Claims
- 1. A securing apparatus comprising:a housing having an insulating cylindrical section and an insulating disc-shaped section defining an interior; means in said interior of said housing for emitting high-intensity radiation; means for supplying power to said high-intensity radiation emitting means; means interposed between said LED array and said plurality of batteries for insulating and spacing to prevent shorting of said batteries; means in said housing for relaying said power to said LED array from said plurality of batteries; means disposed adjacent said LED array for providing a transparent cover to transmit said high-intensity radiation, said transparent cover providing means being connected to said cylindrical section to seal said interior from ambient; means mounted on the outside of said housing and adapted to be displaced for closing said relaying means to connect said power to said LED array to emit said high-intensity radiation through said cover; and a modular envelope coupled to said housing, said modular envelope having photo-curable adhesive layer between a radiation transparent disc and a foil layer, said foil layer being removable from said photo-curable adhesive layer to expose said photo-curable adhesive layer to enable placement of said exposed photo-curable adhesive layer on a surface to permit bonding of said photo-curable adhesive layer on said surface by said high-intensity radiation.
- 2. The apparatus of claim 1 further comprisingmeans mounted on said housing and said modular envelope for coupling said modular envelope to said housing during transit to and placement on said surface and for decoupling said modular envelope from said housing after said bonding of said photo-curable adhesive layer on said surface.
- 3. The apparatus of claim 2 wherein said modular envelope further includes mounting structure connected thereto.
- 4. The apparatus of claim 3 wherein said mounting structure is comprised of a padeye.
- 5. The apparatus of claim 4 wherein said coupling means includes a snap-ring on said housing and a mating rim on said modular envelope, said snap-ring exerting coupling force to hold said modular envelope on said housing during said bonding and to release said rim and said modular envelope from said housing after said bonding.
- 6. The apparatus of claim 4 wherein said coupling means includes frictionally engaging surfaces.
- 7. The apparatus of 4 wherein said coupling means includes mating engaging fibers to releasably interlock.
CROSS REFERENCE TO RELATED APPLICATION
This is a continuation-in-part of copending U.S. patent application entitled “Miniature High Intensity LED Illumination Source” by Ray Baggett et al., U.S. Patent and Trademark Office Ser. No. 10/042,856 (NC 83026), filed Jan. 11, 2002 and incorporates all references and information thereof by reference herein.
STATEMENT OF GOVERNMENT INTEREST
The invention described herein may be manufactured and used by or for the Government of the United States of America for governmental purposes without the payment of any royalties thereon or therefor.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5634711 |
Kennedy et al. |
Jun 1997 |
A |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
10/042856 |
Jan 2002 |
US |
Child |
10/155715 |
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US |