the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

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H01L25/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having photonic die and electronic die
- Patent number 12,368,147
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic device
- Patent number 12,368,108
- Issue date Jul 22, 2025
- Canon Kabushiki Kaisha
- Nobuaki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,368,121
- Issue date Jul 22, 2025
- SK hynix Inc.
- Yu Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,368,148
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having discharge patterns in a pad area to discharge...
- Patent number 12,360,627
- Issue date Jul 15, 2025
- Samsung Display Co., Ltd.
- Jeongoh Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,362,302
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,362,303
- Issue date Jul 15, 2025
- Kioxia Corporation
- Nobuaki Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,364,100
- Issue date Jul 15, 2025
- LG Display Co., Ltd.
- Jin-Young Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper sensor for 3-dimensional die stack
- Patent number 12,361,808
- Issue date Jul 15, 2025
- Xilinx, Inc.
- Thomas Paul Leboeuf
- G08 - SIGNALLING
Information Patent Grant
Direct-bonded native interconnects and active base die
- Patent number 12,362,182
- Issue date Jul 15, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,342
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,354,969
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,354,999
- Issue date Jul 8, 2025
- Kioxia Corporation
- Masayuki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,933
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including memory chip and peripheral memory chip and...
- Patent number 12,354,985
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jooyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive via structure
- Patent number 12,354,989
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete three-dimensional processor
- Patent number 12,355,023
- Issue date Jul 8, 2025
- Hong Kong HaiCun Technology Co., Limited
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 12,354,982
- Issue date Jul 8, 2025
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and fabrication method
- Patent number 12,354,994
- Issue date Jul 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhiyong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,355,003
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Seungyoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,997
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Hsiang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and semiconductor storage device
- Patent number 12,349,358
- Issue date Jul 1, 2025
- Kioxia Corporation
- Tadayoshi Uechi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with flipped high bandwidth memory device
- Patent number 12,347,780
- Issue date Jul 1, 2025
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package die stacking system and method
- Patent number 12,347,810
- Issue date Jul 1, 2025
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE LAYER MEMORY DEVICE
- Publication number 20250234564
- Publication date Jul 17, 2025
- Rambus Inc.
- Thomas VOGELSANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250233048
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...
- Publication number 20250233066
- Publication date Jul 17, 2025
- NVIDIA Corp.
- Mahmut Ersin Sinangil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250234554
- Publication date Jul 17, 2025
- Yunjo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250233030
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
- Publication number 20250233033
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- HUNG-TA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY
- Publication number 20250233044
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...
- Publication number 20250234543
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...
- Publication number 20250234545
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...
- Publication number 20250232828
- Publication date Jul 17, 2025
- Samsung Electronics Co., LTD
- Myeong-Woo Lee
- G11 - INFORMATION STORAGE
Information Patent Application
NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME
- Publication number 20250234563
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Guyeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
- Publication number 20250233114
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20250233039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
- Publication number 20250233095
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
- Publication number 20250226340
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING MERGED SUB ARRAY
- Publication number 20250227926
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Changyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE OF RF FRONT-END MODULE
- Publication number 20250226350
- Publication date Jul 10, 2025
- RADROCK (CHONGQING) MICROELECTRONICS CO., LTD.
- Jianxing Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...
- Publication number 20250226331
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226349
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Minseok Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING...
- Publication number 20250226373
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YOU-CHENG LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Gate Contact Formation for Vertical Transistors
- Publication number 20250227962
- Publication date Jul 10, 2025
- BeSang, Inc.
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure having photonic die and electronic die

Electronic module and electronic device

Chip package structure with ring structure

Embedded cooling systems for advanced device packaging and methods...

Semiconductor memory device

Info packages including thermal dissipation blocks

High bandwidth die to die interconnect with package area reduction

Display device having discharge patterns in a pad area to discharge...

Semiconductor devices and data storage systems including the same

Laser ablation-based surface property modification and contaminatio...

Semiconductor memory device

Display device

Tamper sensor for 3-dimensional die stack

Direct-bonded native interconnects and active base die

Semiconductor devices and methods of manufacturing

Semiconductor package

Semiconductor device and method of manufacture

Semiconductor device and method of manufacturing the same

Semiconductor device

Memory device including memory chip and peripheral memory chip and...

Package structure with conductive via structure

Discrete three-dimensional processor

Memory devices with backside bond pads under a memory array

Three-dimensional memory device and fabrication method

Semiconductor devices and data storage systems including the same

Package structure and manufacturing method thereof

Signal routing between memory die and logic die for performing oper...

Semiconductor device and semiconductor storage device

Integrated circuit package with flipped high bandwidth memory device

Semiconductor device package die stacking system and method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MULTI-DIE LAYER MEMORY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR MODULE

PACKAGING STRUCTURE AND PREPARING METHOD THEREOF

MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...

3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...

NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME

APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS

METHOD OF FABRICATING PACKAGE STRUCTURE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE INCLUDING MERGED SUB ARRAY

PACKAGING STRUCTURE OF RF FRONT-END MODULE

Semiconductor Device and Method of Making a Molded IPD-CoW

BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING...

Methods of Gate Contact Formation for Vertical Transistors

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

Electronic Component

SEMICONDUCTOR STRUCTURE