LINGSEN PRECISION INDUSTRIES, LTD

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TAIWAN, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method
- Patent number 11,410,856
- Issue date Aug 9, 2022
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor package
- Patent number 11,041,774
- Issue date Jun 22, 2021
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- G01 - MEASURING TESTING
Information Patent Grant
Waterproof MEMS chip package structure
- Patent number 10,696,543
- Issue date Jun 30, 2020
- Lingsen Precision Industries, Ltd.
- Chiung-Yueh Tien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure of long-distance sensor and packaging method of t...
- Patent number 10,396,234
- Issue date Aug 27, 2019
- Lingsen Precision Industries, Ltd.
- Ching-I Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS microphone package
- Patent number 10,362,377
- Issue date Jul 23, 2019
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate and package module including the same
- Patent number 10,312,169
- Issue date Jun 4, 2019
- Lingsen Precision Industries, Ltd.
- Yu-Shiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS microphone package
- Patent number 10,299,046
- Issue date May 21, 2019
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method of long-distance sensor
- Patent number 10,103,286
- Issue date Oct 16, 2018
- Lingsen Precision Industries, Ltd.
- Ching-I Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of long-distance sensor and packaging method of t...
- Patent number 10,090,427
- Issue date Oct 2, 2018
- Lingsen Precision Industries, Ltd.
- Ching-I Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microphone package structure
- Patent number 10,003,874
- Issue date Jun 19, 2018
- Lingsen Precision Industries, Ltd.
- Yao-Ting Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical sensing module and method of manufacturing the same
- Patent number 9,952,089
- Issue date Apr 24, 2018
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- G01 - MEASURING TESTING
Information Patent Grant
Optical module integrated package
- Patent number 9,905,548
- Issue date Feb 27, 2018
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of an optical module
- Patent number 9,705,025
- Issue date Jul 11, 2017
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of optical module having printed shielding layer...
- Patent number 9,647,178
- Issue date May 9, 2017
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor package
- Patent number 9,618,415
- Issue date Apr 11, 2017
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- G01 - MEASURING TESTING
Information Patent Grant
Chip stack structure using conductive film bridge adhesive technology
- Patent number 9,553,073
- Issue date Jan 24, 2017
- Lingsen Precision Industries, Ltd.
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module package and its packaging method
- Patent number 9,478,693
- Issue date Oct 25, 2016
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module integrated package
- Patent number 9,449,955
- Issue date Sep 20, 2016
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Micro optical package structure with filtration layer and method fo...
- Patent number 9,312,402
- Issue date Apr 12, 2016
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
MEMS microphone packaging method
- Patent number 9,309,108
- Issue date Apr 12, 2016
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked MEMS microphone packaging method
- Patent number 9,260,298
- Issue date Feb 16, 2016
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for packaging an optical module
- Patent number 9,190,398
- Issue date Nov 17, 2015
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor having micro-package structure and method for making the...
- Patent number 9,063,084
- Issue date Jun 23, 2015
- Lingsen Precision Industries, Ltd.
- Tzu-Chih Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
LED package and manufacturing process of same
- Patent number 8,980,659
- Issue date Mar 17, 2015
- Lingsen Precision Industries, Ltd.
- Wei-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp strip and manufacturing process thereof
- Patent number 8,664,045
- Issue date Mar 4, 2014
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- F21 - LIGHTING
Information Patent Grant
Optical module package unit
- Patent number 8,362,496
- Issue date Jan 29, 2013
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical microphone carrier module
- Patent number 8,254,619
- Issue date Aug 28, 2012
- Lingsen Precision Industries Ltd.
- Jen-Chuan Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pre-molded support mount of lead frame-type for LED light module
- Patent number 8,247,821
- Issue date Aug 21, 2012
- Lingsen Precision Industries Ltd.
- Mu Tsan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for MEMS package
- Patent number 8,238,107
- Issue date Aug 7, 2012
- Lingsen Precision Industries, Ltd.
- Jen-Chuan Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame for quad flat no-lead package
- Patent number 8,027,153
- Issue date Sep 27, 2011
- Lingsen Precision Industries, Ltd.
- Feng-Chun Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
- Publication number 20250015036
- Publication date Jan 9, 2025
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Chia CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD
- Publication number 20220148887
- Publication date May 12, 2022
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE
- Publication number 20200109044
- Publication date Apr 9, 2020
- LINGSEN PRECISION INDUSTRIES, LTD.
- Chao-Wei YU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING FUNCTION OF PREVENTING ADHESIVE FROM...
- Publication number 20200105636
- Publication date Apr 2, 2020
- LINGSEN PRECISION INDUSTRIES, LTD.
- Wei-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR PACKAGE
- Publication number 20190265118
- Publication date Aug 29, 2019
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20190198406
- Publication date Jun 27, 2019
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Shiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF LONG-DISTANCE SENSOR AND PACKAGING METHOD OF T...
- Publication number 20180190856
- Publication date Jul 5, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ching-I LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD OF LONG-DISTANCE SENSOR
- Publication number 20180190857
- Publication date Jul 5, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ching-I LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF LONG-DISTANCE SENSOR AND PACKAGING METHOD OF T...
- Publication number 20180190858
- Publication date Jul 5, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ching-I LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF OPTICAL MODULE
- Publication number 20180190630
- Publication date Jul 5, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20180063615
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE PACKAGE STRUCTURE
- Publication number 20180063614
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yao-Ting YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE
- Publication number 20180063616
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20180063645
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yao-Ting YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20180063646
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL MODULE INTEGRATED PACKAGE
- Publication number 20160365339
- Publication date Dec 15, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MEMS MICROPHONE
- Publication number 20160157024
- Publication date Jun 2, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL MODULE PACKAGE AND ITS PACKAGING METHOD
- Publication number 20160126403
- Publication date May 5, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR PACKAGE
- Publication number 20160116359
- Publication date Apr 28, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- G01 - MEASURING TESTING
Information Patent Application
QUAD-FLAT NON-LEAD PACKAGE STRUCTURE AND METHOD OF PACKAGING THE SAME
- Publication number 20160093556
- Publication date Mar 31, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSING MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160091364
- Publication date Mar 31, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- G01 - MEASURING TESTING
Information Patent Application
MEMS MICROPHONE PACKAGING METHOD
- Publication number 20160052779
- Publication date Feb 25, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED MEMS MICROPHONE PACKAGING METHOD
- Publication number 20160052780
- Publication date Feb 25, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL MODULE INTEGRATED PACKAGE
- Publication number 20150279827
- Publication date Oct 1, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
OPTICAL MODULE WITH OPTICAL CONCENTRATION STRUCTURE AND PACKAGING M...
- Publication number 20150279826
- Publication date Oct 1, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20150279796
- Publication date Oct 1, 2015
- Lingsen Precision Industries Ltd.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20150255423
- Publication date Sep 10, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Tzu-Chih LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20150206852
- Publication date Jul 23, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Tzu-Chih LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK STRUCTURE USING CONDUCTIVE FILM BRIDGE ADHESIVE TECHNOLOGY
- Publication number 20150187735
- Publication date Jul 2, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Chien-Ko LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SENSOR HAVING MICRO-PACKAGE STRUCTURE AND METHOD FOR MAKING THE...
- Publication number 20150185148
- Publication date Jul 2, 2015
- LINGSEN PRECISION INDUSTRIES, LTD.
- Tzu-Chih LIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

LINGSEN PRECISION INDUSTRIES, LTD

Organization

Patents Grantslast 30 patents

Chip packaging method

Pressure sensor package

Waterproof MEMS chip package structure

Package structure of long-distance sensor and packaging method of t...

MEMS microphone package

Substrate and package module including the same

MEMS microphone package

Packaging method of long-distance sensor

Package structure of long-distance sensor and packaging method of t...

Microphone package structure

Optical sensing module and method of manufacturing the same

Optical module integrated package

Package structure of an optical module

Package structure of optical module having printed shielding layer...

Pressure sensor package

Chip stack structure using conductive film bridge adhesive technology

Optical module package and its packaging method

Optical module integrated package

Micro optical package structure with filtration layer and method fo...

MEMS microphone packaging method

Stacked MEMS microphone packaging method

Method for packaging an optical module

Gas sensor having micro-package structure and method for making the...

LED package and manufacturing process of same

LED lamp strip and manufacturing process thereof

Optical module package unit

Microelectromechanical microphone carrier module

Pre-molded support mount of lead frame-type for LED light module

Cap for MEMS package

Lead frame for quad flat no-lead package

Patents Applicationslast 30 patents

PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...

CHIP PACKAGING METHOD

MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE HAVING FUNCTION OF PREVENTING ADHESIVE FROM...

PRESSURE SENSOR PACKAGE

SUBSTRATE AND PACKAGE MODULE INCLUDING THE SAME

PACKAGE STRUCTURE OF LONG-DISTANCE SENSOR AND PACKAGING METHOD OF T...

PACKAGING METHOD OF LONG-DISTANCE SENSOR

PACKAGE STRUCTURE OF LONG-DISTANCE SENSOR AND PACKAGING METHOD OF T...

PACKAGE STRUCTURE OF OPTICAL MODULE

MEMS MICROPHONE PACKAGE

MICROPHONE PACKAGE STRUCTURE

MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE

MEMS MICROPHONE PACKAGE

MEMS MICROPHONE PACKAGE

OPTICAL MODULE INTEGRATED PACKAGE

FLIP-CHIP MEMS MICROPHONE

OPTICAL MODULE PACKAGE AND ITS PACKAGING METHOD

PRESSURE SENSOR PACKAGE

QUAD-FLAT NON-LEAD PACKAGE STRUCTURE AND METHOD OF PACKAGING THE SAME

OPTICAL SENSING MODULE AND METHOD OF MANUFACTURING THE SAME

MEMS MICROPHONE PACKAGING METHOD

STACKED MEMS MICROPHONE PACKAGING METHOD

OPTICAL MODULE INTEGRATED PACKAGE

OPTICAL MODULE WITH OPTICAL CONCENTRATION STRUCTURE AND PACKAGING M...

QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFAC...

COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFAC...

CHIP STACK STRUCTURE USING CONDUCTIVE FILM BRIDGE ADHESIVE TECHNOLOGY

GAS SENSOR HAVING MICRO-PACKAGE STRUCTURE AND METHOD FOR MAKING THE...

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