Patent Grant
7396484
1. Field of the Invention
The invention relates to ophthalmic and other types of surgical and non-surgical use blades and mechanical devices. More particularly, the invention relates to ophthalmic, micro-surgical and non-surgical blades and mechanical devices manufactured from single crystal silicon and other single or poly-crystalline materials, and processes for manufacture and strengthening of the aforementioned mechanical devices, surgical and non-surgical blades.
2. Description of the Related Art
Existing surgical blades are manufactured via several different methodologies, each method having its own peculiar advantages and disadvantages. The most common method of manufacture is to mechanically grind stainless steel. The blade is subsequently honed (through a variety of different methods such as ultrasonic slurrying, mechanical abrasion and lapping) or is electrochemically polished to achieve a sharp edge. The advantage of these methods is that they are proven, economical processes to make disposable blades in high volume. The greatest disadvantage of these processes is that the edge quality is variable, such that achieving superior sharpness consistency is still a challenge. This is primarily due to the inherent limitations of the process itself. Blade edge radii can range from 30 nm to 1000 nm.
A relatively new method of blade manufacture employs coining of the stainless steel in lieu of grinding. The blade is subsequently electrochemically polished to achieve a sharp edge. This process has been found to be more economical than the grinding method. It has also been found to produce blades with better sharpness consistency. The disadvantage of this method is that the sharpness consistency is still less than that achieved by the diamond blade manufacturing process. The use of metal blades in soft tissue surgery is prevalent today due to their disposable cost and their improved quality.
Diamond blades are the gold standard in sharpness in many surgical markets, especially in the ophthalmic surgery market. Diamond blades are known to be able to cleanly cut soft tissue with minimal tissue resistance. The use of diamond blades is also desired due to their consistent sharpness, cut after cut. Most high-volume surgeons will use diamond blades since the ultimate sharpness and sharpness variability of metal blades is inferior to that of diamond. The manufacturing process used to make diamond blades employs a lapping process to achieve an exquisitely sharp and consistent edge radius. The resultant blade edge radii range from 5 nm to 30 nm. The disadvantage of this process is that it is slow and as a direct result, the cost to manufacture such diamond blades ranges from $500 to $5000. Therefore, these blades are sold for reuse applications. This process is currently used on other, less hard materials, such as rubies and sapphires, to achieve the same sharpness at a lesser cost. However, while less expensive than diamonds, ruby and/or sapphire surgical quality blades still suffer from the disadvantage that the cost of manufacture is relatively high, ranging from $50 to $500, and their edges only last through about two hundred cases. Therefore, these blades are sold for reuse and limited reuse applications.
There have been a few proposals for the manufacture of surgical blades using silicon. However, in one form or another, these processes are limited in their ability to manufacture blades in various configurations and at a disposable cost. Many of the silicon blade patents are based on anisotropic etching of silicon. The anisotropic etching process is one where the etching is highly directional, with different etch rates in different directions. This process can produce a sharp cutting edge. However, due to the nature of the process, it is limited by the blade shapes and included bevel angles that can be attained. Wet bulk anisotropic etching processes, such as those employing potassium hydroxide (KOH), ethylene-diamine/pyrcatechol (EDP) and trimethyl-2-hydroxethylammonium hydroxide (TMAH) baths, etch along a particular crystalline plane to achieve a sharp edge. This plane, typically the (111) plane in silicon <100>, is angled 54.7° from the surface plane in the silicon wafers. This creates a blade with an included bevel angle of 54.7°, which has been found to be clinically unacceptable in most surgical applications as too obtuse. This application is even worse when this technique is applied to making double bevel blades, for the included bevel angle is 109.4°. The process is further limited to the blade profiles that it can produce. The etch planes are arranged 90° to each other in the wafer. Therefore, only blades with rectangular profiles can be produced.
In the methods described in greater detail below for manufacturing surgical and non-surgical blades and other mechanical devices from silicon, it is possible that mechanical damage can be induced into the brittle silicon material during one or more of the machining steps. Cracks, chips, scratches and sharp edges all act as crack initiation points in brittle materials. These points serve to initiate catastrophic failure of mechanical devices when they are loaded or stressed.
Other methods are well known to produce sharpened edges in blades formed from wafers in which a photomask is used along with an isotropic wet or dry etch to etch through the wafer to form an ophthalmic blade geometry and the cutting edge. In this process the entire perimeter of the blade etches through and forms a sharpened edge. This thru-etching occurs only while an etch mask is in place. The mask defines approximately where the cutting edges will be created. The mask is then removed and the blades float free when their carrier is dissolved (requiring an additional die level cleaning step). This is both inefficient and ineffective for volume production of high quality, defect free ophthalmic blades. It is inefficient because it adds steps to the manufacturing process.
There are also significant cutting edge geometry constraints inherent to this process. The bevel created by this process is limited to an inefficient 45° for a single bevel blade and an impractical 90° for a double bevel blade. Further, the width of the bevel is severely constrained by the process to a maximum of one times the thickness of the wafer for a single bevel blade and one-half the thickness of the wafer for a double bevel blade. These geometries result in a poor cutting tool as evidenced by a lack of adoption in the ophthalmic community.
Thus, a need exists to manufacture blades that address the shortcomings of the methods discussed above. This system and method of the present invention can make blades with the sharpness of diamond blades at the disposable cost of the stainless steel methods. In addition, the system and method of the present invention can produce blades in high volume and with tight process control. Further, the system and method of the present invention can produce surgical and various other types of blades with both linear and non-linear blade bevels. Still further, the system and method of the present invention can remove the mechanical damage induced into the silicon crystalline material when blades (surgical or non-surgical) or other mechanical devices are manufactured according to the processes described herein.
The above described disadvantages are overcome and a number of advantages are realized by the present invention which relates to a system and method for the manufacturing of surgical blades from a crystalline or poly-crystalline material, such as silicon, which provides for the machining of trenches in a crystalline or poly-crystalline wafer, by various means, at any desired bevel angle or blade configuration. The machined crystalline or poly-crystalline wafers are then immersed in an isotropic etching solution which uniformly removes layer after layer of molecules of the wafer material, in order to form a cutting edge of uniform radius, and of sufficient quality for soft tissue surgery applications. The system and method of the invention provides a very inexpensive means for the manufacture of such high quality surgical blades.
It is therefore an object of the invention to provide a method for manufacturing a surgical blade, comprising the steps of mounting a silicon or other crystalline or poly-crystalline wafer on a mounting assembly, machining one or more trenches on a first side of the crystalline or poly-crystalline wafer with a router, to form either linear or non-linear trenches, etching the first side of the crystalline or poly-crystalline wafer to form one or more surgical blades, singulating the surgical blades, and assembling the surgical blades.
It is a further object of the invention to provide a method for manufacturing a surgical blade, comprising the steps of mounting a crystalline or poly-crystalline wafer on a mounting assembly, machining one or more trenches on a first side of the crystalline or poly-crystalline wafer with a router, to form either linear or non-linear trenches, coating the first side of the crystalline or poly-crystalline wafer with a coating, dismounting the crystalline or poly-crystalline wafer from the mounting assembly, and remounting the first side of the crystalline or poly-crystalline wafer on the mounting assembly, machining a second side of the crystalline or poly-crystalline wafer, etching the second side of the crystalline or poly-crystalline wafer to form one or more surgical blades, singulating the surgical blades, and assembling the surgical blades.
It is still a further object of the invention to provide a method for manufacturing a surgical blade, comprising the steps of mounting a crystalline or poly-crystalline wafer on a mounting assembly, machining one or more trenches on a first side of the crystalline or poly-crystalline wafer with a router, to form either linear or non-linear trenches, dismounting the crystalline or poly-crystalline wafer from the mounting assembly, and remounting the first side of the crystalline or poly-crystalline wafer on the mounting assembly, machining a second side of the crystalline or poly-crystalline wafer with a router, to form either linear or non-linear trenches, etching the second side of the crystalline or poly-crystalline wafer to form one or more surgical blades, converting a layer of the crystalline or poly-crystalline material to form a hardened surface, singulating the surgical blades, and assembling the surgical blades.
It is yet another object of the invention to provide several exemplary embodiments of surgical blades for ophthalmic, microsurgical, heart, eye, ear, brain, re-constructive and cosmetic surgical and biological uses, as well as various non-medical or non-biological uses manufactured in accordance with the methods described herein.
It is still another object of the invention to provide a system and method for increasing the strength of mechanical devices and surgical and non-surgical blades manufactured from single or poly-crystalline materials, including silicon, according to one or more of the processes described herein.
It is therefore an object of the present invention to provide a method based on an isotropic and an anisotropic etching methods that has none of the prior art deficiencies, and all the advantages discussed herein. This method allows complex blade geometries to be formed including, but not limited to, single and double bevel varieties of slit knives, trapezoidal knives, chisel knives among others. The aforementioned methods of manufacturing blades using the isotropic etching process according to several embodiments of the present invention are constrained by the availability of accurate mechanical methods to form the V-grooves that will eventually become the cutting edges of the blades. The method according to an embodiment of the present invention creates the V-grooves without adding any mechanical stresses to the wafer. By using a combination of photomasking, wet etching (isotropic and anisotropic) and dry etching (isotropic and anisotropic, including reactive ion etching) the V-grooves can be formed in an unlimited number of two-dimensional geometries and with excellent control over the preformed bevel angle. Once the initial V-grooves (or trenches) have been formed, the trenched wafers are then subjected to maskless wet isotropic etching process described herein. A final blade geometry and ultra sharp cutting edges can then be created.
The novel features and advantages of the present invention will best be understood by reference to the detailed description of the preferred embodiments which follows, when read in conjunction with the accompanying drawings, in which:
The various features of the preferred embodiments will now be described with reference to the drawing figures, in which like parts are identified with the same reference characters. The following description of the presently contemplated best mode of practicing the invention is not to be taken in a limiting sense, but is provided merely for the purpose of describing the general principles of the invention.
The system and method of the present invention provides for the manufacture of surgical blades to be used for incising soft tissue. Although the preferred embodiment is shown to be a surgical blade, numerous cutting devices can also be fabricated in accordance with the methods discussed in detail below. Therefore, it will be apparent to one skilled in the art of the invention that although reference is made to “surgical blades” throughout these discussions, numerous other types of cutting devices can be fabricated, including, for example, medical razors, lancets, hypodermic needles, sample collection cannula and other medical sharps. Additionally, the blades manufactured according to the system and method of the present invention can be used as blades in other, non-medical uses, including, for example, shaving and laboratory uses (i.e., tissue sampling). Additionally, although reference is made throughout the discussions below to ophthalmic use, numerous other types of medical uses include, but are not limited to, eye, heart, ear, brain, cosmetic and re-constructive surgeries.
Although well known to those skilled in the art, the terms single bevel, double bevel and facets shall be defined. A single bevel refers to one bevel on a blade, where the resulting sharp cutting edge is on the same plane as the blade's primary surface. See, for example,
An additional industry term and parameter well known to those skill in the art is the edge radius of the blade. The “cutting radius” or “edge radius” is the radius of the sharpened edge that cuts the skin, eye (in the case of ophthalmic uses) or other materials/substances. If, for example, a surgeon is using a blade to cut or incise an eye of a patient, it is very important, if not critical, that the blade used be as sharp as possible.
The base material that the blades will be manufactured from is single crystal silicon with a preferred crystal orientation. However, other orientations of silicon are suitable, as well as other materials that can be isotropically etched. For example, silicon wafers with orientation <110> and <111> can also be used, as well as silicon wafers doped at various resistivity and oxygen content levels. Also, wafers made of other materials can be used, such as silicon nitride and gallium arsenide. Wafer form is one particularly useful format for the base material. In addition to single crystal materials, poly-crystalline materials can also be used to manufacture surgical blades. Examples of these poly-crystalline materials include polycrystalline silicon. It will be understood that the term “crystalline” as used herein will be used to refer to both single crystal and poly-crystalline materials.
Therefore, it will be apparent to one skilled in the art of the invention that although reference is made to “silicon wafers” throughout these discussions, any of the aforementioned materials in combination with various orientations can be used in accordance with the various embodiments of the present invention, as well as other suitable materials and orientations that might become available.
For example, although
The method of
Referring again to
Silicon wafer 202 is ablated by the laser beam 404. The ability of the laser beam 404 to ablate the silicon wafer 202 is related to the laser's wavelength λ. In one embodiment, which uses a silicon wafer, the wavelength that yields the best results is 1064 nano-meters, typically provided by a YAG laser, though other types of lasers can be used as well. If a different crystalline or poly-crystalline material is used, then other wavelengths and laser types may be more appropriate.
The resultant through-hole fiducials 406 (a plurality of holes can be cut in this manner) can be used as guides for machining trenches (discussed in detail with respect to step 1008 below), especially if a dicing saw blade is to be used to machine the trenches. Through-hole fiducials 406 can also be cut by any laser beam (e.g., an excimer laser or laser waterjet 402) for the same purpose. The pre-cut through-hole fiducials are typically cut in the shape of a plus “+” or a circle. However, the choice of through-hole fiducial shape is directed by the specific manufacturing tools and environment, and thus need not be limited to just the two aforementioned shapes.
In addition to the use of a laser beam to pre-cut through-hole fiducials, other mechanical machining methods can also be used. These include, for example, but are not limited to, drilling tools, mechanical grinding tools and an ultra-sonic machining tool 100. While use of the devices is novel with respect to the embodiments of the invention, the devices and their general use are well known to those skilled in the art.
Precutting can be performed to silicon wafer 202 prior to machining trenches in order for silicon wafer 202 to maintain its integrity and not fall apart during the etching process. A laser beam (e.g., a laser waterjet 402 or excimer laser) can be used to scroll in elliptical through-hole slots for the dicing blade 502 (discussed in detail in reference to
Referring again to
The methods for machining can employ either a dicing saw blade, laser system, an ultrasonic machining tool, a hot-forging process or a router. Other methods for machining can also be used. Each will be discussed in turn. The trench that is machined by any of these methods provides the angle (bevel angle) of the surgical blade. As the trench machine operates on silicon wafer 202, silicon material is removed, either in the shape of the dicing saw blade, the pattern formed by the excimer laser, or the pattern formed by an ultrasonic machining tool, in the desired shape of the surgical blade preform. In the case of a dicing saw blade, the silicon surgical blades will have only straight edges; in the latter two methods, the blades can be essentially any shape desired. In the case of a hot-forging process, the silicon wafer is heated to make it malleable, then pressed between two die, each one having a three dimensional form of the desired trenches to be “molded” into the heated, malleable silicon wafer. For purposes of this discussion, “machining” trenches encompasses all methods of manufacturing trenches in a silicon wafer, including those mentioned specifically, whether by a dicing saw blade, excimer laser, ultrasonic machine or a hot-forging process, and equivalent methods not mentioned. These methods of machining the trenches will now be discussed in detail.
Although each of the dicing saw blades 502, 504, 506 and 508 illustrated in
A special dicing saw blade is used to machine channels in the first side 304 of the silicon wafer 202. The dicing saw blade composition is specifically chosen to provide the best resultant surface finish while maintaining acceptable wear life. The edge of the dicing saw blade is shaped with a profile that will shape the resultant channel in silicon wafer 202. This shape will correlate to the resultant blade bevel configuration. For instance, surgical blades typically have included bevel angles that range from 15° to 45° for single bevel blades and half included bevel angles that range from 15° to 45° for double bevel blades. Selection of a dicing saw blade in conjunction with etch conditions provides precise control of bevel angle.
As discussed above, slots can also be cut into the silicon wafer 202, especially if a dicing saw blade will be used to machine the trenches. Slots can be cut into the silicon wafer 202 in a fashion similar to the through-hole fiducials, i.e., with the laser water-jet or excimer laser, but serve a very different purpose. Recall that the through-hole fiducials are used by the trench machine in order to accurately position the silicon wafer 202 on the trench machine. This is especially useful when making double bevel blades, because the second machining (on the opposite side of the silicon wafer 202) must be accurately positioned to ensure a properly manufactured double bevel blade. Slots, however, are used for a different purpose. Slots allow the dicing saw blade to begin cutting the silicon wafer 202 away from the edge (as shown in
When machining trenches with the laser machine assembly 900, the silicon wafer 202 is mounted on the mounting assembly 204 which also is adaptable to be manipulated by multi-axis control mechanism 906. Through the use of laser machining assembly 900 and various light beam masking techniques, an array of blade profiles can be machined. The light beam mask is located inside laser 902, and through careful design, prevents laser 902 from ablating silicon material where it is not intended. For double bevel blades, the opposing side is machined the same way using the pre-cut chamfers 206A, 206B or fiducials 406 for alignment.
Laser 902 is used to accurately and precisely machine trench patterns (also referred to as an “ablation profile” in reference to use of a laser) into either first side 304 or second side 306 of silicon wafer 202 in preparation of the wet isotropic etching step (which is discussed in detail with reference to
Ultrasonic machining is used to accurately and precisely machine trench patterns into the silicon wafer 202 surface in preparation for the wet isotropic etching step. Ultrasonic machining is performed by ultrasonically vibrating a mandrel/tool (tool) 104. Tool 104 does not come in contact with silicon wafer 202, but is in close proximity to silicon wafer 202 and excites abrasive slurry 102 by operation of ultrasonic waves emitted by tool 104. The ultrasonic waves emitted by tool 104 force abrasive slurry 102 to erode silicon wafer 202 to the corresponding pattern that is machined on tool 104.
Tool 104 is machined, via milling, grinding or electrostatic discharge machining (EDM), to create the trench pattern. The resultant pattern on the machined silicon wafer 202 corresponds to that which was machined on tool 104. The advantage of using an ultrasonic machining method over an excimer laser is that an entire side of silicon wafer 202 can have numerous blade trench patterns ultrasonically machined at the same time. Thus, the process is fast and relatively inexpensive. Also, like the excimer laser machining process, various curvilinear profile patterns can be achieved via this process.
Silicon wafer 202 is pre-heated in a heat chamber, or can be heated completely by operation of heated base member 1054, upon which silicon wafer 202 sits. After sufficient time at elevated temperatures has passed, silicon wafer 202 will become malleable. Then, heated die 1052 is forced down upon silicon wafer 202 with sufficient pressure to impress the negative image of heated die 1052 into first side 304 of silicon wafer 202. The design of die 1052 can be such that there are numerous trenches of various bevel angles, depths, lengths and profiles, in order to create virtually any blade design imaginable. The diagram illustrated in
After all the desired through holes 622 have been drilled in the silicon wafer 202, the router 620 (which shows a counter-clockwise rotation as viewed from above), is lowered into a through hole 622 after it has been brought up to a certain rotational velocity. The router 620 is lowered to the desired depth and moves in the desired direction according to software control. See
Use of the router 620 provides a relatively inexpensive means for providing linear and non-linear trenches in a silicon wafer 202. As seen in
Having discussed the several methods for machining trenches, attention is again redirected to
After coating 1102 has been applied in optional step 2002, the next step is step 2003, dismounting and remounting (step 2003 can also follow step 1008 if no coating was applied). In step 2003, silicon wafer 202 is dismounted from tape 308 utilizing the same standard mounting machine. The machine dismounts silicon wafer 202 by radiating ultra-violet (UV) light onto the UV sensitive tape 308 to reduce its tackiness. Low tack or heat release tape can also be used in lieu of UV sensitive tape 308. After sufficient UV light exposure, silicon wafer 202 can be easily lifted from the tape mounting. Silicon wafer 202 is then remounted, with second side 306 facing up, in preparation for machine trenching of second side 306.
Step 2004 is then performed on silicon wafer 202. In step 2004, trenches are machined into second side 306 of silicon wafer 202, as was done in step 1008, in order to create double bevel silicon based surgical blades.
The bevels and facets illustrated in the double bevel multiple facet blade 700 can be manufactured by any of the trenching methods described above. For example, laser beam 904 can be used to machine the trenches to form the bevels in the double bevel multiple facet blade 700. Laser beam 904 can make a first pass, machining a first trench on a first side of the wafer, machining a first trench, and the make a second pass, suitably spaced, to machine a second trench. Likewise, the first multiple bevel blade 700 can also be created from the hot forging process described in greater detail with respect to
In
The bevel illustrated in the variable double bevel blade 702 can be manufactured by any of the trenching methods described above. For example, laser beam 904 can be used to machine the trench to form the bevel in the variable double bevel blade 702. Laser beam 904 can be adjusted to make the variable bevel by machining the crystalline material according to software program control. Likewise, the first multiple bevel blade 700 can also be created from the hot forging process described in greater detail with respect to
Following machine trench step 2004, a decision must be made in decision step 2005, as to whether to etch the double machine trenched silicon wafer 202 in step 1018, or dice the double machine trenched silicon wafer 202 in step 1016. Dicing step 1016 can be performed by a dicing saw blade, laser beam (e.g., an excimer laser, or laser waterjet 402). Dicing provides for the resultant strips to be etched (in step 1018) in custom fixtures in lieu of wafer boats (discussed in detail below).
The etching process will uniformly etch both sides of silicon wafer 202 and its respective trenches until the opposing trench profiles intersect. Silicon wafer 202 will be immediately removed from etchant 1402 and rinsed once this occurs. The expected cutting edge radius attained by this process ranges from 5 nm to 500 nm.
Isotropic chemical etching is a process that is used to remove silicon in a uniform manner. In the manufacturing process according to an embodiment of the present invention, the wafer surface profile that was produced with the machining described above is uniformly brought down to intersect with the profile on the opposing side of the wafer (if single bevel blades are desired, the non-machined opposing silicon wafer surface will be intersected). Isotropic etching is used in order to achieve the desired blade sharpness while preserving the blade angle. Attempts to intersect the wafer profiles by machining alone fail because the desired edge geometry is too delicate to withstand the machining mechanical and thermal forces. Each of the acidic components of isotropic etchant (etchant) 1402 has a specific function in isotropic acid bath 1400. First, nitric acid oxidizes the exposed silicon, and secondly, hydrofluoric acid removes the oxidized silicon. Acetic acid acts as a diluent during this process. Precise control of composition, temperature and agitation is necessary to achieve repeatable results.
In
Another benefit of using optional step 2002, applying coating 1102 to first side 304 of silicon wafer 202, is that the cutting edge (the first machined trench side) is composed of coating 1102 (which is preferably comprised of a layer of silicon nitride) that possesses stronger material properties than the base silicon material. Therefore, the process of applying coating 1102 results in a cutting edge that is stronger and more durable. Coating 1102 also provides a wear-barrier to the blade surface which can be desirable for blades that come in contact with steel in electromechanical reciprocating blade devices. Table III illustrates typical strength-indicating specifications of a silicon based surgical blade manufactured without coating 1102 (silicon) and with coating 1102 (silicon nitride).
Young's Modulus (also known as the modulus of elasticity) is a measurement of a material's inherent stiffness. The higher the modulus, the stiffer the material. Yield strength is the point at which a material, under load, will transition from elastic to plastic deformation. In other words, it is the point at which the material will no longer flex, but will permanently warp or break. After etching (with or without coating 1102), the etched silicon wafer 202 is thoroughly rinsed and cleaned to remove all residual etchant 1402 chemicals.
Following mounting step 1020, the silicon based surgical blades (silicon blades) can be singulated in step 1022, which means that each silicon blade is cut apart through use of a dicing saw blade, laser beam (e.g., laser waterjet 402 or an excimer laser), or other suitable means to separate the silicon blades from each other. As one skilled in the art can appreciate, lasers with certain wavelengths within the range of 150 nm to 11,000 nm can also be used. An example of a laser in this wavelength range is an excimer laser. The uniqueness of the laser waterjet (a YAG laser) is that it can scroll curvilinear, interrupted patterns in the wafer. This provides the manufacturer the flexibility to make virtually an unlimited number of non-cutting edge blade profiles. The laser waterjet uses a stream of water as a waveguide that allows the laser to cut like a band saw. This cannot be achieved with the current state of the art dicing machines, which, as mentioned above, can only dice in continuous, straight-line patterns.
In step 1024 the singulated surgical silicon blades are picked and placed on blade handle assemblies, according to the particular desires of the customers. Prior to actual “picking and placing” however, the etched silicon wafers 202 (being mounted on either tape and frame or on a tape/wafer frame) are radiated by ultraviolet (UV) light in the wafer mounting machine to reduce tape 308 tackiness. Silicon wafers 202, still on the “reduced tackiness” tape and frame, or tape/wafer frame, are then loaded into a commercially available die-attach assembly system. Recall from above it was discussed that the order of certain steps can be interchanged according to various manufacturing environments. One such example are the steps of singulation and radiation by UV light: these steps can be interchanged if necessary.
The die-attach assembly system will remove the individual etched silicon surgical blades from the “reduced tackiness” tape and wafer or tape/wafer frame, and will attach the silicon surgical blades to their respective holders within the desired tolerance. An epoxy or adhesive will be used to mount the two components. Other assembly methods can be used to attach the silicon surgical blade to its respective substrate, including heat staking, ultrasonic staking, ultrasonic welding, laser welding or eutectic bonding. Lastly in step 1026, the fully assembled silicon surgical blades with handles, are packaged to ensure sterility and safety, and transported for use according to the design of the silicon surgical blade.
Another assembly method that can be used to mount the surgical blade to its holder involves another use of slots. Slots, as discussed above, can be created by the laser water-jet or excimer laser, and were used to provide an opening for the dicing saw blade to engage the silicon wafer 202 when machining trenches. An additional use of slots can be to provide a receptacle in the blade for one or more posts in a holder.
Having described the manufacturing process for a double bevel silicon-based surgical blade, attention is turned to
Following step 1008 decision step 1010 determines whether the machined silicon wafer 202 will be dismounted from silicon wafer mounting assembly 204. If the single trench silicon wafers 202 were to be dismounted (in step 1012), then a further option is to dice the single trench wafers in step 1016. In optional dismounting step 1012, the silicon wafer 202 is dismounted from tape 308 utilizing the same standard mounting machine.
If silicon wafer 202 was dismounted in step 1012, then optionally the silicon wafer 202 can be diced (i.e., silicon wafer 202 cut apart into strips) in step 1016. Dicing step 1016 can be performed by a dicing blade, excimer laser 902, or laser waterjet 402. Dicing provides for the resultant strips to be etched (in step 1018) in custom fixtures in lieu of wafer boats (discussed in detail below). Following either the dicing step of 1016, the dismounting step of 1012, or the machine trench step of 1008, the next step in the method for manufacturing a single bevel silicon based surgical blade is step 1018. Step 1018 is the etching step, which has already been discussed in detail above. Thereafter, steps 1020, 1022, 1024 and 1026 follow, all of which have been described in detail above in reference to the manufacture of a double bevel silicon based surgical blade, and therefore do not need to be discussed again.
Following the coating step 2002, the silicon wafer 202 is dismounted and remounted in step 2003. This step is also identical as was previously discussed in reference to
Referring to
A single crystal substrate material that has been converted at the surface also exhibits superior fracture and wear resistance than a non converted blade. By changing the surface to a harder material the tendency of the substrate to form crack initiation sites and cleave along crystalline planes is reduced.
A further example of a manufacturing step that can be performed with some interchangeability is the matte-finish step. Often, especially when manufactured in the embodiments of surgical blades, the silicon surface of the blade will be highly reflective. This can be distracting to the surgeon if the blade is being used under a microscope with a source of illumination. Therefore, the surface of the blade can be provided with a matte finish that diffuses incident light (from a high-intensity lamp used during surgical procedure, for example), making it appear dull, as opposed to shiny. The matte finish is created by radiating the blade surface with a suitable laser, to ablate regions in the blade surface according to specific patterns and densities. The ablated regions are made in the shape of a circle because that is generally the shape of the emitted laser beam, though that need not be the case. The dimension of the circular ablated regions ranges from 25-50 microns in diameter, and again is dependent upon the manufacturer and type of laser used. The depth of the circular ablated regions ranges from 10-25 microns.
The “density” of circular ablated regions refers to the total percentage surface area covered by the circular ablated regions. An “ablated region density” of about 5% dulls the blade noticeably, from its normally smooth, mirror-like appearance. However, co-locating all the ablated regions does not affect the mirror-like effect of the balance of the blade. Therefore, the circular ablated regions are applied throughput the surface area of the blade, but in a random fashion. In practice, a graphic file can be generated that randomly locates the depressions, but achieves the desired effect of a specific ablated region density and randomness to the pattern. This graphic file can be created manually, or automatically by a program in a computer. An additional feature that can be implemented is the inscription of serial numbers, manufacturer logos, or the surgeon's or hospital's name on the blade itself.
Typically, a gantry laser can be used to create the matte finish on the blades, or a galvo-head laser machine. The former is slow, but extremely accurate, and the latter is fast, but not as accurate as the gantry. Since the overall accuracy is not vital, and speed of manufacturing directly affects cost, the galvo-head laser machine is a useful tool. It is capable of moving thousands of millimeters per second, providing an overall ablated region etch time of about five seconds for a typical surgical blade.
An additional parameter of surgical and non-surgical blades is the surface roughness characteristic. Surface roughness is an important parameter because it determines how easily the skin or material slides over the blade after the initial cut is made by the blade edge. A rough surface will tend to snag or snare the skin or material, and a smoother one will allow it to move easier over the blade. Rough blade surfaces can cause tears or rips, or, in a worse-case scenario, cause the surgeon (in a surgical use) to make an erratic incision. Such scenarios are extremely rare. Blades or mechanical device manufactured from silicon in accordance with the embodiments of the present invention described above can exhibit an extremely smooth surface, substantially smooth of surface defects, and much smoother than metal blades. Table IV illustrates surface roughness measurements for a metal blade, and Table V illustrates surface roughness measurements for a silicon blade manufactured in accordance with the embodiments of the present invention described above. Both tables represent the surface roughness as measured near the tip of the blade.
Method 380 begins with step 382 with laser cut number one. In
In step 1008, the bevels 392 are trenched according to various methods and equipment as described in greater detail above (see
Following etching step 1018, the blades can be mounted (step 1020), singulated (step 1022), picked and placed (step 1024) and packaged according to the customer's preferences (step 1026). Steps 1020-1026 have been described in greater detail above, and so for purposes of brevity their descriptions have not been repeated here.
The method 380 described above in reference to
The etchant solution (HNA), is an oxidation/reduction etchant for silicon. Under proper conditions the solution will very rapidly form micro-electrochemical cells that act as anode/cathode pairs that etch away the silicon substrate material and the silicon dioxide that is temporarily formed. This type of reaction acts on all surfaces equally. This means that any surface irregularity tends to be substantially rounded out or washed out. The resulting surfaces are substantially defect free, have a spectral mirror-like appearance, and a surface roughness on the order of 100 angstroms.
Tests have been conducted on samples of silicon that were processed according to the method described above in reference to
Due to the brittle fracture failure mode in single crystal silicon, it was necessary to test coupons that accurately represent silicon products manufactured in accordance with any one of the various methods of the present invention described above. Average MOR and statistical distribution values are required to characterize the strength of the material in a meaningful way.
In carrying out the strength measurement tests, a diamond wheel diced edge, an edge cut with a short pulse YAG laser manufactured by Gem City, and an edge cut with a long pulse YAG laser manufactured by Synova were evaluated. Further, these three surfaces were tested after etching off 50 μ of Si and after etching off 150 μ of Si. The etchant serves to remove damage/stress concentration points created by the cutting method and can also be used to reduce the number of finished edges that have weakening defects.
For each case, 10 coupons measuring 20 mm×7 mm were pushed to failure on the Instron using Flexural mode. In each case, etching the sidewalls after cutting significantly increased the average MOR. The data is summarized below in Table VI. In Table VI, to indicates the coupon's initial thickness. The higher MOR values can be attributed to the etch smoothing out any chips or scratches in the sidewalls, as shown in
The following conclusions can be drawn with some confidence based on the test results:
Silicon blades manufactured in accordance with the embodiments of the present invention described herein above can be substantially sharper than metal blades (and can be nearly equal to that of diamond blades) and can be substantially smoother than metal blades (as described above in reference to Tables IV and V).
The steps of the method 600 illustrated in the flow chart of
Method 600 is implemented after through-hole fiducials have been cut into the silicon wafer (wafer) 202, in step 1004 according to the methods of
As a result of the exposure to ultraviolet light 542 and subsequent development, the photoresist layer 540 becomes patterned photoresist layer 541 and the pattern of the patterned photomask 544 is replicated into the patterned photoresist layer 541. For positive photoresist material, the part of the photoresist material that is exposed to the x-rays or ultraviolet or other radiation is the part that is removed during development. The opposite is true for negative photoresist material.
Following step 2002, the method 600 proceeds to decision step 2003. As a result of steps 2000 and 2002, the first side of wafer 202 has a first patterned photoresist layer 541 on it. In decision step 2003, it is determined whether a double bevel blade is to be manufactured. If a double bevel blade is to be manufactured (“Yes” path from decision step 2003), it is then determined whether both sides have been processed. If both sides have not been processed (“No” path from decision step 2001), then the method 600 proceeds to steps 2000 and 2002 again, whereupon a second photoresist layer 540 is deposited upon a second side of the wafer 202, and in step 2002, the second side is baked and a second patterned photomask 544B is placed on the second photoresist layer 540. The second photoresist layer 540 is then exposed to ultraviolet light, x-ray or other types of radiation through the second patterned photomask 544B. As a result, the second photoresist layer 540 becomes second patterned photoresist layer 541. The method then returns to step 2003, where it determines again that this is a wafer 202 in which one or more double bevel blades are being manufactured on it (“Yes” path from decision step 2003). The method 600 then determines that both sides of wafer 202 have been processed (“Yes” path from decision step 2001), and proceeds to step 2005. In step 2005, the wafer 202 with both first and second sides covered with first and second patterned photoresist layers 540A, 540B respectively, is developed such that certain portions of the first and second patterned photoresist layers 540A, 540B are removed. As discussed above, what parts of the patterned photoresist layers 541A, 541B that are developed and removed depends on whether the photoresist is a negative or positive type of photoresist material. The method 600 then proceeds to step 2004, which is discussed in greater detail below.
If, after a first pass through steps 2000 and 2002 it is determined that a double bevel blade is to not be manufactured (“No” path from decision step 2003; i.e., a single bevel blade), method 600 proceeds to step 2005. In step 2005, the wafer 202 with only the first side covered with the first patterned photoresist layer 541 is developed such that certain portions of the first patterned photoresist layer 541 are removed. As discussed above, what parts of the patterned photoresist layer 541A that is developed and removed depends on whether the photoresist is a negative or positive type of photoresist material. The method 600 then proceeds to step 2004, which is discussed in greater detail below.
The patterned photomask 544 used on the photoresist layer 540 is selected based on the desired bevel angle of the cutting device to be formed. Appropriate patterns are selected based on whether the etch method, step 2004, discussed in greater detail below, will be wet, dry, isotropic or anisotropic. For example,
In step 2004, etching of the wafer 202 takes place. Etching, as described above, is the process of removing layers of the crystalline material the wafer 202 is made of to produce a blade (surgical or otherwise) or other type of tool. In this instance, etching is used to create a trench which defines the shape and angle of the blade. As described above, the step of trenching is generally performed in step 1008 of the methods illustrated in
In step 2004, the wafer 202, while masked with patterned photoresist layer 541, is partially etched. Wherever the patterned photoresist layer 541 has been developed out, the exposed underlying wafer 202 will etch away. Depending on the selected etchant, the etchant will either undercut the patterned photoresist layer 541 or directly reproduce the geometry of the patterned photoresist layer 541. This is illustrated in
Following step 2004, in which the wafer 202 is etched using any one of the etching processes discussed above (or combinations thereof), the patterned photoresist layer 541 is removed in step 2006 by an appropriate wet chemistry (solvent, commercial photo stripper, or the like) or it is ashed off in an oxygen plasma apparatus.
Once the patterned photoresist layer 541 has been removed in step 2006, the initially etched (or trenched) wafers 202 are mounted in step 2008 on UV laser dicing tape, and through-hole slots 390 are cut into the wafers 202 in step 2010 to form the non-cutting edges of the blades. Both of these steps are described in greater detail above. In step 2012, the mounted wafer 202 is removed from the laser tape and cleaned in sequential baths to remove debris and organic and metallic contaminations. The method 600 then returns to the methods described above with reference to
In the etching step 1018, the wafer 202 is now wet etched in an isotropic HNA bath as described above. The V-grooves (or the first, second or third etched areas 546, 548, 550) are brought together by the HNA etch to create the extremely sharp cutting edges as it also etches away the planar surfaces to bring the whole wafer/blades to its final target thickness. The wafer 202 is then transferred to an etch stop wherein it is thoroughly rinsed. The blades are then singulated, and combined with handles to create useful mechanical cutting tools (medical sharps) as discussed in greater detail above.
The present invention has been described with reference to certain exemplary embodiments thereof. However, it will be readily apparent to those skilled in the art that it is possible to embody the invention in specific forms other than those of the exemplary embodiments described above. This may be done without departing from the spirit and scope of the invention. The exemplary embodiment is merely illustrative and should not be considered restrictive in any way.
The present application contains subject matter related to that of six U.S. provisional patent applications, Ser. No. 60/362,999, entitled “System and Method for the Manufacture of Surgical Blades”, filed Mar. 11, 2002, Ser. No. 60/430,322, entitled “System and Method for the Manufacture of Surgical Blades”, filed Dec. 3, 2002, Ser. No. 60/503,458, entitled “System and Method for Creating Linear and Non-Linear Trenches in Silicon and Other Crystalline Materials with a Router”, filed Sep. 17, 2003, Ser. No. 60/503,459, entitled “Silicon Blades for Surgical and Non-Surgical Use”, filed Sep. 17, 2003, Ser. No. 60/566,397, entitled “Silicon Surgical Blades and Method of Manufacture”, filed Apr. 30, 2004, and Ser. No. 60/584,850 entitled “Method To Fabricate Complex Blade Geometries From Silicon Wafers”, filed Jul. 2, 2004, as well as that of U.S. nonprovisional patent application Ser. No. 10/383,573, entitled “System and Method for the Manufacture of Surgical Blades”, filed Mar. 10, 2003, now U.S. Pat. No. 7,105,103 the entire contents of all said prior provisional and non-provisional applications being expressly incorporated herein by reference. This application claims the benefit under 35 U.S.C. §119 of provisional patent applications Ser. No. 60/566,397 filed Apr. 30, 2004 and Ser. No. 60/584,840 filed Jun. 30, 2004.
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