Embodiments of the present disclosure generally relate to packaging of components for use in substrate process equipment.
Process chambers for processing substrates, such as semiconductor substrates, typically include various chamber components. For example, process chambers may use annular rings such as edge rings, cover rings, deposition rings, quartz rings. When chamber components are manufactured, they are typically packaged or bagged in a clean room environment. However, when chamber components are transported, interaction between the chamber components and the packaging may leave behind unwanted particles of the packaging materials and/or particles of the chamber component itself onto the chamber component. These unwanted particles may contaminate the chamber components
Therefore, the inventors have provided improved packaging for chamber components for use in a process chamber.
Embodiments of packaged chamber components and methods of packaging chamber components are provided herein. In some embodiments, a packaged chamber component for use in a process chamber includes: an insert having an annular trench disposed about a raised inner portion, wherein the annular trench is disposed between the raised inner portion and an outer lip, wherein a ledge couples the raised inner portion to the outer lip, wherein the ledge includes a first portion and a second portion disposed radially outward of the first portion, and wherein the second portion includes a resting surface that extends upward and radially outward of an upper surface of the first portion; and a chamber component disposed in the annular trench of the insert and supported by the resting surface such that one or more critical surfaces of the chamber component are spaced apart from the insert.
In some embodiments, a packaged chamber component for use with a process chamber includes: an insert made of a polymer material having an annular trench, wherein the annular trench is defined by a raised inner portion, a ledge extending radially outward from the raised inner portion, and an outer lip extending from the ledge, wherein the ledge includes a first portion and a second portion disposed radially outward of the first portion, wherein the second portion includes a resting surface that is raised from an upper surface of the first portion; and a chamber component having an annular body disposed in the annular trench and supported by the resting surface such that a radially inner surface of the annular body and at least a portion of a ledge-facing surface of the annular body are spaced apart from the insert.
In some embodiments, a method of packaging a chamber component for use with a process chamber includes: placing the chamber component in an annular trench of an insert made of a polymer material, wherein the chamber component includes a critical surface, and wherein the annular trench includes one or more resting surfaces on a lower surface thereof for supporting the chamber component without touching the critical surface of the chamber component; placing the chamber component and the insert in a bag made of a polymer material; and vacuum sealing the chamber component and the insert in the bag to clamp the chamber component between the bag and the one or more resting surfaces.
Other and further embodiments of the present disclosure are described below.
Embodiments of the present disclosure, briefly summarized above and discussed in greater detail below, can be understood by reference to the illustrative embodiments of the disclosure depicted in the appended drawings. However, the appended drawings illustrate only typical embodiments of the disclosure and are therefore not to be considered limiting of scope, for the disclosure may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Embodiments of packaged chamber components and methods of packaging chamber components are provided herein. The packaging for a chamber component generally comprises an insert configured to support the chamber component without contacting critical surfaces of the chamber component. A bag may envelope the chamber component and the insert to seal the chamber component. Critical surfaces of the chamber component can be, for example, surfaces proximate a substrate during use in a process chamber. For example, in a plasma process chamber, when a substrate is raised or lowered with respect to the chamber component, a difference in voltage potential between the substrate and the chamber component may cause particles disposed on the critical surfaces to migrate from the chamber component to the substrate, contaminating the substrate.
The chamber component 100 includes one or more critical surfaces 112 disposed in a critical region 110 of the chamber component 100. The critical region 110 may correspond with an area of the chamber component 100 that if covered with unwanted particles, could contaminate a substrate being process or other chamber components. As shown in
In some embodiments, the portion 116 is a radially inner portion that extends to the radially inner surface 114. In some embodiments, the radially inner surface 114 and the portion 116 of the upper surface 108 meet to form a sharp corner that may be prone to wear if packaging material were to contact the sharp corner. The packaging apparatus and methods described herein avoid contacting the one or more critical surfaces 112 to advantageously prevent wear of the chamber component 100 and particle formation. In some embodiments, the one or more critical surfaces 112 may include the upper surface 108 except for an outer peripheral edge 118 of the chamber component 100. In some embodiments, the outer peripheral edge 118 is rounded.
The insert 202 generally includes a raised inner portion 204 and an annular trench 210 disposed about the raised inner portion 204. In some embodiments, the annular trench 210 is defined between the raised inner portion 204 and an outer lip 212. A ledge 218 extends radially outward from the raised inner portion 204 to the outer lip 212 to couple the raised inner portion 204 to the outer lip 212. In some embodiments, an upper surface 214 of the raised inner portion 204 is raised with respect to an upper surface 216 of the outer lip 212.
The annular trench 210 may be sized to accommodate a size of the chamber component 100. For example, in some embodiments, the outer lip 212 has an inner diameter of about 13.0 inches to about 18.0 inches. In some embodiments, the raised inner portion 204 has an outer diameter of about 8.0 inches to about 12.0 inches. In some embodiments, the raised inner portion 204 is raised about 0.8 inches to about 2.0 inches from the ledge 218.
The ledge 218 includes a first portion 220 and a second portion 224 disposed radially outward of the first portion 220. The second portion 224 includes a resting surface 230 (i.e., upper surface of second portion 224) to accommodate the chamber component 100. In some embodiments, the resting surface 230 is raised from an upper surface 222 of the first portion 220 so that the chamber component 100 advantageously does not contact the upper surface 222. For example, the resting surface 230 may extend upward and radially outward from the upper surface 222 of the first portion 220. The resting surface 230 may be stepped from the upper surface 222 or may incline from the upper surface 222. In some embodiments, the resting surface 230 inclines radially outward and upward at an angle of about 25 degrees to about 65 degrees to an inner surface 226 of the outer lip 212. In some embodiments, a width of the second portion 224 is about 20 percent to about 40 percent of a width of the first portion 220.
The chamber component 100 is disposed in the annular trench 210 of the insert 202 and supported by the resting surface 230. In some embodiments, the chamber component 100 is disposed upside-down in the annular trench 210 (i.e., with the upper surface 108 of the chamber component 100 facing the ledge 218. The chamber component 100 is supported such that the one or more critical surfaces 112 of the chamber component 100 are spaced apart from the insert 202. In some embodiments, the one or more critical surfaces 112 includes at least a portion of a ledge-facing surface (i.e., upper surface 108) of the chamber body.
In some embodiments, the chamber component 100 rests solely on the resting surface 230 and does not contact the insert 202 otherwise. In some embodiments, the insert 202 includes a second resting surface 234 raised from the upper surface 222 of the first portion 220 of the ledge 218 at a location radially outward of the one or more critical surfaces 112 to further support the chamber component 100 if needed. In such embodiments, the chamber component 100 may rest on the resting surface 230 and the second resting surface 234. In some embodiments, an outer surface 228 of the raised inner portion 204 has a diameter less than an inner diameter of the chamber component 100 to form a gap therebetween. In some embodiments, the gap is about 1.0 inches to about 3.0 inches so that the chamber component 100 does not contact the outer surface 228
In some embodiments, the insert 202 and the chamber component 100 are disposed in a bag 206. In some embodiments, the bag 206 is made of a polymer such as polyethylene. The bag 206 may be vacuum sealed to clamp the chamber component 100 against the insert 202 and advantageously minimize movement of the chamber component 100 within the annular trench 210. The resting surface 230 having an inclined surface may advantageously aid in clamping the chamber component 100 against the insert 202. The bag 206 is also configured to keep the chamber component 100 clean and substantially free from unwanted particles. The bag 206 envelopes the chamber component 100 and the insert 202 without contacting the one or more critical surfaces 112 of the chamber component 100. For example, the bag 206 is spaced from the radially inner surface 114 of the annular body and the portion 116 of the ledge-facing surface of the annular body of the chamber component. In some embodiments, the bag 206 only contacts one or more surfaces of the chamber component 100 that face away from a floor the upper surface 222 and resting surface 230 of the ledge 218) or sidewalls (i.e., outer surface 228 and inner surface 226) of the annular trench 210. For example, in some embodiments, the bag 206 only contacts one or more surfaces along the lower surface 106 of the chamber component 100.
With respect to
At 502, the method 500 includes placing the chamber component in an annular trench (i.e., annular trench 210) of an insert (i.e., insert 202). In some embodiments, the insert is made of a polymer material. The chamber component includes one or more critical surfaces (i.e., critical surfaces 112) that are spaced from the insert when the chamber component is placed in the insert. The annular trench includes one or more resting surfaces (i.e., resting surface 230 and second resting surface 234) on a lower surface thereof for supporting the chamber component without touching the one or more critical surfaces of the chamber component. In some embodiments, the one or more critical surface comprises at least one of a radially inner surface of the chamber component and at least a portion of an upper surface of the chamber component. In some embodiments, the one or more resting surfaces include one resting surface that is disposed at a radially outer portion (i.e., resting surface 230) of the lower surface of the annular trench and that is raised from a remaining portion (i.e., upper surface 222 of first portion 220 of ledge 218) of the lower surface.
In some embodiments, the method 500 comprises turning the chamber component upside-down prior to placing the chamber component in the annular trench such that an upper surface (i.e., upper surface 108) of the chamber component faces the lower surface of the annular trench.
At 504, the method 500 includes placing the chamber component and the insert in a bag (i.e., bag 206) made of a polymer material. The chamber component and the insert may be advantageously placed in the bag in a clean room to reduce particle formation on the chamber component. At 506, the method 500 includes vacuum sealing the chamber component and the insert in the bag to clamp the chamber component between the bag and the one or more resting surfaces. In some embodiments, the bag contacts only one or more surfaces along a lower surface (i.e., lower surface 106) of the chamber component.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.
Number | Name | Date | Kind |
---|---|---|---|
D126200 | Eisenberg | Apr 1941 | S |
2501983 | Zoie | Mar 1950 | A |
3414183 | Wilcox | Dec 1968 | A |
3429369 | Segal | Feb 1969 | A |
3694991 | Perdue et al. | Oct 1972 | A |
D260492 | Scott | Sep 1981 | S |
D262932 | Daenen | Feb 1982 | S |
D281758 | Trombly | Dec 1985 | S |
D398997 | Taylor | Sep 1998 | S |
D411800 | Kokenge et al. | Jul 1999 | S |
D434660 | Conti | Dec 2000 | S |
D445687 | Gilbertson | Jul 2001 | S |
D483989 | Lillelund et al. | Dec 2003 | S |
D526564 | Slavin et al. | Aug 2006 | S |
D595570 | Moretti | Jul 2009 | S |
D618500 | Hardaway | Jun 2010 | S |
D625190 | Pontes | Oct 2010 | S |
D627226 | Gonzalez Sanchez et al. | Nov 2010 | S |
8266873 | Berbert et al. | Sep 2012 | B2 |
D677162 | Sharma et al. | Mar 2013 | S |
D825505 | Hanson et al. | Aug 2018 | S |
D877558 | Dorfmueller | Mar 2020 | S |
D934315 | Lavitsky et al. | Oct 2021 | S |
D942516 | Koppa et al. | Feb 2022 | S |
D943345 | Lofholm et al. | Feb 2022 | S |
D944083 | Boggs et al. | Feb 2022 | S |
D944484 | Hornbaker et al. | Feb 2022 | S |
D947675 | Yamada | Apr 2022 | S |
D951091 | Bontrager | May 2022 | S |
D955217 | Choi | Jun 2022 | S |
D959896 | Sun | Aug 2022 | S |
20040074790 | Kuremoto | Apr 2004 | A1 |
20060011509 | White | Jan 2006 | A1 |
20060016156 | Bush | Jan 2006 | A1 |
20130213853 | Brautigam et al. | Aug 2013 | A1 |
20160068288 | Palumbo | Mar 2016 | A1 |
Number | Date | Country |
---|---|---|
2001-332612 | Nov 2001 | JP |
10-2019-0007276 | Jan 2019 | KR |
D207742 | Oct 2020 | TW |
Entry |
---|
International Search Report and Written Opinion for PCT/US2021/064277 dated Apr. 18, 2022. |
CAE Online. Used Amat / Applied Materials Etch Chamber for MXP #9222737 for Sale. No date specified. https://caeonline.com/buy/spare-parts/amat-applied-materials-etch-chamber-for-mxp/9222737 (Year: 0). |
MRE Depot. Plastic Reusable Lids for #10 Cans (6 Pack). No date specified. https://www.mredepot.com/10-can-plastic-lids-p/fe005. htm (Year: 0). |
Berlin Packaging. 307 Metal Paint Can Lid (Epoxy Liner). No date specified. https://www.berlinpackaging.com/7713-307-metal-paint-can-lid-epoxy-liner/?promo=shopping&gclid=EAIaIQobCh MI2N3_9KaU9gIVBYizCh3M HQI EAQYCyABEg KZXfD_BwE (Year: 0). |
Search Report for Taiwan Design Application No. 110303137, dated Oct. 29, 2021. |
Number | Date | Country | |
---|---|---|---|
20220199455 A1 | Jun 2022 | US |