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the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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H01L25/18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor structure having photonic die and electronic die
Patent number
12,368,147
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and electronic device
Patent number
12,368,108
Issue date
Jul 22, 2025
Canon Kabushiki Kaisha
Nobuaki Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure with ring structure
Patent number
12,368,080
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded cooling systems for advanced device packaging and methods...
Patent number
12,368,087
Issue date
Jul 22, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device
Patent number
12,368,121
Issue date
Jul 22, 2025
SK hynix Inc.
Yu Jin Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info packages including thermal dissipation blocks
Patent number
12,368,148
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth die to die interconnect with package area reduction
Patent number
12,368,137
Issue date
Jul 22, 2025
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having discharge patterns in a pad area to discharge...
Patent number
12,360,627
Issue date
Jul 15, 2025
Samsung Display Co., Ltd.
Jeongoh Jin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor devices and data storage systems including the same
Patent number
12,362,302
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Moorym Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser ablation-based surface property modification and contaminatio...
Patent number
12,362,340
Issue date
Jul 15, 2025
Intel Corporation
Denis Myasishchev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device
Patent number
12,362,303
Issue date
Jul 15, 2025
Kioxia Corporation
Nobuaki Okada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,364,100
Issue date
Jul 15, 2025
LG Display Co., Ltd.
Jin-Young Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tamper sensor for 3-dimensional die stack
Patent number
12,361,808
Issue date
Jul 15, 2025
Xilinx, Inc.
Thomas Paul Leboeuf
G08 - SIGNALLING
Information
Patent Grant
Direct-bonded native interconnects and active base die
Patent number
12,362,182
Issue date
Jul 15, 2025
Adeia Semiconductor Inc.
Javier A. DeLaCruz
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor devices and methods of manufacturing
Patent number
12,362,341
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chang-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,362,342
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,354,969
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
12,354,999
Issue date
Jul 8, 2025
Kioxia Corporation
Masayuki Miura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,354,933
Issue date
Jul 8, 2025
Kabushiki Kaisha Toshiba
Toru Sugiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device including memory chip and peripheral memory chip and...
Patent number
12,354,985
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Jooyong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with conductive via structure
Patent number
12,354,989
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Liang Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Discrete three-dimensional processor
Patent number
12,355,023
Issue date
Jul 8, 2025
Hong Kong HaiCun Technology Co., Limited
Guobiao Zhang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Memory devices with backside bond pads under a memory array
Patent number
12,354,982
Issue date
Jul 8, 2025
Eric N. Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device and fabrication method
Patent number
12,354,994
Issue date
Jul 8, 2025
Yangtze Memory Technologies Co., Ltd.
Zhiyong Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and data storage systems including the same
Patent number
12,355,003
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Seungyoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,354,997
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Hsiang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal routing between memory die and logic die for performing oper...
Patent number
12,354,649
Issue date
Jul 8, 2025
Micron Technology, Inc.
Aliasger T. Zaidy
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device and semiconductor storage device
Patent number
12,349,358
Issue date
Jul 1, 2025
Kioxia Corporation
Tadayoshi Uechi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with flipped high bandwidth memory device
Patent number
12,347,780
Issue date
Jul 1, 2025
Intel Corporation
Krishna Vasanth Valavala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package die stacking system and method
Patent number
12,347,810
Issue date
Jul 1, 2025
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250233093
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jungmin Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE LAYER MEMORY DEVICE
Publication number
20250234564
Publication date
Jul 17, 2025
Rambus Inc.
Thomas VOGELSANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20250233048
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Juno Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...
Publication number
20250233066
Publication date
Jul 17, 2025
NVIDIA Corp.
Mahmut Ersin Sinangil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES
Publication number
20250234554
Publication date
Jul 17, 2025
Yunjo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20250233030
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Hwanjoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
Publication number
20250233033
Publication date
Jul 17, 2025
TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
HUNG-TA LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY
Publication number
20250233044
Publication date
Jul 17, 2025
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...
Publication number
20250234543
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Tatsuya HINOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...
Publication number
20250234545
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Masanori TSUTSUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...
Publication number
20250232828
Publication date
Jul 17, 2025
Samsung Electronics Co., LTD
Myeong-Woo Lee
G11 - INFORMATION STORAGE
Information
Patent Application
NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME
Publication number
20250234563
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Guyeol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
Publication number
20250233114
Publication date
Jul 17, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
Publication number
20250233039
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
Publication number
20250233053
Publication date
Jul 17, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
Publication number
20250233095
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jaesic Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICOND...
Publication number
20250226340
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Keum Hee Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
Publication number
20250226243
Publication date
Jul 10, 2025
SAMSUNG DISPLAY CO., LTD.
Dong Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226374
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Yongbum Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE INCLUDING MERGED SUB ARRAY
Publication number
20250227926
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Changyoung LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE OF RF FRONT-END MODULE
Publication number
20250226350
Publication date
Jul 10, 2025
RADROCK (CHONGQING) MICROELECTRONICS CO., LTD.
Jianxing Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
Publication number
20250226334
Publication date
Jul 10, 2025
STATS ChipPAC Pte Ltd.
Kai Chong Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...
Publication number
20250226331
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Seokbeom YONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226349
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Minseok Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING...
Publication number
20250226373
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
YOU-CHENG LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Gate Contact Formation for Vertical Transistors
Publication number
20250227962
Publication date
Jul 10, 2025
BeSang, Inc.
Sang-Yun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
Publication number
20250226290
Publication date
Jul 10, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component
Publication number
20250218989
Publication date
Jul 3, 2025
INTELPRO INC.
Lung-Kun Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250219010
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS