Claims
- 1. Apparatus for processing infrared signals, comprising:
- a pyroelectric detector array including a plurality of detector elements;
- a plurality of electrically conductive epoxy polymer mounting means having two ends and attached at one end to said array to provide individual electrical contact for each of said detector elements;
- circuit means attached to the other end of said mounting means for processing electrical signals from said array; and
- means included in said mounting means for providing electrical conductivity between said array and said circuit means sufficient to enable the interoperation thereof while in addition providing thermal isolation so that said array has an improved thermal responsivity.
- 2. The apparatus of claim 1 wherein said pyroelectric material is selected from the group consisting of lithium tantalate, strontium barium niobate and triglycene sulfate.
- 3. The device of claim 1 wherein said epoxy polymer has an electrical conductivity of at least 5.times.10.sup.-7 mho/cm and a thermal conductivity of less than 10.sup.-2 watt/cm.sup.2 .degree.C.
- 4. The device of claim 1 wherein said improved thermal responsivity is at least twice that provided by an indium mounting means.
- 5. The device of claim 1 wherein said infrared thermal responsivity is at least a factor of three times greater than that provided by an indium mounting means.
- 6. In a device for processing infrared signals having a pyroelectric detector array including individual detector elements and a circuit means for processing electrical signals from each of said elements, the improvement comprising:
- a plurality of electrically conductive epoxy polymer mounting means having two ends and attached at one end to said array to provide individual electrical contact for each of said elements and attached at the other end of said mounting means to provide contact with said circuit means,
- wherein the material utilized in said mounting means has sufficient electrical properties to enable the proper operation between each of said elements and said circuit means and also has a thermal isolation property so that said array provides an improved thermal responsivity thereby enhancing the operation of said device.
- 7. The device of claim 6 wherein said epoxy polymer has an electrical conductivity of at least 5.times.10.sup.-7 mho/cm and a thermal conductivity of less than 10.sup.-2 watt/cm.sup.2 .degree.C.
- 8. The device of claim 6 wherein said improved thermal responsivity is at least twice that provided by an indium mounting means.
- 9. The device of claim 6 wherein said infrared thermal responsivity is at least a factor of three times greater than that provided by an indium mounting means.
Parent Case Info
This application is a continuation of application Ser. No. 108,759, filed Dec. 31, 1979 and now abandoned.
US Referenced Citations (7)
Continuations (1)
|
Number |
Date |
Country |
Parent |
108759 |
Dec 1979 |
|