the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

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H01L25/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,341,131
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hyunmog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive patterns of redistribution...
- Patent number 12,341,091
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semifinished product for populating with components and, method for...
- Patent number 12,341,127
- Issue date Jun 24, 2025
- Siemens Aktiengesellschaft
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, and methods of forming microelectronic dev...
- Patent number 12,341,134
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods of the same
- Patent number 12,334,471
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,334,477
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,336,287
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Dae Hwan Jang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device
- Patent number 12,336,359
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Joo Woan Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, display device, and manufacturing method of display...
- Patent number 12,336,413
- Issue date Jun 17, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ping Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking power delivery device dies
- Patent number 12,334,488
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,327,807
- Issue date Jun 10, 2025
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,327,827
- Issue date Jun 10, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid switch multi-chip power module for a vehicle battery
- Patent number 12,328,078
- Issue date Jun 10, 2025
- GM Global Technology Operations LLC
- Benjamin S. Ngu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous package structures with photonic devices
- Patent number 12,326,592
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,328,867
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a bit-line-bias vertical...
- Patent number 12,322,452
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Naoto Norizuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 12,315,860
- Issue date May 27, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,317,494
- Issue date May 27, 2025
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System packaging for cellular modem and transceiver system of heter...
- Patent number 12,315,853
- Issue date May 27, 2025
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,859
- Issue date May 27, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
COOLING STRUCTURE OF A POWER SUPPLY MODULE
- Publication number 20250201654
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Takami MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Module
- Publication number 20250201723
- Publication date Jun 19, 2025
- Graphcore Limited
- Stephen FELIX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250201727
- Publication date Jun 19, 2025
- CXMT Corporation
- Qingchun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC PACKAGE
- Publication number 20250201643
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MODULAR HYBRID BONDING PACKAGE ARCHITECTURE
- Publication number 20250201795
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250201745
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Yiyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES FOR HIGH CAPAC...
- Publication number 20250201793
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, DIE STRUCTURE AND METHOD FOR FORMING THE PACKAGE...
- Publication number 20250201798
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM ARCHITECTURE HAVING EFFICIENT BUS CONNECTIONS
- Publication number 20250201769
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Seong Ju LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME, AN...
- Publication number 20250201642
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Donggyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A STACK STRUCTURE
- Publication number 20250203882
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Young Ock HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDU...
- Publication number 20250201744
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Seokcheon BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20250202379
- Publication date Jun 19, 2025
- MINEBEA POWER SEMICONDUCTOR DEVICE INC.
- Akira MIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
- Publication number 20250201761
- Publication date Jun 19, 2025
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA AND POWER ISOLATION
- Publication number 20250201792
- Publication date Jun 19, 2025
- Nicola Bertoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201794
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Dissipating Structures for Semiconductor Devices and Methods o...
- Publication number 20250201659
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ELECTRODE AND ISOLATION PATTERN AND...
- Publication number 20250203864
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Won Geun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL CHANNEL
- Publication number 20250203873
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Dongsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Computing-in-Memory Chip Architecture, Packaging Method, and Apparatus
- Publication number 20250203881
- Publication date Jun 19, 2025
- Hangzhou Zhicun (Witmem) Technology Co., Ltd.
- Xinjie GUO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP, LOGIC CHIP, CHIP-STACKED STRUCTURE, AND MEMORY
- Publication number 20250201796
- Publication date Jun 19, 2025
- CXMT Corporation
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20250201797
- Publication date Jun 19, 2025
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Artificial Intelligence Engine and Memory Interoperation
- Publication number 20250192128
- Publication date Jun 12, 2025
- Google LLC
- Hongil Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250192079
- Publication date Jun 12, 2025
- AUO Corporation
- Yi-Cheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194110
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jihye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THERMALLY-CONDUCTIVE FILLER IN A...
- Publication number 20250191993
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chesheng KUNG
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor device stack-up with bulk substrate material to mitig...

Semiconductor packages having conductive patterns of redistribution...

Semifinished product for populating with components and, method for...

Microelectronic devices, and methods of forming microelectronic dev...

Semiconductor devices and manufacturing methods of the same

Semiconductor packages

Encapsulated package including device dies connected via interconne...

Display device and tiled display device including the same

Display device

Display panel, display device, and manufacturing method of display...

Stacking power delivery device dies

Lthc as charging barrier in info package formation

Logic drive based on chip scale package comprising standardized com...

High density substrate routing in package

3D system integration

Microelectronic assemblies

Hybrid switch multi-chip power module for a vehicle battery

Heterogeneous package structures with photonic devices

Memory devices having vertical transistors and methods for forming...

Power module semiconductor device and inverter equipment, and fabri...

Three-dimensional memory device including a bit-line-bias vertical...

Semiconductor storage device including staggered semiconductor memo...

Semiconductor memory device

Integrated circuit package for high bandwidth memory

Semiconductor storage device

Switching device and electronic circuit

Methods of manufacturing a fan-out panel level semiconductor package

System packaging for cellular modem and transceiver system of heter...

Semiconductor memory device

Patents Applicationslast 30 patents

COOLING STRUCTURE OF A POWER SUPPLY MODULE

A Module

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

STACKED IC PACKAGE

SYSTEM AND METHODS FOR A MODULAR HYBRID BONDING PACKAGE ARCHITECTURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES FOR HIGH CAPAC...

PACKAGE STRUCTURE, DIE STRUCTURE AND METHOD FOR FORMING THE PACKAGE...

COMPUTING SYSTEM ARCHITECTURE HAVING EFFICIENT BUS CONNECTIONS

SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME, AN...

SEMICONDUCTOR DEVICE INCLUDING A STACK STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDU...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION

DATA AND POWER ISOLATION

SEMICONDUCTOR PACKAGE

Heat-Dissipating Structures for Semiconductor Devices and Methods o...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING ELECTRODE AND ISOLATION PATTERN AND...

SEMICONDUCTOR DEVICE INCLUDING VERTICAL CHANNEL

Computing-in-Memory Chip Architecture, Packaging Method, and Apparatus

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

MEMORY CHIP, LOGIC CHIP, CHIP-STACKED STRUCTURE, AND MEMORY

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Artificial Intelligence Engine and Memory Interoperation

ANTENNA DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY WITH THERMALLY-CONDUCTIVE FILLER IN A...