characterised by edge clamping

Industry

CPC
H01L21/68721

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68721characterised by edge clamping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Clamping device and cleaning device
- Patent number 12,220,730
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Liang-Yuan Li
- B08 - CLEANING
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding apparatus
- Patent number 12,205,832
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Jonghyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actively clamped carrier assembly for processing tools
- Patent number 12,191,186
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Benjamin B. Riordon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Rotatable thermal processing chamber
- Patent number 12,176,242
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Wolfgang R. Aderhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device, processing system, and transfer method
- Patent number 12,170,216
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Shinya Okano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 12,165,909
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp ring and method of using clamp ring
- Patent number 12,142,514
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus and control method thereof
- Patent number 12,140,505
- Issue date Nov 12, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage module, substrate processing system, and method of transfer...
- Patent number 12,125,738
- Issue date Oct 22, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic apparatus
- Patent number 12,117,736
- Issue date Oct 15, 2024
- ASML Netherlands B.V.
- Marcus Adrianus Van De Kerkhof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimal contact packaging for process chamber components
- Patent number 12,100,613
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Joseph Frederick Behnke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 12,074,054
- Issue date Aug 27, 2024
- ZEUS CO., LTD.
- Woon Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor having a variable coupling of low frequency RF power...
- Patent number 12,062,524
- Issue date Aug 13, 2024
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Kui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC edge ring
- Patent number 12,062,568
- Issue date Aug 13, 2024
- Tokai Carbon Korea Co., Ltd.
- Kyoung Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retaining ring having inner surfaces with features
- Patent number 12,048,981
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Steven Mark Reedy
- B24 - GRINDING POLISHING
Information Patent Grant
Chuck for processing semiconductor workpieces at high temperatures
- Patent number 12,046,503
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Dawei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of, and an apparatus for, rinsing materialographic samples
- Patent number 11,998,956
- Issue date Jun 4, 2024
- STRUERS APS
- Thomas Matschofsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin substrate handling via edge clamping
- Patent number 11,996,315
- Issue date May 28, 2024
- Applied Materials, Inc.
- Abhishek Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holding apparatus, elastic membrane, polishing apparatus,...
- Patent number 11,958,163
- Issue date Apr 16, 2024
- Ebara Corporation
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer detection device and wafer detection method using the same
- Patent number 11,961,749
- Issue date Apr 16, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,955,365
- Issue date Apr 9, 2024
- Tokyo Electron Limited
- Yoshinori Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipping mechanism for fastening a substrate for a surface treatmen...
- Patent number 11,942,356
- Issue date Mar 26, 2024
- SEMSYSCO GMBH
- Andreas Gleissner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 11,935,773
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, systems, and methods of measuring edge ring distance for...
- Patent number 11,915,953
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Ole Luckner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP wafer cleaning equipment, wafer transfer robot and wafer flippi...
- Patent number 11,908,720
- Issue date Feb 20, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B08 - CLEANING
Information Patent Grant
Method and apparatus for insitu adjustment of wafer slip detection...
- Patent number 11,904,431
- Issue date Feb 20, 2024
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250054793
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...
- Publication number 20250054803
- Publication date Feb 13, 2025
- PSK Holdings Inc.
- Gunwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250029865
- Publication date Jan 23, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION RETAINING RING
- Publication number 20250022744
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Ryo HIRUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM
- Publication number 20250022690
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Chiuan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RINGS FOR IMPROVED EDGED UNIFORMITY IN SEMICONDUCTOR PROCESSIN...
- Publication number 20250014938
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
- Publication number 20250006516
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Noriiki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF
- Publication number 20250006529
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Theodorus G.M. Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION
- Publication number 20240429089
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Peter MURAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...
- Publication number 20240399535
- Publication date Dec 5, 2024
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
CLAMP RING AND METHOD OF USING CLAMP RING
- Publication number 20240387233
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE CLAMP FOR PHYSICAL VAPOR DEPOSITION
- Publication number 20240376591
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Sathiyamurthi GOVINDASAMY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLIPPING APPARATUS
- Publication number 20240347361
- Publication date Oct 17, 2024
- ACM RESEARCH (SHANGHAI), INC.
- He Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE MEASUREMENT SYSTEM
- Publication number 20240339347
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING HAVING INNER SURFACES WITH FEATURES
- Publication number 20240316723
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Steven Mark Reedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20240312802
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yosuke MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVIATION MEASUREMENT DEVICE
- Publication number 20240282644
- Publication date Aug 22, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RESTRAINING SYSTEM
- Publication number 20240234196
- Publication date Jul 11, 2024
- ASML NETHERLANDS B.V.
- Marinus Augustinus Christiaan VERSCHUREN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS, SYSTEMS, AND METHODS OF MEASURING EDGE RING DISTANCE FOR...
- Publication number 20240203766
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Ole LUCKNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION METHOD OF BONDED SUBSTRATES
- Publication number 20240194492
- Publication date Jun 13, 2024
- SKY TECH INC.
- JUNG-HUA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION JIG AND CALIBRATION METHOD
- Publication number 20240178035
- Publication date May 30, 2024
- Applied Materials, Inc.
- Andrew MYLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240178046
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Yoshinori IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE AND PLASMA PROCESSING APPARATUS
- Publication number 20240153749
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Yasuharu SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240153777
- Publication date May 9, 2024
- Disco Corporation
- Kohei TSUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RESTRAINING SYSTEM
- Publication number 20240136218
- Publication date Apr 25, 2024
- ASML NETHERLANDS B.V.
- Marinus Augustinus Christiaan VERSCHUREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Shield For Stable Tape-Frame Substrate Processing
- Publication number 20240136159
- Publication date Apr 25, 2024
- Harish Varma PENMETHSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND S...
- Publication number 20240093368
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- HONGTAEK LIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
- Publication number 20240096686
- Publication date Mar 21, 2024
- Hon Young Semiconductor Corporation
- Chia-Jen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFER
- Publication number 20240087942
- Publication date Mar 14, 2024
- ROHM CO., LTD.
- Ryosuke YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TRANSPORT METHOD AND APPARATUS
- Publication number 20240079263
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Hung HSIAO
- H01 - BASIC ELECTRIC ELEMENTS

characterised by edge clamping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Clamping device and cleaning device

Plasma control method in semiconductor wafer fabrication

Substrate debonding apparatus

Actively clamped carrier assembly for processing tools

Rotatable thermal processing chamber

Transfer device, processing system, and transfer method

Substrate processing system and transfer method

Screwless semiconductor processing chambers

Integrated substrate measurement system

Calibration jig and calibration method

Clamp ring and method of using clamp ring

Wafer processing apparatus and control method thereof

Storage module, substrate processing system, and method of transfer...

Lithographic apparatus

Minimal contact packaging for process chamber components

Wafer processing apparatus and wafer processing method

Plasma reactor having a variable coupling of low frequency RF power...

SiC edge ring

Retaining ring having inner surfaces with features

Chuck for processing semiconductor workpieces at high temperatures

Method of, and an apparatus for, rinsing materialographic samples

Thin substrate handling via edge clamping

Substrate holding apparatus, elastic membrane, polishing apparatus,...

Wafer detection device and wafer detection method using the same

Substrate processing method and substrate processing apparatus

Clipping mechanism for fastening a substrate for a surface treatmen...

Calibration jig and calibration method

Apparatus, systems, and methods of measuring edge ring distance for...

CMP wafer cleaning equipment, wafer transfer robot and wafer flippi...

Method and apparatus for insitu adjustment of wafer slip detection...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...

WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

EXPANSION RETAINING RING

RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM

EDGE RINGS FOR IMPROVED EDGED UNIFORMITY IN SEMICONDUCTOR PROCESSIN...

SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS

WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF

ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION

METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...

CLAMP RING AND METHOD OF USING CLAMP RING

ADJUSTABLE CLAMP FOR PHYSICAL VAPOR DEPOSITION

FLIPPING APPARATUS

INTEGRATED SUBSTRATE MEASUREMENT SYSTEM

RETAINING RING HAVING INNER SURFACES WITH FEATURES

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICON...

DEVIATION MEASUREMENT DEVICE

SUBSTRATE RESTRAINING SYSTEM

APPARATUS, SYSTEMS, AND METHODS OF MEASURING EDGE RING DISTANCE FOR...

SEPARATION METHOD OF BONDED SUBSTRATES

CALIBRATION JIG AND CALIBRATION METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

STAGE AND PLASMA PROCESSING APPARATUS

WAFER PROCESSING METHOD

SUBSTRATE RESTRAINING SYSTEM

Metallic Shield For Stable Tape-Frame Substrate Processing

EDGE RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND S...

FOCUS RING, APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

METHOD FOR PROCESSING SEMICONDUCTOR WAFER

WAFER TRANSPORT METHOD AND APPARATUS