The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate certain embodiments of the invention. In the drawings:
a-f are cross-sectional views illustrating methods of fabricating SOI substrates and semiconductor devices that include SOI substrates in accordance with some embodiments of the present invention;
a-f are cross-sectional views illustrating methods of fabricating SOI substrates and semiconductor devices that include SOI substrates in accordance with some other embodiments of the present invention; and
a-f are cross-sectional views illustrating methods of fabricating SOI substrates and semiconductor devices that include SOI substrates in accordance with yet some other embodiments of the present invention.
Number | Date | Country | Kind |
---|---|---|---|
10-2006-26036 | Mar 2006 | KR | national |