Claims
- 1. An apparatus for dispensing solder, comprising a nozzle body having a plurality of substantially parallel flow channels formed therein, each flow channel having an inlet end and a dispenser end having a dispenser end diameter, said dispenser ends forming a row, and wherein the flow channels include side walls having undulations along the length thereof, said undulations having a height equal to approximately 1/10 of the diameter of the dispenser end and a frequency width equal to approximately 14/100 of the diameter of the dispenser end.
Parent Case Info
This is a divisional of application(s) Ser. No. 08/649,750 filed on May 15, 1996, now U.S. Pat. No. 5,746,368.
US Referenced Citations (27)
Foreign Referenced Citations (2)
Number |
Date |
Country |
60-92072 |
Jan 1985 |
JPX |
1249163 |
Jan 1989 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
649750 |
May 1996 |
|