The technique of the present disclosure relates to a micromirror device and an optical scanning device.
A micromirror device (also referred to as a microscanner) is known as one of micro electro mechanical systems (MEMS) devices manufactured using the silicon (Si) nanofabrication technique. Since the micromirror device is small and has low power consumption, it is expected to have a wide range of applications in laser displays, laser projectors, optical coherence tomography, and the like.
There are various methods for driving the micromirror device, and a piezoelectric drive type using deformation of a piezoelectric material is promising since the generated torque is higher than that in other methods and a high scan angle can be obtained. In particular, in a case where a high scan angle is required, such as in a laser display, a higher scan angle can be obtained by resonantly driving the micromirror device of the piezoelectric drive type.
A general micromirror device used in a laser display comprises a mirror portion and a piezoelectric actuator (see, for example, JP2017-132281A). The mirror portion is swingable around a first axis and a second axis that are orthogonal to each other. The actuator is a driving part that causes the mirror portion to swing around a first axis and a second axis in accordance with a driving voltage supplied from the outside.
As performance indicators of the laser display, resolution and viewing angle are mentioned. The resolution and the viewing angle are greatly affected by the swing frequency and the deflection angle of the mirror portion. For example, in a Lissajous scan type laser display, a mirror portion performs two-dimensional optical scanning by simultaneously swinging around a first axis and a second axis at different frequencies. In this case, as the deflection angle of the mirror portion increases, the scanning area of light increases, and a larger image can be displayed with a shorter optical path length.
In order to increase the deflection angle of the mirror portion, the simplest method is to increase the area of the driving part to increase the driving torque. However, increasing the area of the driving part leads to an increase in the size of the micromirror device, which is contrary to the miniaturization required for the micromirror device for a laser display application.
In order to solve this problem, in the micromirror device using the resonance driving, the deflection angle of the mirror portion is often improved by adjusting the resonance mode. For example, in the resonance mode in which the mirror portion and the driving part swing in anti-phases, the gain of the deflection angle with respect to the applied voltage to the driving part is large. However, in the anti-phase resonance mode, a large stress is applied to the swing shaft, and thus it is not easy to increase the deflection angle from the viewpoint of durability.
An object of the technology of the present disclosure is to provide a micromirror device and an optical scanning device that can realize a large deflection angle without increasing an area of a driving part.
In order to achieve the above object, a micromirror device of the present disclosure comprises: a mirror portion that has a reflecting surface for reflecting incident light; a pair of first support portions that are connected to the mirror portion on a first axis located in a plane including the reflecting surface in a stationary state of the mirror portion and that support the mirror portion to be swingable around the first axis; a pair of movable frames that are connected to the first support portions and that face each other across the first axis; a pair of second support portions that are connected to the movable frames on a second axis provided in the plane and perpendicular to the first axis and that support the mirror portion, the first support portions, and the movable frames to be swingable around the second axis; a driving part that is connected to the second support portions and that is disposed to surround the movable frames; a fixed frame that is disposed to surround the driving part; and a pair of connecting portions that connect the driving part and the fixed frame, in which the first support portion has a shape that is line-symmetrical about the first axis, the second support portion has a shape that is line-symmetrical about the second axis and includes a second swing shaft disposed on the second axis and a pair of second coupling parts disposed at positions facing each other across the second axis, one end of the second swing shaft is connected to the movable frame and the other end of the second swing shaft is connected to the second coupling part, the second coupling part extends in a direction from an outer end portion of the second swing shaft on the second axis toward the mirror portion and is connected to the driving part in a region adjacent to the movable frame, and the connecting portion has a shape that is line-symmetrical about the second axis and supports the driving part to be swingable around the second axis.
It is preferable that the driving part includes a pair of first actuators that are connected to the second support portion, that face each other across the second axis, and that each include a piezoelectric element, and a pair of second actuators that are disposed to surround the first actuators, that face each other across the first shaft, and that each include a piezoelectric element.
It is preferable that the connecting portions are disposed on the second axis.
It is preferable that the first support portion includes a first swing shaft having a shape that is line-symmetrical about the first axis, and disposed on the first axis, and a pair of first coupling parts disposed at positions facing each other across the first axis.
It is preferable that one end of the first swing shaft is connected to the mirror portion and the other end of the first swing shaft is connected to the first coupling part, and the first coupling part extends in a direction from an outer end portion of the first swing shaft on the first axis toward the mirror portion, is bent in an outer circumferential direction in a region adjacent to the mirror portion, and is bent again in a region adjacent to the driving part to be connected to the movable frame.
It is preferable that one end of the first swing shaft is connected to the mirror portion and the other end of the first swing shaft is connected to the first coupling part, and the first coupling part extends in a direction from an outer end portion of the first swing shaft on the first axis toward the mirror portion and is connected to the movable frame in a region adjacent to the mirror portion.
It is preferable that the first coupling part protrudes from a portion connected to the movable frame to an outer end portion of the first swing shaft on the first axis in a direction of the first axis.
It is preferable that the first coupling part is bent in an outward direction from an outer end portion of the first swing shaft on the first axis, forms an annular region in a region adjacent to the movable frame, further extends from the annular region along the first axis, and extends along the driving part in a region adjacent to the driving part to be connected to the movable frame.
It is preferable that the pair of first coupling parts are connected in a region adjacent to the driving part.
According to the present disclosure, there is provided an optical scanning device comprising: the micromirror device described above; and a processor that drives the driving part, in which the processor applies a drive signal to the driving part to cause the mirror portion to swing around each of the first axis and the second axis.
According to the technology of the present disclosure, it is possible to provide a micromirror device and an optical scanning device that can realize a large deflection angle without increasing the area of the driving part.
Exemplary embodiments according to the technique of the present disclosure will be described in detail based on the following figures, wherein:
An example of an embodiment according to the technology of the present disclosure will be described with reference to the accompanying drawings.
The MMD 2 is a piezoelectric biaxial drive-type micromirror device capable of allowing a mirror portion 20 (see
The light source 3 is a laser device that emits, for example, laser light as the light beam LB. It is preferable that the light source 3 emits the light beam LB perpendicularly to a reflecting surface 20A (see
The driving controller 4 outputs a drive signal to the light source 3 and the MMD 2 based on optical scanning information. The light source 3 generates the light beam LB based on the input drive signal and emits the light beam LB to the MMD 2. The MMD 2 allows the mirror portion 20 to swing around the first axis a1 and the second axis a2 based on the input drive signal.
As will be described in detail below, the driving controller 4 allows the mirror portion 20 to resonate around the first axis a1 and the second axis a2, so that the surface to be scanned 5 is scanned with the light beam LB reflected by the mirror portion 20 such that a Lissajous waveform is drawn. This optical scanning type is called a Lissajous scanning type.
The optical scanning device 10 is applied to, for example, a Lissajous scanning type laser display. Specifically, the optical scanning device 10 can be applied to a laser scanning display such as augmented reality (AR) glass or virtual reality (VR) glass.
The ROM 41 is a non-volatile storage device and stores a program for the CPU 40 to execute processing and data such as the optical scanning information described above. The RAM 42 is a volatile storage device that temporarily holds a program and data.
The light source driver 43 is an electric circuit that outputs a drive signal to the light source 3 under the control of the CPU 40. In the light source driver 43, the drive signal is a driving voltage for controlling the irradiation timing and the irradiation intensity of the light source 3.
The MMD driver 44 is an electric circuit that outputs a drive signal to the MMD 2 under the control of the CPU 40. In the MMD driver 44, the drive signal is a driving voltage for controlling the timing, cycle, and deflection angle for allowing the mirror portion 20 of the MMD 2 to swing.
The CPU 40 controls the light source driver 43 and the MMD driver 44 based on the optical scanning information. The optical scanning information is information including the scanning pattern of the light beam LB with which the surface to be scanned 5 is scanned and the light emission timing of the light source 3.
Next, the configuration of the MMD 2 according to a first embodiment will be described with reference to
As shown in
The mirror portion 20 has a reflecting surface 20A for reflecting incident light. The reflecting surface 20A is provided on one surface of the mirror portion 20, and is formed of a metal thin film such as gold (Au) and aluminum (Al). The shape of the reflecting surface 20A is, for example, circular with the intersection of the first axis a1 and the second axis a2 as the center.
The first axis a1 and the second axis a2 exist, for example, in a plane including the reflecting surface 20A in a case where the mirror portion 20 is stationary. The planar shape of the MMD 2 is rectangular, line-symmetrical about the first axis a1, and line-symmetrical about the second axis a2.
The pair of first support portions 21 are disposed at positions facing each other across the second axis a2, and have a shape that is line-symmetrical about the second axis a2. In addition, each of the first support portions 21 has a shape that is line-symmetrical about the first axis a1. The first support portions 21 are connected to the mirror portion 20 on the first axis a1, and swingably support the mirror portion 20 around the first axis a1.
The pair of movable frames 22 are disposed at positions facing each other across the first axis a1, and have a shape that is line-symmetrical about the first axis a1. Each of the movable frames 22 has a shape that is line-symmetrical about the second axis a2. In addition, each of the movable frames 22 is curved along the outer periphery of the mirror portion 20. Both ends of the movable frame 22 are connected to the first support portion 21.
The first support portion 21 and the movable frame 22 are connected to each other to surround the mirror portion 20. The mirror portion 20, the first support portion 21, and the movable frame 22 constitute a movable portion 60.
The pair of second support portions 23 are disposed at positions facing each other across the first axis a1, and have a shape that is line-symmetrical about the first axis a1. Each of the second support portions 23 has a shape that is line-symmetrical about the second axis a2. The second support portion 23 is connected to the movable frame 22 on the second axis a2, and swingably supports the movable portion 60 having the mirror portion 20 around the second axis a2. In addition, both ends of the second support portion 23 are connected to the first actuator 24.
The pair of first actuators 24 are disposed at positions facing each other across the second axis a2, and have a shape that is line-symmetrical about the second axis a2. In addition, the first actuators 24 have a shape that is line-symmetrical about the first axis a1. The first actuator 24 is formed along the outer periphery of the movable frame 22 and the first support portion 21. The first actuator 24 is a piezoelectric drive type actuator comprising a piezoelectric element.
The first actuator 24 is electrically connected across the first axis a1 by a wiring line (not shown). The pair of first actuators 24 disposed across the second axis a2 are electrically separated.
The second support portion 23 and the first actuator 24 are connected to each other to surround the movable portion 60.
The pair of second actuators 25 are disposed at positions facing each other across the first axis a1, and have a shape that is line-symmetrical about the first axis a1. In addition, the second actuators 25 have a shape that is line-symmetrical about the second axis a2. The second actuator 25 is formed along the outer periphery of the first actuator 24 and the second support portion 23. The second actuator 25 is a piezoelectric drive type actuator comprising a piezoelectric element.
The second actuators 25 are electrically connected to each other across the second axis a2 by a wiring line (not shown). The pair of second actuators 25 disposed across the first axis a1 are electrically separated.
The pair of first connecting portions 26A are disposed at positions facing each other across the second axis a2, and have a shape that is line-symmetrical about the second axis a2. In addition, each of the first connecting portions 26A has a shape that is line-symmetrical about the first axis a1. The first connecting portion 26A is disposed along the first axis a1, and connects the first actuator 24 and the second actuator 25 on the first axis a1.
The pair of second connecting portions 26B are disposed at positions facing each other across the first axis a1, and have a shape that is line-symmetrical about the first axis a1. In addition, each of the second connecting portions 26B is stretched in the Y direction, and has a shape that is line-symmetrical about the second axis a2. The second connecting portion 26B is disposed along the second axis a2, and connects the second actuator 25 and the fixed frame 27 on the second axis a2. The second connecting portion 26B supports the second actuator 25 to be swingable around the second axis a2. The second connecting portion 26B corresponds to a “connecting portion” according to the technology of the present disclosure.
The second actuator 25 surrounds the first actuator 24. The first actuator 24 and the second actuator 25 constitute a driving part disposed around the movable frame 22.
The fixed frame 27 is a frame-shaped member having a rectangular outer shape, and has a shape that is line-symmetrical about each of the first axis a1 and the second axis a2. The fixed frame 27 surrounds the outer periphery of the second actuator 25 and the second connecting portion 26B. That is, the fixed frame 27 is disposed around the driving part.
The first actuator 24 and the second actuator 25 are piezoelectric actuators each including a piezoelectric element. The pair of first actuators 24 allow the movable portion 60 to swing around the second axis a2 by applying rotational torque around the second axis a2 to the mirror portion 20 and the movable frame 22. The pair of second actuators 25 allow the mirror portion 20 to swing around the first axis a1 by applying rotational torque around the first axis a1 to the mirror portion 20, the movable frame 22, and the first actuator 24.
As shown in
The pair of coupling parts 21B are disposed at positions facing each other across the first axis a1, and have a shape that is line-symmetrical about the first axis a1. One end of the coupling part 21B is connected to the outer end portion E1 on the first axis a1 of the swing shaft 21A, and the other end thereof is connected to the movable frame 22. The coupling part 21B has a folded structure. Specifically, the coupling part 21B extends in a direction from the outer end portion E1 of the swing shaft 21A on the first axis a1 toward the mirror portion 20, is bent in the outer circumferential direction in a region adjacent to the mirror portion 20, and is bent again in a region adjacent to the first actuator 24 to be connected to the movable frame 22. As described above, since the coupling part 21B has elasticity due to the folded structure, the internal stress applied to the swing shaft 21A is relaxed in a case where the mirror portion 20 swings around the first axis a1. The swing shaft 21A and the coupling part 21B correspond to a “first swing shaft” and a “first coupling part” according to the technology of the present disclosure, respectively.
The second support portion 23 is composed of a swing shaft 23A and a pair of coupling parts 23B. The swing shaft 23A is a so-called torsion bar extended along the second axis a2. One end of the swing shaft 23A is connected to the movable frame 22, and the other end thereof is connected to the coupling part 23B.
The pair of coupling parts 23B are disposed at positions facing each other across the second axis a2, and have a shape that is line-symmetrical about the second axis a2. One end of the coupling part 23B is connected to the outer end portion E2 on the second axis a2 of the swing shaft 23A, and the other end thereof is connected to the first actuator 24. The coupling part 23B has a folded structure. Specifically, the coupling part 23B extends from the outer end portion E2 on the second axis a2 of the swing shaft 23A in a direction toward the mirror portion 20 and is connected to the first actuator 24 in a region adjacent to the movable frame 22. As described above, since the coupling part 23B has elasticity due to the folded structure, the internal stress applied to the swing shaft 23A is relaxed in a case where the mirror portion 20 swings around the second axis a2. The swing shaft 23A and the coupling part 23B correspond to a “second swing shaft” and a “second coupling part” according to the technology of the present disclosure, respectively.
In the mirror portion 20, a plurality of slits 20B and 20C are formed on the outside of the reflecting surface 20A along the outer periphery of the reflecting surface 20A. The plurality of slits 20B and 20C are disposed at positions that are line-symmetrical about the first axis a1 and the second axis a2, respectively. The slit 20B has an effect of suppressing distortion generated on the reflecting surface 20A due to the swing of the mirror portion 20.
In
As shown in
The mirror portion 20, the first support portion 21, the movable frame 22, the second support portion 23, the first actuator 24, the second actuator 25, the first connecting portion 26A, and the second connecting portion 26B are formed of the second silicon active layer 33 remaining by removing the first silicon active layer 31 and the silicon oxide layer 32 from the SOI substrate 30 by an etching treatment. The second silicon active layer 33 functions as an clastic portion having elasticity. The fixed frame 27 is formed of three layers of the first silicon active layer 31, the silicon oxide layer 32, and the second silicon active layer 33. That is, the mirror portion 20, the first support portion 21, the movable frame 22, the second support portion 23, the first actuator 24, the second actuator 25, the first connecting portion 26A, and the second connecting portion 26B have a thinner thickness than the fixed frame 27. In the present disclosure, the thickness means a width in the Z direction.
The first actuator 24 includes a piezoelectric element (not shown) formed on the second silicon active layer 33. The piezoelectric element has a laminated structure in which a lower electrode, a piezoelectric film, and an upper electrode are sequentially laminated on the second silicon active layer 33. The second actuator 25 has the same configuration as the first actuator 24.
The lower electrode and the upper electrode are formed of, for example, metal such as gold (Au) or platinum (Pt). The piezoelectric film is formed of, for example, lead zirconate titanate (PZT), which is a piezoelectric material. The lower electrode and the upper electrode are electrically connected to the driving controller 4 described above via the wiring line and the electrode pad.
The lower electrode is connected to the driving controller 4 via the wiring line and the electrode pad, and a ground potential is applied thereto. A driving voltage is applied to the upper electrode from the driving controller 4.
In a case where a positive or negative voltage is applied to the piezoelectric film in the polarization direction, deformation (for example, expansion and contraction) proportional to the applied voltage occurs. That is, the piezoelectric film exerts a so-called inverse piezoelectric effect. The piezoelectric film exerts an inverse piezoelectric effect by applying a driving voltage from the driving controller 4 to the upper electrode, and displaces the first actuator 24 and the second actuator 25.
In addition,
A deflection angle θ of the mirror portion 20 around the first axis a1 is controlled by the drive signal (hereinafter, referred to as a first drive signal) given to the second actuator 25 by the driving controller 4. The first drive signal is, for example, a sinusoidal AC voltage. The first drive signal includes a driving voltage waveform V1A (t) applied to one of the pair of second actuators 25 and a driving voltage waveform V1B (t) applied to the other. The driving voltage waveform V1A (t) and the driving voltage waveform V1B (t) are in an anti-phase with each other (that is, the phase difference is 180°).
The deflection angle θ of the mirror portion 20 around the first axis a1 corresponds to an angle at which the normal line N of the reflecting surface 20A is inclined with respect to the Z direction in the YZ plane.
The first actuator 24 is driven in the anti-phase rotation mode similarly to the second actuator 25. A deflection angle of the mirror portion 20 around the second axis a2 is controlled by the drive signal (hereinafter, referred to as a second drive signal) given to the first actuator 24 by the driving controller 4. The second drive signal is, for example, a sinusoidal AC voltage. The second drive signal includes a driving voltage waveform V2A (t) applied to one of the pair of first actuators 24 and a driving voltage waveform V2B (t) applied to the other. The driving voltage waveform V2A (t) and the driving voltage waveform V2B (t) are in an anti-phase with each other (that is, the phase difference is 180°).
The driving voltage waveforms V1A (t) and V1B (t) are represented as follows, respectively.
Here, V1 is the amplitude voltage. Voff1 is the bias voltage. fd1 is the driving frequency (hereinafter, referred to as the first driving frequency). t is time. α is the phase difference between the driving voltage waveforms V1A (t) and V1B (t). In the present embodiment, for example, α=180°.
By applying the driving voltage waveforms V1A (t) and V1B (t) to the pair of second actuators 25, the mirror portion 20 swings around the first axis a1 at the first driving frequency fd1.
The driving voltage waveforms V2A (t) and V2B (t) are represented as follows, respectively.
Here, V2 is the amplitude voltage. Voff2 is the bias voltage. fd2 is the driving frequency (hereinafter, referred to as the second driving frequency). t is time. β is the phase difference between the driving voltage waveforms V2A (t) and V2B (t). In the present embodiment, for example, β=180°. In addition, φ is the phase difference between the driving voltage waveforms V1A (t) and V1B (t) and the driving voltage waveforms V2A (t) and V2B (t). In the present embodiment, for example, Voff1=Voff2=0 V.
By applying the driving voltage waveforms V2A (t) and V2B (t) to the pair of first actuators 24, the movable portion 60 including the mirror portion 20 swings around the second axis a2 at the second driving frequency fd2.
The first driving frequency fd1 is set so as to match the resonance frequency around the first axis a1 of the mirror portion 20. The second driving frequency fd2 is set so as to match the resonance frequency around the second axis a2 of the mirror portion 20. For example, the first driving frequency fd1 is larger than the second driving frequency fd2.
The applicant has found that, by configuring the MMD 2 as described above, a large deflection angle can be realized in the anti-phase rotation mode without increasing the area of the driving part. In addition, in the MMD 2, since the first support portion 21 and the second support portion 23 are separated from the driving part at the outer end portions E1 and E2, respectively, the concentration of stress at one location during driving is suppressed. As a result, the first support portion 21 and the second support portion 23 are suppressed from causing Si structure destruction, and a large deflection angle can be realized.
In order to verify the above-described effect, the present applicant produced a sample of MMD2 and performed an experiment.
In addition, the diameter of the mirror portion 20 was set to 1.5 mm, the thickness of the SOI substrate 30 was set to 430 μm, and the thickness of the second silicon active layer 33 was set to 100 μm. The length of one side of the fixed frame 27 was 5.5 mm.
In the present experiment, the mirror portion 20 was resonantly driven in the anti-phase rotation mode around the second axis a2 in a vacuum (less than 50 Pa), and the driving voltage (that is, the amplitude voltage V2) required for θ=11.25° was confirmed. θ=11.25° corresponds to 45° in terms of the scanning angle (full angle) of the light beam LB. As a result of the experiment, the required driving voltage at θ=11.25° was 3.8 V.
In addition, a resonance mode analysis simulation was performed by the finite element method. Specifically, the mirror portion 20 was resonantly driven in the anti-phase rotation mode around the second axis a2, and the Mises stress applied to the second support portion 23 at θ=11.25° was calculated. The calculated value of the Mises stress was 1.79 GPa.
Next, a second embodiment will be described.
In the present embodiment, the first support portion 21 is configured with a swing shaft 21A and a pair of coupling parts 21B. One end of the swing shaft 21A is connected to the mirror portion 20, and the other end thereof is connected to the coupling part 21B. One end of the coupling part 21B is connected to the outer end portion E1 on the first axis a1 of the swing shaft 21A, and the other end thereof is connected to the movable frame 22. In the present embodiment, the coupling part 21B does not have a folded structure. That is, the coupling part 21B extends from the outer end portion E1 on the first axis a1 of the swing shaft 21A in a direction toward the mirror portion 20 and is connected to the movable frame 22 in a region adjacent to the mirror portion 20.
The present applicant also performed the same experiments and simulations as described above on the MMD 2A according to the second embodiment.
As a result of the experiment, the required driving voltage at θ=11.25° was 3.7 V. In addition, as a result of the resonance mode analysis simulation, the calculated value of the Mises stress applied to the second support portion 23 when θ=11.25° was 1.77 GPa.
Next, a third embodiment will be described.
In the present embodiment, the first support portion 21 is configured with a swing shaft 21A and a pair of coupling parts 21B. One end of the swing shaft 21A is connected to the mirror portion 20, and the other end thereof is connected to the coupling part 21B. One end of the coupling part 21B is connected to the outer end portion E1 on the first axis a1 of the swing shaft 21A, and the other end thereof is connected to the movable frame 22. In the present embodiment, the coupling part 21B has a folded structure.
Specifically, as in the first embodiment, the coupling part 21B extends in a direction from the outer end portion E1 of the swing shaft 21A on the first axis a1 toward the mirror portion 20, is bent in the outer circumferential direction in a region adjacent to the mirror portion 20, and is bent again in a region adjacent to the first actuator 24 to be connected to the movable frame 22. The coupling part 21B of the present embodiment is different from the coupling part 21B of the first embodiment in that the coupling part 21B protrudes from a portion connected to the movable frame 22 to the outer end portion E1 of the swing shaft 21A on the first axis a1 in the direction of the first axis a1. Reference numeral P indicates a region where the coupling part 21B protrudes in the direction of the first axis a1.
The present applicant also performed the same experiments and simulations as described above on the MMD 2B according to the third embodiment.
As a result of the experiment, the required driving voltage at θ=11.25° was 3.5 V. In addition, as a result of the resonance mode analysis simulation, the calculated value of the Mises stress applied to the second support portion 23 when θ=11.25° was 1.77 GPa.
Next, a fourth embodiment will be described.
In the present embodiment, the first support portion 21 is configured with a swing shaft 21A and a pair of coupling parts 21B. One end of the swing shaft 21A is connected to the mirror portion 20, and the other end thereof is connected to the coupling part 21B. One end of the coupling part 21B is connected to the outer end portion E1 on the first axis a1 of the swing shaft 21A, and the other end thereof is connected to the movable frame 22. In the present embodiment, the coupling part 21B has a folded structure.
Specifically, as in the first embodiment, the coupling part 21B is bent in an outer direction (that is, the second axis a2 direction) from the outer end portion E1 of the swing shaft 21A on the first axis a1 and forms an annular region C in a region adjacent to the movable frame 22. In addition, the coupling part 21B extends from the annular region C along the first axis a1 and extends along the driving part in a region adjacent to the driving part to be connected to the movable frame 22.
The present applicant also performed the same experiments and simulations as described above on the MMD 2C according to the fourth embodiment.
As a result of the experiment, the required driving voltage at θ=11.25° was 3.8 V. In addition, as a result of the resonance mode analysis simulation, the calculated value of the Mises stress applied to the second support portion 23 when θ=11.25° was 1.79 GPa.
Next, a fifth embodiment will be described.
In the present embodiment, the first support portion 21 is configured with a swing shaft 21A and a pair of coupling parts 21B. One end of the swing shaft 21A is connected to the mirror portion 20, and the other end thereof is connected to the coupling part 21B. One end of the coupling part 21B is connected to the outer end portion E1 on the first axis a1 of the swing shaft 21A, and the other end thereof is connected to the movable frame 22. In the present embodiment, the coupling part 21B has a folded structure.
In the present embodiment, the first support portion 21 is connected to the pair of coupling parts 21B in a region adjacent to the driving part in addition to the configuration of the fourth embodiment. The first support portion 21 of the present embodiment has the same configuration as the first support portion 21 of the fourth embodiment except that the pair of coupling parts 21B are connected to the first support portion 21.
The present applicant also performed the same experiments and simulations as described above on the MMD 2D according to the fifth embodiment.
As a result of the experiment, the required driving voltage at θ=11.25° was 3.8 V. In addition, as a result of the resonance mode analysis simulation, the calculated value of the Mises stress applied to the second support portion 23 when θ=11.25° was 1.80 GPa.
Next, the first comparative example will be described.
The present applicant also performed the same experiments and simulations as described above on the MMD 2E according to the first comparative example.
In addition, the diameter of the mirror portion 20 was set to 1.5 mm, the thickness of the SOI substrate 30 was set to 430 μm, and the thickness of the second silicon active layer 33 was set to 100 μm. In addition, the lengths of the fixed frame 27 in the X direction and the Y direction were set to 6.2 mm and 8.6 mm, respectively.
As a result of the experiment, the required driving voltage at θ=11.25° was 3.2 V. In addition, as a result of the resonance mode analysis simulation, the calculated value of the Mises stress applied to the second support portion 23 when θ=11.25° was 2.155 GPa.
Next, a second comparative example will be described.
The present applicant also performed the same experiments and simulations as described above on the MMD 2F according to the second comparative example.
In addition, the diameter of the mirror portion 20 was set to 1.5 mm, the thickness of the SOI substrate 30 was set to 350 μm, and the thickness of the second silicon active layer 33 was set to 60 μm. The length of one side of the fixed frame 27 was 6.1 mm.
In the configuration of the MMD 2F according to the second comparative example, since the mirror portion 20 cannot be resonantly driven in the anti-phase rotation mode around the second axis a2, the mirror portion 20 is resonantly driven in the in-phase rotation mode around the second axis a2.
As a result of the experiment, the required driving voltage at θ=11.25° was 18 V. In addition, as a result of the resonance mode analysis simulation, the calculated value of the Mises stress applied to the second support portion 23 when θ=11.25° was 1.225 GPa.
In the first comparative example, since the second support portion 23 does not have the folded structure and is directly connected to the driving part, the second support portion 23 is greatly twisted in a case where the mirror portion 20 and the first actuator 24 swing in anti-phases, and a large stress is generated. In the first comparative example, since the Mises stress applied to the second support portion 23 is 2 GPa or more at θ=11.25°, there is a high risk of structural destruction of the second support portion 23.
In the second comparative example, the mirror portion 20 and the first actuator 24 swing in the in-phase instead of in anti-phases. In this case, since the internal energy loss of the second support portion 23 in the Si structure during the resonance is large, the Q value is not improved even in a vacuum, and the driving voltage required for θ=11.25° is 10 V or more. In consideration of the power consumption, it is preferable to suppress the driving voltage to less than 10 V, but in a case where the driving voltage is less than 10 V, a sufficiently large deflection angle cannot be realized in the second comparative example.
As described above, in the first comparative example and the second comparative example, a large deflection angle cannot be realized even though the device size is large and the area of the driving part is large. On the other hand, in each of the above-described embodiments, since the driving voltage required for θ=11.25° is less than 10 V and the Mises stress applied to the second support portion 23 at θ=11.25° is less than 2 GPa, a large deflection angle can be realized without increasing the area of the driving part.
In the above embodiment, the hardware configuration of the driving controller 4 can be variously modified. The processing unit of the driving controller 4 may be composed of one processor or may be composed of a combination of two or more processors of the same type or different types. The processor includes, for example, a CPU, a programmable logic device (PLD), or a dedicated electric circuit. As is well known, the CPU is a general-purpose processor that executes software (program) to function as various processing units. The PLD is a processor such as a field programmable gate array (FPGA) whose circuit configuration can be changed after manufacture. The dedicated electric circuit is a processor that has a dedicated circuit configuration designed to perform a specific process, such as an application specific integrated circuit (ASIC).
All of the publications, the patent applications, and the technical standards described in the specification are incorporated by reference herein to the same extent as each individual document, each patent application, and each technical standard are specifically and individually stated to be incorporated by reference.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-149486 | Sep 2022 | JP | national |
This application is a continuation application of International Application No. PCT/JP2023/031287, filed Aug. 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Further, this application claims priority from Japanese Patent Application No. 2022-149486, filed on Sep. 20, 2022, the disclosure of which is incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2023/031287 | Aug 2023 | WO |
| Child | 19082318 | US |