Claims
- 1. A method of manufacturing a die package, comprising:
positioning a die assembly in a mold, wherein the die assembly is configurable to eject ink drops in an ink jet printer; contacting interface areas of the die assembly with the mold; distributing a flowable insulative material into the mold; and, exposing the flowable insulative material to conditions effective to render the flowable insulative material into a generally non-flowable state.
- 2. The method of claim 1, wherein said contacting interface areas comprises contacting fluid handling interface areas of the die assembly.
- 3. The method of claim 1, wherein distributing a flowable insulative material into the mold comprises injecting a thermoplastic material into the mold.
- 4. The method of claim 1 further comprising subsequent to said exposing, making connections to said interface areas, distributing a flowable insulative material over at least portions of said die package and exposing the flowable insulative material to conditions effective to render the flowable insulative material into a generally non-flowable state.
- 5. A method of forming die packages, comprising:
contacting interface areas of at least one die assembly; and, embedding at least portions of the at least one die assembly in an insulative material so that said interface areas remain free of the insulative material.
- 6. The method of claim 5, wherein contacting interface areas comprises contacting electrical interface areas.
- 7. The method of claim 5, wherein contacting interface areas comprises contacting fluid handling interface areas.
- 8. The method of claim 5, wherein contacting interface areas comprises contacting electrical interface areas and fluid handling interface areas.
- 9. The method of claim 5, wherein said contacting comprises contacting with a mold.
- 10. The method of claim 9, wherein said embedding comprises injecting a generally flowable insulative material into said mold, and exposing said generally flowable insulative material to conditions to cause it to become generally non-flowable.
- 11. The method of claim 5 further comprising subsequent to said embedding, making connections to said interface areas, and embedding at least portions of the die package and said connections in an insulative material.
- 12. A method of forming die packages, comprising:
contacting interface areas of a die assembly to keep the interface areas free of an insulative material; and, distributing a flowable insulative material around at least portions of said die assembly.
- 13. The method of claim 12 further comprising subsequent to said distributing, exposing the flowable insulative material to conditions effective to render the flowable insulative material to a generally non-flowable state.
- 14. The method of claim 13, further comprising subsequent to said exposing, making connections to said interface areas, distributing a flowable insulative material over at least portions of said die package and exposing the flowable insulative material to conditions effective to render the flowable insulative material into a generally non-flowable state.
- 15. The method of claim 12, wherein contacting interface areas of a die assembly comprises contacting interface areas of a die assembly with a mold.
- 16. The method of claim 12, wherein contacting interface areas of a die assembly comprises contacting electrical interface areas of a die assembly.
- 17. The method of claim 12, wherein contacting interface areas of a die assembly comprises contacting fluid interface areas of a die assembly.
- 18. The method of claim 12, wherein contacting interface areas of a die assembly comprises contacting electrical interface areas and fluid interface areas of a die assembly.
- 19. A method, comprising:
contacting at least a fluid receiving portion of a print head die assembly with a mold; and, distributing a generally flowable insulative material around at least portions of the print head die assembly to form a die package.
- 20. The method of claim 19 further comprising, prior to said act of distributing, contacting a fluid ejecting portion of the print head die assembly with the mold.
- 21. The method of claim 19 further comprising, prior to said act of distributing, contacting an electrical interface portion of the print head die assembly with the mold.
- 22. A method, comprising:
contacting a first interface area of a die assembly with a first portion of a tool; contacting a second interface area of the die assembly with a second portion of the tool; and, forming a die package by distributing a generally flowable insulative material around at least portions of the die assembly.
RELATED APPLICATIONS
[0001] This application is a continuation application of, and claims priority from, U.S. patent application Ser. No. 10/001,679 titled “Methods and Systems for Forming a Die Package” filed on Oct. 31, 2001, the disclosure of which is incorporated by reference herein.
Continuations (1)
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Number |
Date |
Country |
Parent |
10001679 |
Oct 2001 |
US |
Child |
10741253 |
Dec 2003 |
US |