the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

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H01L25/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip structure and manufacturing method therefor, display apparatus
- Patent number 12,176,377
- Issue date Dec 24, 2024
- BOE Technology Group Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,178,055
- Issue date Dec 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,176,309
- Issue date Dec 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yanhong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,176,310
- Issue date Dec 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,176,337
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including upper and lower selectors
- Patent number 12,178,046
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor package and method of making an optical sensor package
- Patent number 12,176,220
- Issue date Dec 24, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer
- Patent number 12,170,249
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics processing unit and high bandwidth memory integration usin...
- Patent number 12,170,275
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,170,257
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,170,258
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,165,949
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Munsik Ham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a lower chip including a peripheral...
- Patent number 12,166,000
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hoonjoo Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,166,026
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-bonded memory stacks with copper-bonded interconnection memo...
- Patent number 12,166,027
- Issue date Dec 10, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,165,979
- Issue date Dec 10, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429152
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Takashi KATSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING PERIPHERAL CIRCUIT AND CELL ARR...
- Publication number 20240429187
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Homoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429197
- Publication date Dec 26, 2024
- SAMSUNG-RO, ELECTRONICS CO., LTD
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, DISPLAY DEVICE, ELECTRONIC DEVICE, AND MANUF...
- Publication number 20240429263
- Publication date Dec 26, 2024
- KYOCERA CORPORATION
- Takeshi KAMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE GATE DIELECTRICS FOR MONOLITHIC STACKED DEVICES
- Publication number 20240429277
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429174
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240431122
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Hongjun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240429220
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier with Stack-Stack Connection for Connecting Compon...
- Publication number 20240429175
- Publication date Dec 26, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20240429221
- Publication date Dec 26, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS
- Publication number 20240429223
- Publication date Dec 26, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
- Publication number 20240431121
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Yunseok Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY DEVICE, WEARABLE DEVICE, AND METHOD...
- Publication number 20240421142
- Publication date Dec 19, 2024
- Sharp Kabushiki Kaisha
- YOSHIHIRO UETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421143
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Dongjoo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT ARRAY, MASK, AND LIGHT EMITTING ELEMENT MANU...
- Publication number 20240421180
- Publication date Dec 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Myeong Su SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421140
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240420764
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Hiroshi MAEJIMA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...
- Publication number 20240422973
- Publication date Dec 19, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Shinsuke YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING NON-VOLATILE MEMORY CELLS, AND RELATED MIC...
- Publication number 20240422993
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-L...
- Publication number 20240422995
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Mustafa BADAROGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421031
- Publication date Dec 19, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240421016
- Publication date Dec 19, 2024
- Samsung Electronics Co.,Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421141
- Publication date Dec 19, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING

the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip structure and manufacturing method therefor, display apparatus

3D semiconductor memory devices and structures

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Half-bridge module for an inverter of an electric drive of an elect...

Semiconductor devices and methods of manufacturing

Semiconductor package with metal posts from structured leadframe

Semiconductor chip structure

Semiconductor devices including upper and lower selectors

Logic drive with brain-like elasticity and integrality based on sta...

Optical sensor package and method of making an optical sensor package

Semiconductor package

3D chip package based on vertical-through-via connector

Semiconductor package including interposer

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor packages and methods of forming same

Integrated high voltage electronic device with high relative permit...

Graphics processing unit and high bandwidth memory integration usin...

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Integrated circuit assemblies with direct chip attach to circuit bo...

Display device

Semiconductor device including a lower chip including a peripheral...

Semiconductor devices and methods of manufacturing

Semiconductor packages and methods for forming the same

Copper-bonded memory stacks with copper-bonded interconnection memo...

Signal routing between memory die and logic die

Display device including anisotropic conductive film (ACF)

Packaging substrate and semiconductor apparatus comprising same

Image pickup device and electronic apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE INCLUDING PERIPHERAL CIRCUIT AND CELL ARR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE, DISPLAY DEVICE, ELECTRONIC DEVICE, AND MANUF...

MULTIPLE GATE DIELECTRICS FOR MONOLITHIC STACKED DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor structure and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Component Carrier with Stack-Stack Connection for Connecting Compon...

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS

MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME

LIGHT-EMITTING DEVICE, DISPLAY DEVICE, WEARABLE DEVICE, AND METHOD...

SEMICONDUCTOR PACKAGE

LIGHT EMITTING ELEMENT ARRAY, MASK, AND LIGHT EMITTING ELEMENT MANU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...

MEMORY DEVICES INCLUDING NON-VOLATILE MEMORY CELLS, AND RELATED MIC...

DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-L...

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC