992914 Best et al. Jun 2018 B2
10015905 Watanabe et al. Jul 2018 B2
10018425 Shelnutt et al. Jul 2018 B2
10020242 Katsumata et al. Jul 2018 B2
10028409 Metzler et al. Jul 2018 B1
10070558 Campbell et al. Sep 2018 B2
10098260 Bouras et al. Oct 2018 B2
10104814 Wagoner et al. Oct 2018 B2
10130008 Shepard et al. Nov 2018 B2
10149408 Fujiwara et al. Dec 2018 B2
10206307 Lau Feb 2019 B2
10206308 Meijer et al. Feb 2019 B2
10257960 Banerjee et al. Apr 2019 B1
10321603 Banerjee et al. Jun 2019 B1
10485137 Helsel et al. Nov 2019 B2
10512192 Miyoshi Dec 2019 B2
10568236 Tian et al. Feb 2020 B2
10609839 Archer et al. Mar 2020 B1
10765033 Keehn et al. Sep 2020 B1
10966349 Lau Mar 2021 B1
11076508 Gao Jul 2021 B2
11116113 Chiu et al. Sep 2021 B2
20140139251 De La Puente May 2014 A1
20170212164 Caradonna Jul 2017 A1
20180264281 Kim Sep 2018 A1
20190267683 Shepard et al. Aug 2019 A1
20190357378 Kolar et al. Nov 2019 A1
20200113083 Schon et al. Apr 2020 A1
20200178414 Bulinski et al. Jun 2020 A1
20200386488 Smith et al. Dec 2020 A1
20210018356 Bean, Jr. et al. Jan 2021 A1
20210059079 Keehn et al. Feb 2021 A1
20210084790 Sachdev et al. Mar 2021 A1
20210180874 Eadelson Jun 2021 A1
20220117114 Farias Moguel Apr 2022 A1
Foreign Referenced Citations (4)
Number Date Country
2019138176 Jul 2019 WO
2020225649 Nov 2020 WO
2021111296 Jun 2021 WO
2019155179 Aug 2022 WO
Related Publications (1)
Number Date Country
20230240050 A1 Jul 2023 US
Provisional Applications (6)
Number Date Country
63274759 Nov 2021 US
62981098 Feb 2020 US
62897457 Sep 2019 US
62875222 Jul 2019 US
62815682 Mar 2019 US
62768633 Nov 2018 US
Continuations (3)
Number Date Country
Parent 17136113 Dec 2020 US
Child 17370237 US
Parent 17979539 US
Child 17370237 US
Parent PCT/US2019/060759 Nov 2019 US
Child 17136474 US
Continuation in Parts (3)
Number Date Country
Parent 17573319 Jan 2022 US
Child 17979539 US
Parent 17370237 Jul 2021 US
Child 17573319 US
Parent 17136474 Dec 2020 US
Child 17979539 US