Patent Application
20240234391
The present application claims priority to German Patent Application No. 10 2021 112 018.7 dated May 7, 2021, the disclosure content of which is hereby incorporated by reference into the present application.
The present invention relates to functional cells, a microsystem comprising a plurality of functional cells, a method of manufacturing functional cells, and a method of manufacturing a microsystem comprising a plurality of functional cells.
Bionics deals with the transfer of phenomena from nature to technology. In many technical areas, it has already been possible to transfer phenomena from nature to technology. However, in the field of autonomous microsystems, such as microrobots with the size of small insects or worms, hardly any solutions are known at this time to provide such a system based on phenomena from nature.
Existing microsystems are miniaturized devices, assemblies or a component whose components have the smallest dimensions in the range of 1 micrometer and interact as a system. Existing microsystems can, for example, consist of one or more sensors, actuators and control electronics arranged on a carrier or chip. At present, such microsystems are usually limited to relatively large assemblies with dimensions of several millimeters due to their design, manufacture and the components used. In addition, the production of such microsystems is currently very cost-intensive, as they have to be manufactured individually and using non-standardized processes.
Therefore, there is a need to counteract the aforementioned problems and provide a microsystem and a method for manufacturing a microsystem that is easy to manufacture and has small dimensions.
This need is addressed by a functional cell having the features of independent claim 1, by a microsystem comprising a plurality of functional cells having the features of independent claim 19, by a method of making a functional cell having the features of independent claim 29, and by a method of making a microsystem having the features of independent claim 33. Embodiments and further embodiments of the invention are described in the de-pendent claims.
The inventor has made use of a phenomenon found in nature by creating an autonomous microsystem consisting of a large number of cells that are interconnected and interact with each other. The cells can be the same size as biological cells, but with a much simpler structure, and depending on the type of cell, can perform different functions within the microsystem. In the following, such cells are therefore called functional cells. In contrast to biological cells, functional cells do not have an intrinsic blueprint, they cannot self-replicate, and they cannot obtain their energy via a complicated biochemical metabolic process. However, functional cells can be of different types and can be of a different cell type, such as electrical energy generating cells, electrical energy storing cells, electrical energy conducting cells, and electrical energy consuming cells. A common feature of the functional cells is that they each have a housing with the same dimensions. This makes it possible, depending on the application, to easily combine the various individual cells in any order and in any composition to form a microsystem. The resulting possibilities and freedom in the arrangement of the functional cells in relation to each other make a high degree of standardization in the manufacturing process conceivable, since the functional cells can be provided in large quantities and these can be individualized and easily combined according to the desired application.
A functional cell according to the invention has a cell type, wherein the cell type forms a cell type consisting of the following types:
Further, the functional cell comprises a housing made of an electrically insulating material and the housing of each two types of cells has the same dimensions. The functional cell comprises at least one first electrical connection area and at least one second electrical connection area, wherein the at least one first electrical connection area and the at least one second electrical connection area are arranged on two opposite outer surfaces of the housing. In addition thereto, the functional cell comprises a functional element associated with the respective cell type and/or identifying the cell type and arranged inside the housing with electrical connection of the at least one first electrical connection area and the at least one second electrical connection area.
The housing of the functional cells may in particular be formed by a base layer and a cover layer, which span a cavity or hollow between the two layers. The functional element of the functional cells may be arranged in this cavity or hollow space, and the functional element may in particular fill this cavity or hollow space.
The housing can form the cell body of the functional cell, following the example of a biological cell. In particular, the housing or the cell body can consist of or comprise an electrically insulating material or a non-conductive material, so that the housing or the cell body is electrically non-conductive on its outer surfaces. The only exception to this can be the electrical connection areas that are arranged on the outer surfaces of the housing or protrude from them.
In some embodiments, the functional element comprises at least one of the following:
In particular, the functional element may be formed by an energy generating element in the cell type of an electric energy generating cell, by an energy storing element in the cell type of an electric energy storing cell, by an energy conducting element in the cell type of an electric energy conducting cell, by an actuator in the cell type of an electric energy consuming cell, by a controller in the cell type of an electric energy consuming cell, or by an optoelectronic semiconductor device such as an LED or a sensor in the cell type of an electric energy consuming cell.
For example, a functional cell of the cell type of an electric energy generating cell can convert ambient light, or a fuel carried or supplied by the cell, into electric energy. The energy generated by the functional cells of the cell type of an electric energy generating cell can be stored in cells of the cell type of an electric energy storing cell, or such cells can be externally supplied or charged with electric energy. Cells of cell type of electric energy consuming cell may perform controlling functions, or such cells may perform movement, heating, light emission, or light detection in the form of actuators, or optoelectronic devices. Cells of the cell type of an electric energy conducting cell can conduct electric energy between the mentioned cell types.
The functional element may comprise, for example, an artificial neuron in the cell type of an electrical energy consuming cell. Such an artificial neuron may be modeled on a natural neuron and may, for example, be in the form of a logic gate (AND, OR, XOR, . . . ) or in the form of an integrated circuit (IC) or contain such an element.
In some embodiments, the functional element does not exceed a size of 100 μm×100 μm×100 μm. In particular, the functional elements within this application are declared u, such as μ-LED, μ-IC, μ-solar cell, or μ-accumulator, to express that they are very small elements, in particular elements with a size smaller than 100 μm×100 μm×100 μm.
In some embodiments, the functional cell housing does not exceed a size of 500 μm×500 μm×500 μm, or 250 μm×250 μm×250 μm, or 100 μm×100 μm×100 μm. In particular, the housing of each two cell types, and in particular of all cell types, has the same dimensions. In some embodiments, the housing of each two cell types and in particular of all cell types has the same dimensions and the same shape. This has the advantage that the functional cells can be stacked and combined in a space-saving manner and in any order and composition.
In some embodiments, the housing comprises an electrically insulating material or the housing comprises an electrically insulating material. For example, the housing comprises at least one of epoxy resin, silicone, acrylate, polyethylene terephthalate (PET), polyethylene (PE), a thermoplastic, a thermoset, Al2O3, AlN, glass, and ceramic.
In some embodiments, the at least one first electrical connection area and the at least one second electrical connection area are each formed by a leaf spring projecting from the housing or from an outer surface of the housing. For example, the at least one first electrical connection area and the at least one second electrical connection area may each be formed similarly to a through contact in an electrical switch.
In some embodiments, the at least one first electrical terminal area and the at least one second electrical terminal area have a coating of gold or other low oxidation material, or the at least one first electrical terminal area and the at least one second electrical terminal area have a coating of a solder compound. In some embodiments, the at least one first electrical connection area and the at least one second electrical connection area each have a roughened or spiked surface at least in the regions outside the housing. This may, for example, provide better electrical contact between multiple functional cells.
In some embodiments, the at least one first electrical connection area and the at least one second electrical connection area are each formed by or include a contact pad formed on two opposing outer surfaces of the housing.
In some embodiments, the at least one first electrical connection area and the at least one second electrical connection area each have a solder bump arranged on the housing or contact pad. A solder wetting area on the housing may be smaller than the solder bump arranged on the housing in each case in the area of a solder bump. In particular, a solder wetting area may be limited to a contact pad disposed on the housing, and a solder bump disposed on the contact pad may cover a larger area than the area of the contact pad or solder wetting area. For example, the solder wetting area may be limited by a solder bump applied to the package. In the event that the functional cell or the at least one first electrical connection area and the at least one second electrical connection area are heated, the respective solder bump retracts to the area of the solder wetting surface.
In some embodiments, the functional cell further comprises at least one third electrical connection area and at least one fourth electrical connection area, wherein the at least one third electrical connection area and the at least one fourth electrical connection area are disposed on two opposing exterior surfaces of the housing.
In some embodiments, the functional cell further comprises at least one fifth electrical connection area and at least one sixth electrical connection area, wherein the at least one fifth electrical connection area and the at least one sixth electrical connection area are disposed on two opposing exterior surfaces of the housing.
In some embodiments, at most one of the at least one first, second, third, fourth, fifth, and sixth electrical connection areas is disposed on each exterior surface of the housing.
In some embodiments, exactly one of the at least one first, second, third, fourth, fifth and sixth electrical connection areas is arranged on each outer surface of the housing. Accordingly, in the case of a cuboid or cube-shaped housing with six outer surfaces, exactly one electrical connection area, for a total of six electrical connection areas, may be arranged on each of the outer surfaces.
In some embodiments, the functional cell further comprises at least one seventh electrical connection area, wherein the at least one seventh electrical connection area is disposed on an outer surface of the housing. In contrast to aforementioned electrical connection areas, the seventh electrical connection area may be disposed on an outer surface of the housing without another electrical connection area associated with the seventh electrical connection area being disposed on the opposite outer surface of the housing.
In some embodiments, at least two of the at least one first, third, fifth, and seventh, or the at least one second, fourth, sixth, and seventh electrical connection areas are disposed on at least one exterior surface of the housing.
The number of electrical connection areas on an outer surface of the housing can be selected variably and adapted to the requirements of the functional cell. However, in order to be able to provide a high degree of standardization in the manufacturing process of the functional cells and versatile combination options for the functional cells, it can be advantageous that at most one electrical connection area is arranged on each outer surface of the housing.
In some embodiments, the electrical connection areas comprise or consist at least in part of any of the following materials: copper, nickel, gold, silver, indium, tin, and bismuth.
In case the functional cell is of the cell type of an electric energy conducting cell, and the functional element comprises at least one electric conductor, the electric conductor may electrically interconnect the at least one first and/or the at least one second and/or the at least one third and/or the at least one fourth and/or the at least one fifth and/or the at least one sixth and/or the at least one seventh electric terminal area. In addition thereto, at least one further electrical conductor may electrically interconnect at least a part of the remaining electrical connection areas not yet interconnected. Possible combinations and specific examples regarding possible electrical connections between the electrical connection areas are explained below in the detailed description or figure description using a short circuit table.
In some embodiments, the housing is rotationally symmetric along at least one axis or is mirror symmetric along at least one plane. In some embodiments, the housing is rotationally symmetric along multiple axes or mirror symmetric along multiple planes. High symmetry of the housing can provide high standardization in the manufacturing process of the functional cells and versatile combination options of the functional cells. Furthermore, high symmetry of the housing may be advantageous because the orientation of the housing may play little or no role in the assembly of multiple functional cells.
In some embodiments, the enclosure comprises one of the following shapes: Cube, in particular a cube with rounded edges; Cuboid, in particular a cuboid with rounded edges; Beam, in particular a beam with rounded edges; Sphere; Ellipsoid; Pyramid, in particular a pyramid with rounded edges; Truncated pyramid, in particular a truncated pyramid with rounded edges; and Truncated cone, in particular a truncated cone with rounded edges.
Rounded or rounded edges or corners of the housing shape can serve in particular to reduce the stresses in the housing or in the composite of the cells as a microsystem. Further, the shape of the cell may affect the expansion of the cell in the event that the cell includes an actuator, in the case of the cell type of an electrical energy consuming cell. For example, an enclosure in the shape of a sphere may expand substantially isotropically in the event of an increase in temperature, whereas an enclosure in the shape of a cuboid, or a bar or rod, may expand substantially anisotropically. Such a varying expansion of the cell may be desired, for example, if the composite of cells as a microsystem is to perform a particular movement.
In some embodiments, the functional cell comprises an adhesive layer covering at least one outer surface of the housing. In particular, the adhesive layer covers the at least one outer surface of the housing such that any electrical connection area or electrical connection areas disposed on the outer surface of the housing are not covered by the adhesive layer. The adhesive layer may be used, for example, to interconnect a plurality of functional cells.
A microsystem according to the invention comprises a plurality of functional cells that are at least partially electrically coupled to each other. The functional cells each have a cell type, wherein the cell type forms a cell type consisting of the following types:
Each functional cell comprises a housing made of an electrically insulating material, wherein the housings of each two functional cells have the same dimensions. Further, each functional cell comprises at least one first electrical connection area and at least one second electrical connection area and a functional element arranged inside the housing with electrical connection of the at least one first electrical connection area and the at least one second electrical connection area.
In particular, the functional cells of the microsystem may be formed according to the embodiments of the functional cells described in the above.
That the functional cells are at least partially electrically coupled to each other means that at least a portion of the plurality of functional cells are electrically coupled to each other, however, the microsystem may also have cells that are not electrically coupled to any other cell of the microsystem. However, all cells of the microsystem may be at least mechanically coupled to each other.
In some embodiments, the plurality of functional cells are arranged side-by-side in a first plane, resulting in a layer of functional cells arranged side-by-side. However, in some embodiments, a first subset of the plurality of functional cells may be arranged side-by-side in a first plane, and a second subset of the plurality of functional cells may be arranged in a second plane parallel to the first plane. Thus, the cells may be arranged in two or more superimposed layers. The layers of cells or the planes in which the subsets of cells are arranged can either comprise the same number of cells, but the number of cells in the layers or in the planes can also differ. In particular, the area or space occupied by the cells per layer or per level may also differ. Due to the multiple layers, each with a different number of cells arranged therein, the microsystem can be formed in all conceivable volume freeforms or in the form of a fabric in space. Within this free form or within this fabric, existing and opposing electrical connection areas of the individual cells can be electrically coupled to each other.
In some embodiments, the microsystem comprises at least one non-electric cell, wherein a housing of the at least one non-electric cell has substantially the same dimensions and, in particular, the same shape as a housing of a functional cell.
For example, the housing of the at least one non-electric cell may be formed by a substantially transparent material.
For example, one such non-electric cell or a plurality of such non-electric cells may form a spacer between functional cells, a light guide between functional cells, an elastomer between functional cells, or an outer armor or protective shell for the microsystem. Similarly, it is possible, for example, for a plurality of such non-electric cells to form a cavity for a fuel to power an electric energy generating cell.
The housing of the at least one non-electric cell may be formed by, for example, or comprise at least one of the following materials: Epoxy resin, silicone, acrylate, polyethylene terephthalate (PET), polyethylene (PE), a thermoplastic, a thermoset, Al2O3, AlN, glass, and ceramic. In particular, the housing of the at least one non-electric cell may be formed of a hard, transparent material, such as an epoxy resin, and have a comparatively softer core of, for example, silicone.
In some embodiments, the functional cells and the non-electrical cells are encapsulated in an interconnect layer. In particular, the interconnect layer may provide a mechanical connection between the cells or at least provide a mechanical connection between the cells that are not coupled via the electrical pads. The interconnect layer may further have insulating properties to prevent unwanted short circuits or unwanted contacting within the microsystem.
In some embodiments, the interconnect layer is formed of an electrically insulating material and comprises or consists particularly of one of the following materials: a synthetically produced hydrocarbon, particularly forming a polymer, plastic, silicone, acrylate, epoxy resin, PET, PE, a thermoplastic, a thermoset, and an elastomer.
In some embodiments, a subset of the plurality of functional cells arranged adjacent to each other has the same cell type. In particular, a subset of the plurality of functional cells arranged adjacent to each other and in electrical communication with each other has the same cell type. Accordingly, the microsystem has sub-regions, the sub-regions being characterized in that the cells therein have the same cell type, are arranged adjacent to each other, and are optionally in electrical communication with each other.
In some embodiments, the at least one first electrical connection area and the at least one second electrical connection area of each functional cell are formed by a leaf spring projecting from the housing of the respective functional cell. Opposing leaf springs of two adjacent functional cells may thereby be in electrically conductive connection with each other. The electrically conductive connection can be created in particular by the leaf springs touching or resting on each other. In particular, the electrically conductive connection can result from the leaf springs being pressed against each other and slightly bent, thus exerting a force on the leaf springs which in turn generates a contact force.
The bending of the leaf springs can result from a force applied to the functional cells during the manufacturing process, for example by pressing the functional cells together, or the bending can result from the compound layer applied for casting the cells hardening and contracting. The shrinkage of the material of the compound layer can cause the functional cells to be closer together after curing, resulting in a force on the leaf springs.
In addition, or alternatively, the leaf springs or the electrical connection areas can comprise a coating of a solder com-pound, so that the electrically conductive connection can be created by soldering the opposing leaf springs or electrical connection areas to one another at least in the area of the coating. The soldering can be carried out in particular by pressing the opposing leaf springs or electrical connection areas onto one another and simultaneously heating them.
In some embodiments, the at least one first electrical connection area and the at least one second electrical connection area of each functional cell are formed with solder bumps. Opposite solder bumps of two adjacent functional cells may be soldered together and thus be in electrically conductive connection with each other. In particular, the at least one first electrical connection area and the at least one second electrical connection area of each cell can each be formed by or have a contact pad. A solder bump may be disposed on each of the contact pads. A solder wetting area on the housing of each cell can thereby be smaller in each case in the area of the solder bumps than the solder bump arranged on the housing. In particular, the solder wetting area may be limited to the contact pads arranged on the housing, and the solder bump applied to each of the contact pads may cover a larger area than the area of the contact pad or the solder wetting area. When the functional cells are electrically connected, they or at least the opposing electrical connection areas of the functional cells can be heated so that the respective solder bump retracts to the area of the solder wetting surface and the opposing solder bumps “grow together” or are soldered.
In some embodiments, the microsystem further comprises another functional cell having a housing having dimensions substantially equal to a multiple of the dimensions of a housing of one of the plurality of functional cells. In this regard, the further functional cell may have a cell type, wherein the cell type forms a cell type consisting of the following types:
In particular, the further functional cell may be formed in accordance with the embodiments of the functional cell described in the above, but may have dimensions that are substantially a multiple of the dimensions of a housing of the embodiments of the functional cell described in the above.
By the further functional cell or the housing of the further functional cell having dimensions substantially corresponding to a multiple of the dimensions of a housing of the embodiments of the functional cell described in the above, it is possible to arrange the further functional cell in the microsystem instead of a number of smaller cells described in the above.
Such a larger further functional cell may be particularly advantageous if the microsystem requires increased computing power or control. Thus, it may be useful to have a larger integrated circuit (IC) in a functional cell as opposed to multiple small integrated circuits in multiple smaller functional cells. Another application of a larger cell could be when a lens, for example, is to be provided by a larger non-electric cell, which might not be feasible with multiple smaller non-electric cells.
A method according to the invention for producing a functional cell of a cell type, wherein the cell type forms a cell type consisting of the following types:
In particular, the method of manufacturing a functional cell may be adapted to form the functional cells of the microsystem according to the embodiments of the functional cell described in the above.
The process according to the invention may comprise steps known from thin film technology such as physical vapor deposition (PVD), chemical vapor deposition (CVD), lithography, and etching. Further, the process may also include steps known from printing technology such as stereo lithography, jet printing, screen printing, stencil printing, and offset printing. For example, the step of patterning the base layer may be performed by a photolithography process or a wet chemical etching process, and the step of applying an electrically conductive pattern may be performed, for example, by vapor deposition and sputtering of an electrically conductive material followed by lift-off processes or etching techniques.
In some embodiments, the functional element disposed in the at least one cavity or hollow comprises at least one of the following:
In some embodiments, the method further comprises a step of structuring the base layer and/or the cover layer and/or the electrically conductive structure. By this step, a plurality of functional cells formed on the release layer may be separated from each other so that they subsequently yield individual components. Accordingly, this step may also be referred to as the separation step.
In some embodiments, the step of applying an electrically conductive structure comprises:
However, the latter two steps can also be performed downstream, after the step of applying a cover layer to encapsulate the functional element.
A method of manufacturing a microsystem according to the invention comprising a plurality of functional cells at least partially electrically coupled to each other, wherein each functional cell is formed by one of the following cell types:
In particular, the method of manufacturing a microsystem comprising a plurality of functional cells may be adapted to form the microsystem according to the embodiments described above.
The method according to the invention can comprise steps which are known from a laser lift off method.
By means of the method, a plurality of functional cells may be juxtaposed in a first plane, resulting in a layer of juxtaposed functional cells. However, in some embodiments, a first subset of the plurality of functional cells may be arranged side-by-side in a first plane, and a second subset of the plurality of functional cells may be arranged in a second plane parallel to the first plane. Thus, the cells may be arranged in two or more superimposed layers. The layers of cells or the planes in which the subsets of cells are arranged can either comprise the same number of cells, but the number of cells in the layers or in the planes can also differ. In particular, the area or space occupied by the cells per layer or per level may also differ. Accordingly, several layers can be formed by the process, whereby the several layers can be formed with a different number of cells arranged therein in all conceivable volume free forms or in the form of a fabric in space. Within this free form or within this fabric, existing and opposing electrical connection areas of the individual cells can be electrically coupled to one another.
In some embodiments, the method further comprises a step of potting the functional cells arranged on the carrier. In particular, it may be provided that a layer of functional cells is formed by means of the method, this layer is potted and subsequently further functional cells are arranged in a plane parallel to the first layer. The resulting further layer can then be cast again before a new third layer parallel to the first or second layer is created.
In the following, embodiments of the invention are explained in more detail with reference to the accompanying drawings. They show, schematically in each case,
The following embodiments and examples show various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. Likewise, various elements may be shown enlarged or reduced in size to highlight individual aspects. It will be understood that the individual aspects and features of the embodiments and examples shown in the figures may be readily combined without affecting the principle of the invention. Some aspects have a regular structure or shape. It should be noted that minor deviations from the ideal shape may occur in practice, but without contradicting the inventive idea.
In addition, the individual figures, features and aspects are not necessarily shown in the correct size, nor do the proportions between the individual elements have to be fundamentally correct. Some aspects and features are highlighted by showing them enlarged. However, terms such as “above”, “above”, “below”, “below”, “larger”, “smaller” and the like are correctly represented in relation to the elements in the figures. Thus, it is possible to derive such relationships between the elements based on the figures.
The functional cell 1 further comprises a functional element not explicitly shown here, which is arranged inside the housing 2 with electrical connection of at least two of the electrical connection areas. Each functional cell is associated with a functional element by means of which a cell type can be assigned to the cell or by means of which the cell type of the functional cell can be identified. Thus, the functional cell can have different functions according to the functional element arranged inside its housing, which can be combined within a microsystem.
The functional cells 1 are further encapsulated in an interconnect layer 102 or with a potting material to provide an additional mechanical connection between the functional cells. The interconnect layer 102 may further have insulating properties to prevent unwanted short circuits or unwanted contacting within the microsystem 100.
In contrast to a functional cell, the non-electric cell 4 has no functional element in its interior and also no electrical connection areas. However, in areas where the functional cells have the electrical connection areas, the non-electric cell 4 can have webs arranged on the housing sides that can be connected at least mechanically to the electrical connection areas of the functional cells.
A contact force between the opposing leaf springs or contact pads is achieved by arranging the functional cells 1 next to and on top of each other, then casting them in the interconnect layer, and the curing of the interconnect layer, i.e. the shrinkage in the interconnect layer, produces a contact force that acts on the leaf springs or contact pads. In addition, an increased contact force acts between the leaf springs due to the fact that the leaf springs in the illustrated arrangement are bent slightly upwards or slightly downwards and are thus under tension. As a result, two opposing spring forces act on the contact points between the leaf springs.
Before and during the curing of the interconnect layer 101, an additional force can be applied to the functional cells 1 so that the interconnect layer cures in a state in which the electrical connection areas are optimally in electrical connection with each other.
In the case that the coating 6 on the leaf springs or the contact pads contains or consists of a solder connection, the microsystem 100 or at least the electrical connection areas can be additionally heated so that an electrical connection 101 between the functional cells 1 results not only due to a contact force but also due to an intermetallic connection between the electrical connection areas.
By selectively heating the solder bumps 7 or the electrical connection areas, or by heating the entire microsystem 100 of
However, such a soldering process can also be carried out before the functional cells 1 are potted in the interconnect layer 102. In such a case, the solder joint does not have to grow through the material of the interconnect layer 102, but the soldering process is carried out in an upstream step.
In the case that the functional cell 1 is of the cell type of an electric energy conducting cell as shown in
The columns of Table 1 show the electrical connection areas 3a, 3b, 3c, 3d, 3e, 3f and the rows show possible types or specific examples of possible electrical connections between the electrical connection areas. The symbol x indicates that within this type there is a short circuit between the marked electrical connection areas. An empty field, on the other hand, indicates an open or non-existent contact between the electrical connection areas within this type. For example, in the case of the type 1 functional cell, only the first and second terminal regions 3a, 3b are shorted, resulting in a “linear” electrical conductor from left to right or from right to left. In the case of the functional cell of type 2, on the other hand, only the second and the fourth connection areas 3b, 3d are short-circuited, so that an electrical conductor results which connects the electrical connection areas via a corner, i.e. the electrical connection areas on two mutually perpendicular outer walls of the housing 2. By the symbol “ . . . ” in the case of type 7, it is intended to indicate that an electrical conductor can electrically connect the electrical connection areas or at least some of the electrical connection areas 3a, 3b, 3c, 3d, 3e, 3f to each other as desired. The examples shown in the table are accordingly not intended to be restrictive.
In addition to this, at least one further electrical conductor can electrically connect at least part of the remaining electrical connection areas that are not yet connected to each other.
For manufacturing reasons, it is also possible for the housing 2 to have undercuts or a multi-layered structure, similar to the cuboids arranged one on top of the other shown in
However, the housing shapes shown are not intended to be restrictive; other shapes known to those skilled in the art can also be used for the housing.
For example, such a microsystem 100 may form a microrobot or other autonomous microsystem.
The microsystem 100 has a plurality of subregions that perform different functions within the microsystem. The sub-regions are characterized by the fact that the cells therein have the same cell type, are arranged adjacent to each other, and are electrically connected to each other, at least in the case of the functional cells.
The non-electric cells 4 at the left and bottom edges of the microsystem 100 form, for example, an outer armor or skin for the microsystem 100. This makes it possible to protect the functional cells located inside the microsystem from external damage. The non-electric cells 4 inside the microsystem 100, on the other hand, can serve as spacers, for example.
For example, a first subset 103a of functional cells 1a, some of which are arranged adjacent to each other, has a cell type of an electric power generating cell. In particular, the functional cells 1a of the first subset 103a comprise a photocell or a solar cell as a functional element for converting ambient light incident on the microsystem 100 into electrical energy.
The microsystem further comprises a second subset 103b of functional cells formed by electrical energy storing cells 1d. The electrical energy storing cells 1d are arranged adjacent to each other and are in electrical communication with each other. In particular, the functional cells 1d of the second subset 103a include, as a functional element, an accumulator or a capacitor to store the electric energy generated by the electric energy generating cells 1a.
A third subset 103c is formed by electrical energy consuming cells 1c. Together, the functional cells 1c of the third subset form a controller for the microsystem. For this purpose, the functional cells 1c of the third subset 103a may include, in particular, artificial neurons or integrated circuits as a functional element.
Further, the microsystem has a fourth subset 103d of functional cells formed by electrical energy consuming cells 1c. The functional cells of the fourth subset are also arranged adjacent to each other. The electrical energy consuming cells 1c of the fourth subset 103d may comprise, for example, uLEDs or actuators as a functional element, such that the cells of the fourth subset 103d are adapted to emit light or enable movement of the microsystem, for example.
The functional cells of the first, second, third, and fourth subsets are interconnected via a fifth subset 103e of electrical energy conducting cells 1b. Through the electrical energy conducting cells 1b, it is possible to supply all cells with the required energy and thus enable interaction between the individual functional cells or subsets.
For example, the electrical energy conducting cells 1b may pro-vide negative 104 and positive 105 voltage supplies to the fourth subset 103d of electrical energy consuming cells 1c to supply power to the electrical energy consuming cells 1c of the fourth subset 1d. The electrical energy consuming cells 1c of the fourth subset 1d may further include, for example, a switching input for activating and deactivating the cells, which is connected to the electrical energy consuming cells 1c of the third subset 103c via electrical energy conducting cells 1b.
By having larger dimensions of the further electrical energy consuming cell 1e or the housing of the further electrical energy consuming cell 1e, a larger integrated circuit (IC) can be arranged in the cell. This may, for example, increase the computing power of the microsystem 100 because, unlike multiple small integrated circuits in multiple smaller functional cells, a larger integrated circuit (IC) in a larger cell may have greater computing power.
In the case of
Such a situation when the electric energy consuming cells 1c of the fourth subset 103d are heated and thus expanded is shown in
In a further step S2, a base layer 12 is applied to the release layer and this is structured so that several cavities 13 are formed in the release layer. Processes from thin-film technology or thin-film technology, such as physical vapor deposition processes (PVD), chemical vapor deposition processes (CVD), lithography processes, and etching techniques, can be used for this. Furthermore, processes known from printing technology can also be used, such as stereo lithography, jet printing, screen printing, stencil printing, and offset printing.
In a step S3, a functional element 14 is arranged in each of the cavities, which is assigned to a cell type and by which the cell type of the resulting functional cells can be identified. In the case shown, the functional element 14 is an electrical conductor, so that the cell is of the cell type of an electrical energy conducting cell. In addition thereto, an electrically conductive structure 15 is applied to the base layer 12 and adjacent to the functional element 14. The electrically conductive structure 15 is applied such that the electrical connection areas of the functional cell are formed on the base layer. In particular, the application of an electrically conductive structure 15 can be performed, for example, by means of vapor deposition and sputtering of an electrically conductive material and subsequent lift-off processes or etching techniques.
In a step S4, the base layer 12 is then structured and areas of the base layer between the individual functional cells are removed so that they are formed individually on the release layer 11. By structuring the base layer 12, areas of the electrically conductive structure 15 are additionally exposed so that they protrude beyond the material of the base layer and form the electrical connection areas 3 in the later final product.
In a step S5, a cover layer 16 is applied to the base layer 12 or the electrically conductive structure 15 to enclose the functional element 14. The application of the cover layer can again be carried out by means of processes from thin-film technology or thin-film technology or by means of processes known from printing technology.
The cover layer 16 can be applied in particular in such a way that it laterally terminates with the outer edges of the structured base layer 12. Together, the base layer 12 and the cover layer 16 form the housing 2 of the functional cells 1, in the interior of which a functional element 14 is arranged and on the outer surfaces of which the electrical connection areas 3 are arranged.
In a step Sb, a subcarrier structure 108 is arranged at a defined distance above the adhesive layer 107, the subcarrier structure 108 comprising a plurality of regions 109a, 109b, 109c. The regions 109a, 109b, 109c are each populated with functional cells of different cell types. For example, a first region 109a is populated with electrical energy generating cells 1a, a second region 109b is populated with electrical energy conducting cells 1b, and a third region 109c is populated with electrical energy consuming cells 1c. However, the subcarrier structure 108 may include more than the three regions shown in the figure, and thus may be populated with a greater variety of different types and designs of functional cells.
For example, the subcarrier structure may be in the form of a subcarrier on which the functional elements are arranged in different areas. However, the subcarrier structure may also be in the form of a feeder and the different areas may be in the form of individual subcarriers or rollers on which the functional cells are arranged.
The subcarrier structure 108 is arranged above the adhesive layer 107 and can be moved parallel to the adhesive layer 107 in the horizontal direction h. At the same time, the functional cells 1a, 1b, 1c are irradiated with light in a desired sequence so that they detach from the subcarrier structure 108 and fall onto the adhesive layer 107 in the vertical direction v. By moving the subcarrier structure along the horizontal direction h and irradiating the functional cells on the regions of the subcarrier structure 108 selectively, the functional cells can be arranged in a desired range order side by side in a layer on the adhesive layer 107. By irradiating the functional cells, they experience an impulse and fall in the vertical direction v onto the adhesive layer 107, on which they adhere to the desired position or sink into the material of the adhesive layer 107. Likewise, it is possible that not only individual functional cells are irradiated and detached, but also several functional cells can be irradiated simultaneously, so that several functional cells can be placed on the adhesive layer at the same time. Individual process steps can be carried out in a similar way to a LIFT process (Laser Induced Forward Transfer) or inkjet printing process, for example.
To create a further layer with functional cells on the resulting layer, the functional cells are encapsulated in a interconnect layer 102. In particular, the interconnect layer 102 can comprise the same material as the adhesive layer 107.
In a further step Sc, the subcarrier structure 108 is arranged at a defined distance above the first layer of functional cells and can now be moved in the horizontal direction h parallel to the adhesive layer 107 or the first layer of functional cells. At the same time, the functional cells 1a, 1b, 1c are irradiated with light in a desired sequence so that they detach from the subcarrier structure 108 and fall onto the first layer of functional cells or onto the interconnect layer 102 in the vertical direction v. By moving the subcarrier structure along the horizontal direction h and selectively irradiating the functional cells on the regions of the subcarrier structure 108, the functional cells can be arranged in a desired range sequence side by side in another layer on the first layer of functional cells or on the interconnect layer 102.
The first and second layers can comprise a different sequence of functional cells arranged next to each other and a different number of functional cells. By creating multiple layers, any shape can be created that the final microsystem will have.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2021 112 018.7 | May 2021 | DE | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2022/062172 | 5/5/2022 | WO |
