Patent Application
20180063614
The present invention relates to chip packages and, more particularly, to a microphone package structure.
A conventional microphone package structure is characterized in that a sound wave transducer and a processing chip are electrically connected to a top side of a substrate, and a metal lid covers the top side of the substrate to define a chamber between the substrate and the metal lid so that the sound wave transducer and the processing chip are received in the chamber, wherein a sound aperture corresponding in position to the sound wave transducer is disposed at the top of the metal lid so that sound signals from above the microphone package structure are received by the sound wave transducer through the sound aperture.
The conventional microphone package structure is widely in use with 3C products, such as cell phones. However, the conventional microphone package structure requires that its solder pads be positioned on a bottom side of the substrate. To this end, manufacturers affix the bottom side of the substrate to a PCB substrate by surface mount technology so that the microphone package structure lies flat on the PCB substrate. As a result, the conventional microphone package structure has a drawback, that is, it receives sound signals from above but not laterally.
Accordingly, the conventional microphone package structure has the aforesaid drawback and thus still has room for improvement.
In view of the aforesaid drawback of the prior art, it is an objective of the present invention to provide a microphone package structure characterized in that its solder pads are disposed on a lateral side and a bottom side of a substrate, wherein a user can selectively position the lateral side of the substrate at an external circuit board or position the bottom side of the substrate at the external circuit board, allowing the microphone package structure to receive sound signals from above or laterally.
The microphone package structure comprises a substrate, a sound wave transducer, a processing chip, a lid, a sound aperture, at least one first solder pad and at least one second solder pad. The substrate has a top side, a bottom side and two lateral sides. The top side and the bottom side each connect the two lateral sides. The two lateral sides are opposite. The sound wave transducer is disposed on the top side. The processing chip is disposed on the top side and electrically connected to the substrate and the sound wave transducer. The lid covers the substrate to form a chamber for containing the sound wave transducer and the processing chip. The sound aperture is disposed at the substrate or the lid. The at least one first solder pad is disposed on the bottom side and in electrical conduction with the processing chip. The at least one second solder pad is disposed on one of the lateral sides and in electrical conduction with the processing chip.
Therefore, depending on structures and features of products, the user selectively positions the bottom side of the substrate at an external circuit board and solders the at least one first solder pad disposed on the bottom side to the external circuit board such that the microphone package structure lies flat on the external circuit board. Alternatively, the user selectively positions one of the lateral sides of the substrate at the external circuit board and solders the at least one second solder pad to the external circuit board such that the microphone package structure is disposed at the external circuit board vertically. Hence, the microphone package structure is variably positioned and thus capable of receiving sound signals from all directions, thereby meeting specific user needs.
Referring to
The substrate 20 has a top side 22, a bottom side 24, two lateral sides 26 and a conduction portion 28. The top side 22 and the bottom side 24 each connect the two lateral sides 26. The two lateral sides 26 are opposite. The two lateral sides 26 each have at least one groove 27. In this preferred embodiment, the two lateral sides 26 each have four grooves 27, but the present invention is not limited thereto; hence, in another preferred embodiment, only one of the lateral sides 26 has the grooves 27. Each groove 27 is transversely curved and has two ends connected to the top side 22 and the bottom side 24, respectively. The conduction portion 28 is disposed on the top side 22.
The sound wave transducer 30 is disposed on the top side 22 of the substrate 20.
The processing chip 40 is disposed on the top side 22 of the substrate 20. In this preferred embodiment, the processing chip 40 is electrically connected to the sound wave transducer 30 and the conduction portion 28 of the substrate 20 by a wire bonding process with a metal wire 42. In this preferred embodiment, the processing chip 40 is an application-specific integrated circuit (ASIC) designed and manufactured according to specific user needs and a specific electronic system. The processing chip 40 integrates circuits, such as a charge pump, a voltage regulator, an amplifier, a sigma delta modulator and an analog-to-digital converter, thereby achieving advantages, such as being more compact, more robust and capable of suppressing noise.
The lid 50 covers the substrate 20 to form a chamber 52 for containing the sound wave transducer 30 and the processing chip 40. The lid 50 is made of metal, fiberglass or ceramic.
In this preferred embodiment, the sound aperture 60 is disposed at the lid 50 and corresponds in position to the sound wave transducer 30. Referring to
In this preferred embodiment, the at least one first solder pad 70 is in the number of four, but the present invention is not limited thereto. The at least one first solder pad 70 is disposed on the bottom side 24 of the substrate 20. The at least one first solder pad 70 is in electrical conduction with the conduction portion 28 by an internal circuit of the substrate 20.
The at least one second solder pad 80 is disposed in the grooves 27 of the two lateral sides 26. The quantity of the at least one second solder pad 80 is changeable according to the quantity of the grooves 27. The at least one second solder pad 80 is in electrical conduction with the conduction portion 28 through an internal circuit of the substrate 20.
When the microphone package structure 10 is operating, the sound wave transducer 30 receives external sound signals through the sound aperture 60 on the substrate 20 or the lid 50 and converts the external sound signals into electrical signals. Afterward, the electrical signals are sent to the processing chip 40 to undergo a processing process. Upon completion of the processing process, the processed electrical signals are sent through the conduction portion 28 to the at least one first solder pad 70 or the at least one second solder pad 80 and thus can be for use by an external circuit board.
Referring to
Therefore, depending on structures and features of products, the user selectively positions the microphone package structure 10 at the external circuit board 90 flat or vertically. Moreover, unlike the prior art which resorts to developing different microelectromechanical microphones for use with respective products, the present invention meets specific user needs and incurs low manufacturing costs.
Constituent components and positions thereof disclosed in the above embodiments of the present invention are illustrative rather than restrictive of the scope of the present invention; hence, their replacement by equivalent components as well as their changes are intended to fall within the scope of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 105128144 | Aug 2016 | TW | national |
