the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

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H01L25/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,308,345
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,309,930
- Issue date May 20, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting diode unit for display comprising plurality of pixel...
- Patent number 12,310,161
- Issue date May 20, 2025
- SEOUL VIOSYS CO., LTD.
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compute in memory three-dimensional non-volatile nor memory for neu...
- Patent number 12,307,354
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Yanli Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including outer conductive plate
- Patent number 12,300,625
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,629
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 12,300,651
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having connection unit
- Patent number 12,300,596
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Myongsoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,300,648
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,300,650
- Issue date May 13, 2025
- Kioxia Corporation
- Keisuke Nakatsuka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device including capacitor with a dielectric f...
- Patent number 12,302,550
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Seung Jae Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable random-access memory (RAM) array including through-sil...
- Patent number 12,300,688
- Issue date May 13, 2025
- Jianwen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for protecting an optoelectronic device against electrostati...
- Patent number 12,300,521
- Issue date May 13, 2025
- Aledia
- Frédéric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor package and smart card having the same
- Patent number 12,294,000
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting display apparatus and multi-screen display apparatus...
- Patent number 12,295,229
- Issue date May 6, 2025
- LG Display Co., Ltd.
- KyungMin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package including memory array
- Patent number 12,293,999
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing process including forming a bond...
- Patent number 12,288,719
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Takuya Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with signal bump and dummy bump, semiconductor p...
- Patent number 12,288,762
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,779
- Issue date Apr 29, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Kei Takahashi
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
- Publication number 20250167192
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE
- Publication number 20250167193
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING WORD LINE SIGNAL PATH
- Publication number 20250169066
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Daesun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250169053
- Publication date May 22, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...
- Publication number 20250167191
- Publication date May 22, 2025
- International Business Machines Corporation
- Robert K. Montoye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS
- Publication number 20250167194
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS
- Publication number 20250167195
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
POWER MODULE
- Publication number 20250167674
- Publication date May 22, 2025
- Mitsubishi Heavy Industries, Ltd.
- Takashi MASUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblage module 3D
- Publication number 20250167057
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Manon PORLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICE
- Publication number 20250169080
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Bonjae KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250167161
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH THROUGH VIA
- Publication number 20250167077
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250169071
- Publication date May 22, 2025
- SK HYNIX INC.
- Do Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169083
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- IN JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component and Method of Operating Such a Component
- Publication number 20250164551
- Publication date May 22, 2025
- TDK-Micronas GmbH
- Thilo Rubehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE
- Publication number 20250167068
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinkyu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
- Publication number 20250167072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167098
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CHIP, MEMORY CHIP, CHIP STACK STRUCTURE, AND MEMORY
- Publication number 20250158003
- Publication date May 15, 2025
- CXMT CORPORATION
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND TESTING METHOD
- Publication number 20250155498
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao WANG
- G01 - MEASURING TESTING
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157937
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Takahiro ARAKI
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Power module package for direct cooling multiple power modules

Display apparatus

Light-emitting diode unit for display comprising plurality of pixel...

Semiconductor die with tapered sidewall in package

Packaging architecture for disaggregated integrated voltage regulators

Method for manufacturing display device and apparatus for manufactu...

Semiconductor package

Semiconductor package

Compute in memory three-dimensional non-volatile nor memory for neu...

Semiconductor package system and related methods

Semiconductor package including outer conductive plate

Dual cool power module with stress buffer layer

Semiconductor package and method of fabricating the same

Electronic device, package structure and electronic manufacturing m...

Semiconductor package and method of fabricating the same

Display device having connection unit

Three-dimensional memory devices and methods for forming the same

Semiconductor memory device

Semiconductor memory device including capacitor with a dielectric f...

Configurable random-access memory (RAM) array including through-sil...

Method for protecting an optoelectronic device against electrostati...

Photonics integrated circuit package

Fingerprint sensor package and smart card having the same

Light emitting display apparatus and multi-screen display apparatus...

3D semiconductor package including memory array

Integrated circuit package and method of forming same

Semiconductor device manufacturing process including forming a bond...

Semiconductor chip with signal bump and dummy bump, semiconductor p...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE

SEMICONDUCTOR DEVICE INCLUDING WORD LINE SIGNAL PATH

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...

REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS

REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS

POWER MODULE

Structure and Method for Fabricating a Computing System with an Int...

Assemblage module 3D

ELECTRONIC DEVICE

VERTICAL MEMORY DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR STRUCTURES WITH THROUGH VIA

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Electronic Component and Method of Operating Such a Component

MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LOGIC CHIP, MEMORY CHIP, CHIP STACK STRUCTURE, AND MEMORY

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

PACKAGE STRUCTURE FOR HEAT DISSIPATION

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND TESTING METHOD

POWER CONVERSION DEVICE