Solder materials or compositions ; Methods of application thereof

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H05K3/3457

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3457Solder materials or compositions ; Methods of application thereof

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for step-soldering
- Patent number 12,179,291
- Issue date Dec 31, 2024
- Senju Metal Industry Co., Ltd.
- Takashi Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,251
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,252
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount technology method and magnetic carrier system
- Patent number 12,114,435
- Issue date Oct 8, 2024
- SanDisk Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Selective soldering with photonic soldering technology
- Patent number 12,041,728
- Issue date Jul 16, 2024
- Apple Inc.
- Maryam Rahimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket having solder balls
- Patent number 11,916,328
- Issue date Feb 27, 2024
- Tyco Electronics Japan G.K.
- Naoki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member and bonding method
- Patent number 11,819,915
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 11,813,686
- Issue date Nov 14, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, electron...
- Patent number 11,765,828
- Issue date Sep 19, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal composition, intermetallic compound member and joined body
- Patent number 11,746,398
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Masumi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 11,641,718
- Issue date May 2, 2023
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin flux solder paste and mount structure
- Patent number 11,623,307
- Issue date Apr 11, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for solder paste printing on components
- Patent number 11,622,451
- Issue date Apr 4, 2023
- IO Tech Group Ltd.
- Ziv Gilan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, electron...
- Patent number 11,589,461
- Issue date Feb 21, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 11,510,314
- Issue date Nov 22, 2022
- Xerox Corporation
- Naveen Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for formation of patterned solder mask
- Patent number 11,477,894
- Issue date Oct 18, 2022
- Picosun Oy
- Marko Pudas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, chip solder, solder paste and solder joint
- Patent number 11,465,244
- Issue date Oct 11, 2022
- Senju Metal Industry Co., Ltd.
- Ken Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, electron...
- Patent number 11,419,212
- Issue date Aug 16, 2022
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Ren Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board, printed circuit boa...
- Patent number 11,382,209
- Issue date Jul 5, 2022
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, solder paste, and solder joint
- Patent number 11,344,976
- Issue date May 31, 2022
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material for active soldering and method for active solde...
- Patent number 11,338,397
- Issue date May 24, 2022
- Rogers Germany GmbH
- Stefan Britting
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electronic control module
- Patent number 11,343,920
- Issue date May 24, 2022
- Robert Bosch GmbH
- Udo Kaess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free and antimony-free tin solder reliable at high temperatures
- Patent number 11,090,768
- Issue date Aug 17, 2021
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 10,937,707
- Issue date Mar 2, 2021
- Kyocera Corporation
- Hiroshi Kawagoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder alloy, solder joint, solder paste composition, ele...
- Patent number 10,926,360
- Issue date Feb 23, 2021
- Tamura Corporation
- Masaya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid high temperature lead-free solder preform
- Patent number 10,888,958
- Issue date Jan 12, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining material and method for manufacturing joined body
- Patent number 10,888,961
- Issue date Jan 12, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihiro Kawaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,530
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroki Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR STEP-SOLDERING
- Publication number 20250065449
- Publication date Feb 27, 2025
- SENJU METAL INDUSTRY CO., LTD.
- Takashi SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20240224436
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...
- Publication number 20240172375
- Publication date May 23, 2024
- Delta Electronics, Inc.
- Quansong Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164026
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
- Publication number 20240147619
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jongwan SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20230420343
- Publication date Dec 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Huifang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...
- Publication number 20230371180
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Yohan MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Mount Technology Method and Magnetic Carrier System
- Publication number 20230371185
- Publication date Nov 16, 2023
- Western Digital Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW MELTING-POINT BONDING MEMBER, METHOD FOR PRODUCING SAME, SEMICO...
- Publication number 20230347453
- Publication date Nov 2, 2023
- SHINRYO CORPORATION
- Hirotoshi NISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
- Publication number 20230330788
- Publication date Oct 19, 2023
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230300993
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- JOOYOUNG KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230276577
- Publication date Aug 31, 2023
- IBIDEN CO., LTD.
- Yasushi USAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...
- Publication number 20230247773
- Publication date Aug 3, 2023
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...
- Publication number 20230240021
- Publication date Jul 27, 2023
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STEP-SOLDERING
- Publication number 20230226648
- Publication date Jul 20, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Takashi SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT INSPECTION FEATURES
- Publication number 20230164923
- Publication date May 25, 2023
- KOLLMORGEN CORPORATION
- Jeffery Todd BREWSTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...
- Publication number 20230164917
- Publication date May 25, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-ABSORBING EPOXY FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20230131422
- Publication date Apr 27, 2023
- Hojeonable Inc.
- Jong Tae MOON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET
- Publication number 20230125153
- Publication date Apr 27, 2023
- NITTO DENKO CORPORATION
- Akiko TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...
- Publication number 20230067621
- Publication date Mar 2, 2023
- HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20220418104
- Publication date Dec 29, 2022
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE AND AN ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20220418108
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for Forming Silicon Carbide Module Integrated Structure
- Publication number 20220394857
- Publication date Dec 8, 2022
- PHIHONG TECHNOLOGY CO., LTD.
- Kao Ping Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...
- Publication number 20220353992
- Publication date Nov 3, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ren XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220216302
- Publication date Jul 7, 2022
- InnoLux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...
- Publication number 20220195177
- Publication date Jun 23, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Shohei SANADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Solder materials or compositions ; Methods of application thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for step-soldering

Electromagnetic compatibility contact between metal castings and pr...

Electromagnetic compatibility contact between metal castings and pr...

Surface mount technology method and magnetic carrier system

Hybrid nanosilver/liquid metal ink composition and uses thereof

Selective soldering with photonic soldering technology

Socket having solder balls

Bonding member and bonding method

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Flexible printed circuit and manufacturing method thereof, electron...

Metal composition, intermetallic compound member and joined body

Electromagnetic compatibility contact between metal castings and pr...

Resin flux solder paste and mount structure

Systems and methods for solder paste printing on components

Flexible printed circuit and manufacturing method thereof, electron...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Method for formation of patterned solder mask

Solder alloy, solder ball, chip solder, solder paste and solder joint

Flexible printed circuit and manufacturing method thereof, electron...

Method for manufacturing printed circuit board, printed circuit boa...

Solder material, solder paste, and solder joint

Soldering material for active soldering and method for active solde...

Method for producing an electronic control module

Lead-free and antimony-free tin solder reliable at high temperatures

Wiring substrate, electronic device, and electronic module

Lead-free solder alloy, solder joint, solder paste composition, ele...

Hybrid high temperature lead-free solder preform

Joining material and method for manufacturing joined body

Method of processing solder bump by vacuum annealing

Solder ball, solder joint, and joining method

Patents Applicationslast 30 patents

METHOD FOR STEP-SOLDERING

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

Lead-Free Solder Ball

INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME

METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND E...

PRINTED CIRCUIT BOARD

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE

DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...

Surface Mount Technology Method and Magnetic Carrier System

LOW MELTING-POINT BONDING MEMBER, METHOD FOR PRODUCING SAME, SEMICO...

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

METHOD FOR MANUFACTURING WIRING SUBSTRATE

ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...

ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...

METHOD FOR STEP-SOLDERING

SOLDER JOINT INSPECTION FEATURES

FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...

LIGHT-ABSORBING EPOXY FILM AND MANUFACTURING METHOD THEREOF

BONDING SHEET

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS

ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PR...

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

INTERPOSER STRUCTURE AND AN ELECTRONIC DEVICE INCLUDING THE SAME

Method for Forming Silicon Carbide Module Integrated Structure

FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRON...

ELECTRONIC DEVICE

FLUX RESIN COMPOSITION, ELECTRONIC COMPONENT, METHOD FOR MANUFACTUR...