Claims
- 1. A method for preparing metallic nanometer scale wires comprising the steps of
electrodepositing a metal at a step edge present on a stepped surface to form a wire, and removing the wire off of the stepped surface.
- 2. The method of claim 1 wherein the electrodepositing step includes electrodepositing metal from an aqueous solution including a desired metal.
- 3. The method of claim 2 wherein the electrodepositing step includes applying a nucleation pulse to the aqueous solution.
- 4. The method of claim 3 wherein the electrodepositing step further includes applying a deposition potential to the aqueous solution.
- 5. The method of claim 4 wherein the over potential corresponding to the deposition potential is less than about −400 millivolts.
- 6. The method of claim 1 further comprising the step of embedding the wire in a film of material.
- 7. The method of claim 6 wherein the film of material comprises a polymer.
- 8. The method of claim 6 wherein the removing step includes lifting the film and embedded wire off of the stepped surface.
- 9. A method for preparing metallic nanowires comprising the steps of
electrodepositing metal oxide at step edges present on a stepped surface to form a metal oxide wire, reducing the metal oxide wire to a metal wire, and removing the metal wire from the stepped surface.
- 10. The method of claim 9 wherein the electrodepositing step includes electrodepositing metal oxide particles from an aqueous solution including a desired metal oxide.
- 11. The method of claim 10 wherein the electrodepositing step includes applying a deposition potential to the solution.
- 12. The method of claim 11 wherein the over potential corresponding to the deposition potential is less than −900 millivolts.
- 13. The method of claim 9 wherein the reducing step includes reducing the metal oxide wire to a metal wire via gas phase reduction.
- 14. The method of claim 13 wherein the reducing step includes reducing the metal oxide wire in hydrogen gas.
- 15. The method of claim 13 wherein the reducing step includes reducing the metal oxide wire at about 500° C.
- 16. The method of claim 9 further comprising the step of embedding the metal wire in a film of material.
- 17. The method of claim 16 wherein the film of material comprises a polymer.
- 18. The method of claim 16 wherein the removing step includes lifting the film and embedded wire off of the stepped surface.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of Ser. No. 09/976,990, which claims priority of Provisional U.S. patent application Ser. No. 60/306,715 and Provisional U.S. Patent Application Serial No. 60/317,862, which applications are fully incorporated herein by reference.
Government Interests
[0002] This invention was made with Government support under contract no. DMR-9876479. The government has certain rights in this invention.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60306715 |
Jul 2001 |
US |
|
60317862 |
Sep 2001 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09976990 |
Oct 2001 |
US |
Child |
10861821 |
Jun 2004 |
US |