This disclosure relates generally to precision engineering micro assembly methods and devices and, more particularly to, manipulation of small beads and wires.
U.S. Pat. No. 8,333,796 of Tompkins et al. describes attempts to mechanically release an embolic coil from a microcatheter. For example, a ball affixed to a proximal end of the embolic coil is retained within an insertion tip of the microcatheter and held against an inner sidewall of the tip in a gap between two so-called engaging elements. When the coil is deployed, the engaging elements are moved outward from the insertion tip of the microcatheter, thereby moving the ball from being held against the sidewall and releasing it and the proximal end of the coil to which the ball is attached. The ball applies tension to the coil because it is tethered to an atraumatic (i.e., rounded) distal tip of the coil by a slender filament (wire, thread, fiber, or the like) passing through the center of the coil. In other words, the coil has a ball tethered by a filament attached to the opposing tip at the opposite end of the coil. Likewise, the aforementioned engaging elements are tethered so that they may be ejected from and retracted into the tip of the microcatheter by pulling or releasing a strand tethering the engaging elements.
As summarized above, in the specific attempt described in the '796 patent, there are at least four non-ferrous (i.e., non-magnetic) beads, spheres, balls, or the like that are assembled to filaments. But because such filaments and spheres are so small (e.g., on the order of hundreds of micrometers or less in diameter), assembling these components by hand in a repeatable manner and at high yields has been challenging for medical device manufacturers and potentially other precision engineering fields. The current assembly process is manually intensive and requires exceptional dexterity and beyond-excellent vision.
Disclosed are a multi-tool assembly system and associated methods for threading small spheres or other objects having through-holes onto small diameter wire, fiber, rod, or pin, trimming excess filaments, and securing components in position with adhesive. The tools can precisely manipulate objects having a diameter of about 200 μm or less in a reliable, repeatable manner and may operate semi-autonomously, fully autonomously, or in a manual mode.
This disclosure describes enhancements to the following eight precision engineering tasks: (1) presenting two thin (e.g., in a range between about 25-250 μm) filaments preparatory to transferring a small rounded object from one filament to the other; (2) removing a small rounded object that is threaded on a thin filament that may carry additional rounded objects; (3) transferring the small rounded object onto another filament; (4) manipulating the small rounded object over a looped section of fiber; (5) bonding end portions of two filaments; (6) seating a retaining device into an aperture of the through-hole of the small rounded object; (7) cutting an unseated portion of the retaining device; and (8) applying adhesive to the seated retaining device.
The tools and methods described herein apply to multiple business segments including, but not limited to: medical (e.g. implant); aerospace; micro, nano, and pico manufacturing/technology; electrical discharge machining (EDM) inspection and handling; and micro machines and machining.
In addition to providing relief to operators performing a complicated manual task, the tools and methods described also provide several key benefits, including: (1) modularity that enables varied configurations which can accommodate new part designs, implementation of upgraded components, and scalability; (2) a suitable platform for integrating an inspection and metrology system, including the automatic characterization of defects; and (3) the ability to adjust processes “on-the-fly,” facilitating the development of new methods of assembly or identification of those needing improvement. Among other things, the disclosed systems and methods provide: product uniformity due to consistent part handling and repeatability of operations; improved assembly quality due to benign handling of fragile parts and precisely controlled movements; reduced operator fatigue due to automated and assisted manual modes; vision system, manual or automated; and decreased assembly time.
Additional aspects and advantages will be apparent from the following detailed description of embodiments, which proceeds with reference to the accompanying drawings.
Although any of the assembly tasks described in this disclosure may be performed discretely and separately from the other tasks, for ease of description and providing a concise narrative, the tasks are described in accordance with an assembly sequence and in connection with an example assembly project. The assembly project itself and resulting assembled device, however, are not a limitation on the scope of this disclosure, as skilled persons will appreciate that any of the tasks and their variants have widespread applicability to various precision engineering fields including, among others, medical device manufacture. Thus, the technologies may, alone or in combination, be employed to automate or partly automate assembly, increase yields, and improve consistency.
Partly assembled proximal end 26 of embolic coil 28 includes a second stainless steel microstrand wire 30, different from first stainless steel wire 14 (
PE fiber 36 is actually formed from many strands extending through a central aperture 38 of embolic coil 28. For sake of simplicity, the numerous filaments are not shown. Note, however, that the numerous filaments introduce automation challenges having solutions discussed later in terms of replacing wire 30 with a platinum counterpart and avoiding excess wicking of adhesive.
Free ends 40—i.e., proximal ends according to the microcatheter reference frame mentioned previously—of second stainless steel wire 30 are free to dangle away from opposing loop 34 of PE fiber 36. Other ends (not shown) of PE fiber 36 are anchored to another component that is not relevant to the present example.
Kinematic mounts are used to securely hold one or more wires, which themselves may be loaded with spheres or other small objects as explained in the next section. Multiple kinematic mounting sites are located at different assembly stations (see e.g.,
Two-piece kinematic mount 48 is 3D-printable and relatively inexpensive, yet highly precise in terms of presenting inputs 10, 12 to micro tools arranged according to an assembly sequence carried out at different assembly stations when transportable kinematic mount portion 50 is automatically moved to corresponding anchored kinematic mount portions seriatim at the different assembly stations. Thus, two-piece kinematic mount 48 provides accurate and repeatable positioning of workpieces within range of a variety of specialized micro-manipulation tools and in the field of view and depth of focus of a vision and lighting systems, as shown in
Top portion 50 is retained on anchored kinematic mount portion 52 by three spherical magnets 54 exposed on or embedded in a base 56 (e.g., bottom face) of top portion 50. When top portion 50 is placed on anchored portion 52, each magnet 54 is magnetically fastened in a gap 58 between a corresponding pair of metal dowels 60. Because gaps 58 collectively define longitudinal axes intersecting at an exact center, and magnets 54 are precisely positioned with respect to each other and dowels 60, top portion 50 is fully constrained (not over constrained) in six-degrees of freedom to a location that has a tolerance of about 1 μm. Accordingly, top portion 50 can be removed completely for loading first or second inputs 10, 12 into or removing them out from a v-groove 64 of top portion 50.
Once loaded or unloaded, top portion 50 may be returned to a desired kinematic mounting site with high repeatability in terms of its position. Likewise, because top portion 50 is transportable, it may be separated from anchored portion 52 and placed in another anchored portion at a different orientation (e.g., placed upright) when transporting to another kinematic mounting site 46 first or second inputs 10, 12 retained in v-groove 64 of top portion 50.
As shown in
In addition to or as a substitute for magnets below v-groove 64, e.g., in cases where wires are not magnetic, there are a number of different ways to present a wire to the manipulation tools described in the following sections. For example, a metal endcap can be placed on non-magnetic portions so that the endcap provides magnetic attraction. In another embodiment,
In some embodiments, v-groove 64 is a depression or trough. Some embodiments include retention devices such as spring clips in addition to or in lieu of grooves.
As shown in
Additionally, manipulation of small spheres or wires can be accomplished with a variety of jigs and methods other than vacuum, some of which may be more effective for other shapes or sizes. For instance,
Using the equipment at assembly station 100, an operator or technician carefully transfers platinum sphere 16 using micrometer position adjustment of one or more of the tools of
Monitor 106 shows a greatly magnified view of coil 28 after platinum sphere 16 has been transferred and then pulled over loop 32 of wire 30 and loop 34 of PE fiber 36.
An optional force sensor (not shown) is integrated into micro grippers 114 such that tensile force can be measured while pulling. The force sensor is configured to indicate an out-of-tolerance condition during pulling of wire 30 and PE fiber 36 through the tapered hole of bead 16.
Once sphere 16 is pulled over loops 32, 34, wire 30 is replaced by a platinum wire having a diameter of about 0.002 inch (about 50 μm). In other words, loop 34 of PE fiber 36 will instead be looped around a platinum wire 128 (
In one embodiment, platinum wire 128 is carefully inserted through loop 34 of PE fiber 36 (akin to threading an eye of a needle), and stainless steel wire 30 is removed. This technique is challenging, however, because PE fiber 36 is made of numerous fraying micro strands, and breaking a strand or failing to capture one of them within loop 130 results in a failed component.
To ensure all strands are captured, the present inventors instead bond one end 134 of stainless steel wire 30 to an end 136 of platinum wire 128. This bond is made while loop 32 is intact so that stainless steel wire 30 may then be pulled 142 (
The first type of bond shown in
The second type of bond is a lap bond (not shown). A relatively short segment of one filament is bonded to roughly equal portion of the other filament. The bond may be secured by UV-cured adhesive, solder, glues, or other types of bonding agents.
Bonding and exchanging wires is optional in some other embodiments. For example, instead of using stainless steel wire 30, a platinum wire is provided as an input to the system. That platinum wire may include one or more segments that are 0.001 inch and another segment that is 0.002 inch. Accordingly, bead 16 fits over two doubled-over narrower segments (0.002 inch) or doubled-over wider and narrower segments (0.003 inch). Once bead 16 passes over, the wide segments of 0.002 inch are moved into exit hole 24 and doubled over to form a platinum loop that is 0.004 inch for trapping bead 16 (which is also called a proximal constraint since it is used for retaining in and releasing from a micocatheter, coil 28). A platinum wire having different segment widths can be formed by pulling segments of a 0.002 inch wire through a 0.001 inch die.
During the seating operation, PE fiber 36 may be optionally gripped to ensure a feeler gauge or other spacer tool is mechanically separated from coil 28 by the gripping tool. This ensures that coil 28 is not overloaded or otherwise damaged when seating bead 16.
Slit 180 guides a blade (not shown) during trimming. Free ends 172 of platinum wire 128 may be extended out one side of clamp 176, whereas loops 130 and 34, bead 16, PE fiber 36, and coil 28 are extended out the opposite side of clamp 176. This constrains both sides of cut location 178 so that the cutting blade may be passed through platinum wire 128, leaving behind loop 130 of platinum seated against bead 16.
Skilled persons will appreciate that other cutting techniques may be employed: laser trimming, saw trimming, or dual blade snipping (see e.g.,
Once sphere 16 has been seated against loops 130, 34 (i.e., essentially forming a knot inside bead 16), adhesive is applied to retain sphere 16 and loops 130, 34. For example,
An example of an adhesive dispense tool is a solenoid-actuated microdot dispenser available from Xandex, Inc. of Petaluma, Calif. This type of dispenser has a reciprocating micro dispensing needle system described later in connection with
In some embodiments, a rotation fixture facilitates rotation of the workpiece about its longitudinal axis for improving distribution of adhesive. For example, a theta rotation stage is described later. And
Strands of PE fiber 36 are relatively loose and therefore rapidly absorb adhesive. To optimize wicking of adhesive through capillary action of the numerous strands and generally reduce the rate of adhesive absorption, strands are tightened by the aforementioned axial pull or by twisting PE fiber using micro tools to tighten strands and reduce capillary wicking action For example, as described later, a collet fixture has bearings allowing rotation while holding constraint, thus twisting PE fiber which minimizes wicking
In some embodiments, a pulsed UV light is used to cure adhesive applied to a workpiece. The UV light is applied after one or more microdots of adhesive are applied. A light shield (not shown) blocks UV light from reaching, and drying out the adhesive flowing from, adhesive dispense needle 190.
In the example of
Another dispense and cure assembly station 242 is optionally included to increase throughput since two stations 240, 242 could operate simultaneously on two different workpieces. Similarly, there are spare stations that could be populated for additional redundancy. For clarity, skilled persons should appreciate that seriatim processing of a particular proximal end according to a sequence performed at several stations need to preclude parallel processing of two or more different proximal ends in different stations that would otherwise be left idle. Accordingly, some embodiments of this disclosure include those systems having additional or redundant stations.
A transport device, such as a robotic arm 250 or gantry, is configured to move a transportable kinematic mount of a collet fixture to multiple kinematic mounting sites 256 located at different assembly stations 230. As explained previously, each kinematic mounting site 256 provides a kinematic mount formed in response to attachment of a transportable kinematic mount portion to a corresponding one of multiple anchored kinematic mount portions fixed at an associated kinematic mounting site.
Multiple multi-axis motion stages 266 include a first multi-axis motion stage 270 at first assembly station 236 and a second multi-axis motion stage 272 at second assembly station 240. First multi-axis motion stage 270 is an XYZ stage and includes a first micro tool 280 that is operable to perform a micro bead or wire manipulation procedure (e.g., trim) of assembly sequence 218. Likewise, second multi-axis motion stage 272 is an XYZ and Θ (rotation) stage and includes a second micro tool 282 (e.g., a Xandex dispenser) operable to perform an adhesive micro-dispense procedure of assembly sequence 218. Thus, first and second micro tools 280, 282 are configured to act at different times on a filament of a workpiece (shown in other figures) in accordance with at least a portion of assembly sequence 218 when transportable kinematic mount portion is moved to corresponding anchored kinematic mount portions seriatim at, respectively, first and second assembly stations 236, 240.
Following an adhesive dispense and cure process (at either available dispense and cure station shown in
Once sequence 218 is complete for all collet fixtures 200 that are kinematical remounted back on carousel 210, operator 206 removes fixtures 200 (or takes the entire populated carousel 210) from system 194 for further downstream processes 314, such as cleaning and packaging.
A computer workstation 324 is coupled to one or more inspection cameras 306 at interior assembly stations 230. Computer workstation 324 includes a machine readable storage medium having instructions stored thereon that, when executed by a processor, configure the processor to perform inspection tasks or control any of the automation tools employed in the aforementioned processes.
Station 236 also includes a pair of XYZ stages 412, an anchored kinematic mount portion 414 bracketed to a first stage 416 of pair 412, and seat and trim micro tools 418 mounted to a second stage 420 of pair 412. An optional vacuum line 424 and illumination source (not shown) are also included.
Seat and trim micro tools 418 are similar to those described previously. For example, a spacer 428 is used to create space between bead 16 and a proximal end of coil 332 (see e.g., space shown in
A theta stage 456 rotates the proximal end about a longitudinal axis so that a dispense tip 458 can apply adhesive droplets circumferentially around the proximal end. One or more droplets are applied and then cured in rapid succession by flickering light applied from UV device 460.
Station 240 also includes a pair of orthogonally arranged cameras 470. Images are taken of the proximal end for fine alignment and incoming and outgoing inspection.
A system using micro tools for micro assembly of a workpiece that includes a component having one or both of a micro bead and a wire, the micro tools arranged according to an assembly sequence carried out at different assembly stations that include a first assembly station and a second assembly station that is different from the first assembly station, the system comprising: multiple kinematic mounting sites located at the different assembly stations, each kinematic mounting site providing a kinematic mount formed in response to attachment of a transportable kinematic mount portion to a corresponding one of multiple anchored kinematic mount portions fixed at an associated kinematic mounting site, the transportable kinematic mount portion including a depression and being sized to carry the workpiece with its component secured in the depression for presentation of the component at the different assembly stations when the transportable kinematic mount portion is transferred to and mounted at a corresponding anchored kinematic mount; multiple multi-axis motion stages including a first multi-axis motion stage at the first assembly station and a second multi-axis motion stage at the second assembly station, the first multi-axis motion stage including a first micro tool that is operable to perform a micro bead or wire manipulation procedure of the assembly sequence, and the second multi-axis motion stage including a second micro tool that is different from the first micro tool and is operable to perform an adhesive micro-dispense procedure of the assembly sequence; and the first and second micro tools are configured to act at different times on the component of the workpiece in accordance with at least a portion of the assembly sequence when the transportable kinematic mount portion is moved to corresponding anchored kinematic mount portions seriatim at, respectively, the first and second assembly stations.
The system of example 1, in which the transportable kinematic mount portion comprises a collet fixture.
The system of example 1, further comprising a robotic arm configured to move the transportable kinematic mount portion to the multiple kinematic mounting sites.
The system of example 1, in which the depression comprises a v-groove.
The system of example 1, in which the first multi-axis motion stage comprises an XYZ stage.
The system of example 1, in which the second multi-axis motion stage comprises an XYZ and Θ stage.
The system of example 1, in which the different assembly stations include a carousel having anchored kinematic mount portions affixed to or integral in a sidewall.
The system of example 1, in which the component includes a proximal constraint for an embolic coil.
The system of example 1, in which the workpiece comprises an embolic coil.
The system of example 9, in which the embolic coil is retained in a sheath.
The system of example 1, further comprising inspection cameras at the different assembly stations.
The system of example 1, in which the second micro tool is a solenoid-actuated microdot dispenser.
The system of example 1, in which the first micro tool includes microgrippers.
The system of example 13, in which the microgrippers are configured to perform the micro bead or wire manipulation procedure by gripping a polyethylene (PE) fiber of the workpiece.
The system of example 1, further comprising a third micro tool that is the same as the second micro tool and included in a redundant assembly station for improving throughput.
The system of example 1, in which the first micro tool includes a wire cutting tool.
A method of using micro tools for micro assembly of a workpiece that includes a component having one or both of a micro bead and a wire, the micro tools arranged according to an assembly sequence carried out at different assembly stations that include a first assembly station and a second assembly station that is different from the first assembly station, the method comprising: sequentially attaching a transportable kinematic mount portion to corresponding different ones of multiple anchored kinematic mount portions fixed at associated kinematic mounting sites, the transportable kinematic mount portion including a depression and being sized to carry the workpiece with its component secured in the depression for presentation of the component at the different assembly stations when the transportable kinematic mount portion is transferred to and mounted at an anchored kinematic mount; controlling multiple multi-axis motion stages including a first multi-axis motion stage at the first assembly station and a second multi-axis motion stage at the second assembly station, the first multi-axis motion stage including a first micro tool that is operable to perform a micro bead or wire manipulation procedure of the assembly sequence, and the second multi-axis motion stage including a second micro tool that is different from the first micro tool and is operable to perform an adhesive micro-dispense procedure of the assembly sequence; and processing the component of the workpiece with the first and second micro tools in accordance with at least a portion of the assembly sequence when the transportable kinematic mount portion is moved to corresponding anchored kinematic mount portions seriatim at, respectively, the first and second assembly stations.
The method of example 17, further comprising seating a bead using the first micro tool.
The method of example 17, further comprising trimming a wire using the first micro tool.
The method of example 17, further comprising applying adhesive to a wire using the second micro tool.
The method of example 17 performed by the system of any one of examples 1-16.
Skilled persons will appreciate that many changes may be made to the details of the above-described embodiments without departing from the underlying principles of the invention. For instance, collet 202 itself could be kinematically mounted, in which case it could serve as a transportable kinematic mount portion. The scope of the present invention should, therefore, be determined only by the following claims.
The application claims priority benefit of U.S. Provisional Patent Application No. 62/673,102, filed May 17, 2018, which is hereby incorporated by reference.
Number | Date | Country | |
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62673102 | May 2018 | US |