Patent Application
20190129108
The present invention provides an integrated fiber lighting module that efficiently optically couples and structurally connects lasers or LEDs with light diffusion optical fibers and circuit boards.
Semiconductor lasers, and in particular VCSELs (Vertical-Cavity Surface-Emitting Lasers), are used in a variety of applications wherein the lasers are optically coupled to optical fibers to enable light output from the laser to be transmitted into and through the fiber. Various modules, assemblies or packages have been and are being used to hold and align the laser, other optical components, and optical fiber in order that the laser is as efficiently as possible optically coupled to the fiber. The process of aligning an optical fiber to a laser diode and fixing it in place can be a time-consuming and, therefore, costly step in the manufacturing process. Standard laser package types include coaxial or TO (transistor outline) can laser packages and butterfly laser packages.
In a conventional TO Can laser package, shown in
In a butterfly type laser package, shown in
Both the TO Can and butterfly type packaging are relatively expensive to manufacture and have limited utility for consumer electronics applications, particularly for light diffusion fiber applications, where low cost and spatially efficient packaging are critical.
Thus, it is desirable to provide a module for coupling a laser to an optical fiber that is simple and inexpensive to manufacture and assemble and that is structurally and functionally reliable.
It is to be understood that, unless otherwise stated or contextually evident, as used herein:
With the foregoing objects in mind, the present invention provides a module for optically and mechanically coupling an optical fiber, such as a multi-mode or light diffusion fiber, to a laser or LED diode, such as for example a VCSEL or a LED. The present invention also provides a method for fabricating such a module.
According to one aspect of the invention, a method for optically and structurally coupling an optical fiber to a laser or LED on a substrate in a compact module comprises providing an optical fiber with a core tip exposed and extending from the fiber cladding at a light receiving end of the fiber which may be of the light diffusion type, The exposed core tip is extended into a fiber holder through an aperture in a closed end of the fiber holder. A laser or LED diode is disposed on a top surface of a substrate, and an open end of the fiber holder is positioned on the top surface of the substrate surrounding the laser with the exposed fiber core tip in light-receiving butt-coupled relation to the laser or LED. A resilient strain relief housing is disposed about the light receiving end of the fiber, and the fiber holder and at least the top surface of the substrate are inserted into the strain relief housing in water resistant sealing relation. The laser may, for example, be a VCSEL.
According to another aspect of the invention there is provided a module assembly for optically and structurally coupling an optical fiber to a laser or LED. The module assembly comprises an optical fiber (e.g., a light diffusion optical fiber) having a light-receiving end, an optically transmissive core and a cladding surrounding the core, wherein a portion of core extends axially from the cladding at the light-receiving end of the fiber. A fiber holder has an open end and a closed end with an aperture defined through the closed end, and the light-receiving end of the optical fiber is secured to the closed end of the fiber holder with the exposed core tip extending though the aperture into the holder. A substrate having top and bottom surfaces has a laser or LED disposed on the top surface of said substrate. The open end of the fiber holder is secured to the top surface of the substrate surrounding the laser or LED such that the exposed fiber core tip is butt-coupled to the laser or LED in light-receiving relation. A resilient strain relief housing encloses and provides water resistant sealing for the light receiving end of the fiber, the fiber holder and at least the top surface of the substrate.
A gap in the range of a few microns to a couple of hundred microns may be provided between the butt-coupled laser or LED and the exposed core tip of the optical fiber. The gap may be filled with epoxy having a refractive index matching the refractive index of the optical fiber.
The above and still further features and advantages of the present invention will become apparent upon consideration of the definitions, descriptions and descriptive figures of specific embodiments thereof set forth herein. In the detailed description below, like reference numerals in the various figures are utilized to designate like components and elements, and like terms are used to refer to similar or corresponding elements in the several embodiments. While these descriptions go into specific details of the invention, it should be understood that variations may and do exist and would be apparent to those skilled in the art in view of the following description.
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the inventive concepts and how they may be practiced in particular embodiments. However, it will be understood that those inventive concepts may be practiced without these specific details. In other instances, well-known methods, procedures and techniques have not been described in detail so as not to obscure the present inventions.
The disclosure below is set forth in relation to particular embodiments and with reference to certain drawings; however, the inventions described herein are not limited to the drawings and are to be considered limited only by the claims. Moreover, it is to be understood that the drawings described herein are schematic in nature and are provided only to assist in understanding of the inventions described. In the drawings, the sizes of some of the elements may be exaggerated and not drawn to scale for illustrative purposes. The dimensions and the relative dimensions do not necessarily correspond to actual reductions to practice of the present inventions.
Referring to the embodiment illustrated
A fiber holder 20 has a closed proximal end 21 and an open distal end 22 and is preferably fabricated from a suitable polymer material. In the disclosed embodiment the fiber holder 20 has a generally cylindrical cup-shaped configuration but it will be appreciated that other configurations and materials consistent with the described functional requirements of the fiber holder may be employed. An aperture 23 is defined through the proximal end 21 of the fiber holder and is configured to circumferentially engage the exposed tip of core 11 inserted axially through the aperture. Aperture 23 is preferably centrally located in proximal holder end 21 such that the inserted tip of core 11 and holder 20 are concentrically aligned. The annular shoulder at the end of cladding 12 from, which the core tip extends, abuts and may be secured by suitable adhesive or other means to the exterior surface of proximal end 21 surrounding aperture 23.
A substrate 30, typically a printed circuit board (PCB), has an interiorly facing top surface 31, an exteriorly facing bottom surface 32 and a periphery 33. A laser or LED diode 34, typically a VCSEL or LED, is disposed on the top surface 31 of the substrate 30. As depicted in the illustrated embodiment, miscellaneous electronic components 35, 36 may also be disposed on the substrate top surface. Electrical leads or wires 37 extend from bottom surface 32 for connection to external electrical components. In the illustrated embodiment the substrate 30 is round (i.e., a flat cylinder) and the laser or LED diode 34 is positioned at the center thereof.
The annular open distal end 22 of fiber holder 20 may be secured by a suitable adhesive or other means to the top surface 31 of the substrate 30 in a concentric relation about laser or LED diode 34 such that the exposed tip of core 11 in the fiber holder is aligned with and butt-coupled to the laser or LED diode. Typically, the butt-coupling defines a small gap, anywhere from a few microns but no greater than a two or three hundred microns, between the laser or LED diode 34 and the fiber core tip. For some applications the gap may be filled with epoxy having a refractive index matching the refractive index of the optical fiber. The laser or LED diode 34 and exposed tip of core 11 are thusly coaxially aligned.
A housing 40, in the form of a resilient strain relief member, encloses the fiber holder 20 along with the top surface 31 and periphery 33 of substrate 30. The resilient strain relief housing 40 may have an elongated generally bell-shaped configuration that is open at its wide end, the interior surface 41 of which engages the periphery 33 of substrate 30 in water-resistant sealing relation. The narrow end of housing 40 is closed except for an axially centered aperture 42 defined therein that communicates with a hollow cylindrical fiber retaining tube 43 extending axially through the housing interior, terminating short of the open housing end. Tube 43 is configured to receive and circumferentially surround and engage fiber 10 such that the tip of the fiber core 11 extends in butt-coupling relation to the laser or LED diode 34 as described above. Housing 40 may be made of rubber or other resilient material suitable for serving the protective strain relief and housing functions described herein.
In the structure as described the exposed tip of fiber core 11 extends into fiber holder 20 where it is butt-coupled to the laser or LED diode 34. The strain relief housing contains and protects the coupling region as well as the top surface of the substrate. Although the annular end of the fiber cladding 12 may be secured to the closed end of fiber holder 20 as described, the positional engagement of the fiber may rely solely on frictional or other engagement within the fiber retaining tube 43.
Strain relief housing 40, being resilient, protects the fiber and its positioning against pulling or bending while enclosing and protecting the coupling region and top surface of the substrate in a water resistant engagement. The fiber holder 20 protects the butt coupling region within the housing and may also serve as a polishing holder.
In addition to the structure of the module, as described, the invention includes the method of assembling the module. The method includes the following steps performed not necessarily in the order recited. Optical fiber 10 is provided with an exposed tip of core 11 extending from the fiber cladding at the light receiving end of the fiber. The exposed core tip is inserted into fiber holder 20 through aperture 23 at the closed end of the fiber holder. Laser or LED 34 is disposed on the top surface 31 of substrate 30, and an open end of the fiber holder 20 is placed on the top surface of the substrate surrounding the laser or LED with the exposed fiber core tip in light-receiving butt-coupled relation to the laser or LED. Because of the simple design this placement may be accomplished, without laser- or LED fiber alignment complications, using standard pick and place robotic systems. Resilient strain relief housing 40 is secured about the light receiving end of the fiber, and the fiber holder 20 and at least the top surface 31 of the substrate 30 are inserted into and secured to the strain relief housing 40 in water resistant sealing relation.
The schematic diagram of
As noted above, although substrate 30 is illustrated as being circular (i.e., having a flat cylindrical configuration), that is not to be considered as a limiting feature of the invention since the substrate can be a regular or irregular polygon, ellipse, or other shape. In such embodiments the strain relief housing configuration would also be modified to accommodate the substrate configuration for providing the required enclosure and sealing functions. An example of this is illustrated in
The package design described and illustrated provides an integrated solution for laser or LED driver electronics packaging, fiber alignment, strain relief, semi-hermetic sealing (or water resistance sealing) in one simple cost effective design. The advantages of the invention are several. Specifically, as described, the laser or LED and fiber alignment can be accomplished using standard pick and place equipment; no active alignment step is required. Further, fiber holder 20 serves to provide not only a fiber holding function; it also provides protection for the laser or LED diode and associated wiring. Moreover, the strain relief housing unit 40 serves to protect the optical fiber from pulling and bending forces and also protects and provides a water resistant seal for the overall module. Also, housing 40 is configured to permit the remainder of the laser or LED module to be easily inserted therein and sealed, resulting in a simply assembled overall package that can easily be adapted to be fully waterproof.
It will be understood that the principles of the invention apply to embodiments other than those specifically described and illustrated. For example, if desired, holder 20 can be replaced with index matched, transparent encapsulation epoxy. The substrate, instead of a PCB, may be a ceramic package or a lead frame package.
As described herein the invention includes structure and a method of fabricating a structure for a module for coupling a laser or LED diode (e.g., a VCSEL) with light diffusion fiber in butt-coupling relation. The package design integrates solutions for laser or LED driver electronics, and a housing that effects fiber alignment, strain relief, and semi-hermetic sealing (or water resistance sealing) in one simple cost effective design. A PCB assembly is nested into the strain relief housing.
The laser or LED module described is a simple, low cost laser or LED package designed for light diffusion fiber. Only two leads 37 (Vcc and GND) are required to operate the module, although pulse width modulation (PWM) signals can be provided on a third lead with additional functionality (such as light intensity control, dimming, etc).
As noted herein, although the invention has been disclosed with primary application for VCSELs or LEDs, the principles are equally applicable for other lasers, particularly laser diodes that can be mounted on a substrate of the type described.
Having described preferred embodiments of new and improved modular laser or LED connector packaging and method, it is believed that other modifications, variations and changes will be suggested to those skilled in the art in view of the teachings set forth herein. It is therefore to be understood that all such variations, modifications and changes are believed to fall within the scope of the present invention as defined by the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
