characterised by edge clamping

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CPC
H01L21/68721

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68721characterised by edge clamping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma etching apparatus and method
- Patent number 12,362,152
- Issue date Jul 15, 2025
- SPTS Technologies Limited
- Maxime Varvara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,347,654
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Hwajun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die separation ring for wafers having a large die aspect ratio
- Patent number 12,347,733
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Shuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer conveyance unit and wafer conveyance method
- Patent number 12,347,718
- Issue date Jul 1, 2025
- Hamamatsu Photonics K.K.
- Akira Shimase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus
- Patent number 12,340,990
- Issue date Jun 24, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic edge ring mounting system for substrate processing
- Patent number 12,340,989
- Issue date Jun 24, 2025
- Lam Research Corporation
- Alexander Matyushkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated adaptive positioning systems and routines for automated...
- Patent number 12,341,040
- Issue date Jun 24, 2025
- Lam Research Corporation
- Hossein Sadeghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for treating substrate
- Patent number 12,334,370
- Issue date Jun 17, 2025
- Semes Co., Ltd.
- Sangmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding unit
- Patent number 12,330,251
- Issue date Jun 17, 2025
- Disco Corporation
- Takayuki Masada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer storage device
- Patent number 12,322,621
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Ju- Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder
- Patent number 12,288,707
- Issue date Apr 29, 2025
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor processing method and apparatus
- Patent number 12,283,512
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuang-Shiuan Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer clamping method and semiconductor manufacturing apparatus
- Patent number 12,272,588
- Issue date Apr 8, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 12,272,528
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate test apparatus and method for measuring dechucking force...
- Patent number 12,261,072
- Issue date Mar 25, 2025
- Semes Co., Ltd.
- Jong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,249,533
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Yoshinori Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding system with heated automatic collet changer
- Patent number 12,237,202
- Issue date Feb 25, 2025
- MRSI Systems, LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and user interface for edge ring wear compensation
- Patent number 12,237,203
- Issue date Feb 25, 2025
- Lam Research Corporation
- Tom A. Kamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moveable edge ring designs
- Patent number 12,230,482
- Issue date Feb 18, 2025
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping device and cleaning device
- Patent number 12,220,730
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Liang-Yuan Li
- B08 - CLEANING
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding apparatus
- Patent number 12,205,832
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Jonghyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actively clamped carrier assembly for processing tools
- Patent number 12,191,186
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Benjamin B. Riordon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Rotatable thermal processing chamber
- Patent number 12,176,242
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Wolfgang R. Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device, processing system, and transfer method
- Patent number 12,170,216
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Shinya Okano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 12,165,909
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218854
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- In Ki JUNG
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218842
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Byoung Min YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Support For Backside Processing Using Edge Grip
- Publication number 20250210406
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Roger B. Fish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20250201621
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250191960
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyun Sun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND USER INTERFACE FOR EDGE RING WEAR COMPENSATION
- Publication number 20250191962
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Tom A. KAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GRIPPING APPARATUS
- Publication number 20250191961
- Publication date Jun 12, 2025
- EBARA CORPORATION
- SATOSHI AO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SIZED SUBSTRATE FIXTURE
- Publication number 20250167039
- Publication date May 22, 2025
- ONTO INNOVATION INC.
- Troy Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK ASSEMBLY
- Publication number 20250167037
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER STORAGE DEVICE
- Publication number 20250157837
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Ju- CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING APPARATUS
- Publication number 20250140580
- Publication date May 1, 2025
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Shiro HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE AND MOUNTING DEVICE USING SAME
- Publication number 20250096016
- Publication date Mar 20, 2025
- TORAY ENGINEERING CO., LTD.
- Kenji HAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RETAINING DEVICE
- Publication number 20250079227
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Lu-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20250069944
- Publication date Feb 27, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Bo-Ru CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250054793
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...
- Publication number 20250054803
- Publication date Feb 13, 2025
- PSK Holdings Inc.
- Gunwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250029865
- Publication date Jan 23, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION RETAINING RING
- Publication number 20250022744
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Ryo HIRUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM
- Publication number 20250022690
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Chiuan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RINGS FOR IMPROVED EDGED UNIFORMITY IN SEMICONDUCTOR PROCESSIN...
- Publication number 20250014938
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
- Publication number 20250006516
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Noriiki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF
- Publication number 20250006529
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Theodorus G.M. Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION
- Publication number 20240429089
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Peter MURAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...
- Publication number 20240399535
- Publication date Dec 5, 2024
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
CLAMP RING AND METHOD OF USING CLAMP RING
- Publication number 20240387233
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE CLAMP FOR PHYSICAL VAPOR DEPOSITION
- Publication number 20240376591
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Sathiyamurthi GOVINDASAMY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLIPPING APPARATUS
- Publication number 20240347361
- Publication date Oct 17, 2024
- ACM RESEARCH (SHANGHAI), INC.
- He Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE MEASUREMENT SYSTEM
- Publication number 20240339347
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING HAVING INNER SURFACES WITH FEATURES
- Publication number 20240316723
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Steven Mark Reedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20240312802
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yosuke MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS

characterised by edge clamping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma etching apparatus and method

Plasma processing apparatus

Die separation ring for wafers having a large die aspect ratio

Wafer conveyance unit and wafer conveyance method

Member for semiconductor manufacturing apparatus

Electrostatic edge ring mounting system for substrate processing

Integrated adaptive positioning systems and routines for automated...

Apparatus and method for treating substrate

Holding unit

Semiconductor wafer storage device

Substrate holder

Semiconductor processing method and apparatus

Wafer clamping method and semiconductor manufacturing apparatus

Stage and plasma processing apparatus

Method of manufacturing semiconductor package, method of handling w...

Substrate test apparatus and method for measuring dechucking force...

Substrate processing apparatus

Die bonding system with heated automatic collet changer

System, method, and user interface for edge ring wear compensation

Moveable edge ring designs

Clamping device and cleaning device

Plasma control method in semiconductor wafer fabrication

Substrate debonding apparatus

Actively clamped carrier assembly for processing tools

Rotatable thermal processing chamber

Transfer device, processing system, and transfer method

Substrate processing system and transfer method

Screwless semiconductor processing chambers

Integrated substrate measurement system

Calibration jig and calibration method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

Workpiece Support For Backside Processing Using Edge Grip

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

SUBSTRATE PROCESSING APPARATUS

SYSTEM, METHOD, AND USER INTERFACE FOR EDGE RING WEAR COMPENSATION

SUBSTRATE GRIPPING APPARATUS

MULTI-SIZED SUBSTRATE FIXTURE

WAFER CHUCK ASSEMBLY

SEMICONDUCTOR WAFER STORAGE DEVICE

WET PROCESSING APPARATUS

POSITIONING DEVICE AND MOUNTING DEVICE USING SAME

WAFER RETAINING DEVICE

SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...

WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

EXPANSION RETAINING RING

RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM

EDGE RINGS FOR IMPROVED EDGED UNIFORMITY IN SEMICONDUCTOR PROCESSIN...

SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS

WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF

ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION

METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...

CLAMP RING AND METHOD OF USING CLAMP RING

ADJUSTABLE CLAMP FOR PHYSICAL VAPOR DEPOSITION

FLIPPING APPARATUS

INTEGRATED SUBSTRATE MEASUREMENT SYSTEM

RETAINING RING HAVING INNER SURFACES WITH FEATURES

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...