Claims
- 1. A magnetic memory comprising
a plurality of magnetic memory cells, a first plurality of write lines, the first plurality of write lines being a plurality of magnetic write lines; and a second plurality of write lines, at least one of the plurality of magnetic lines and at least one of the second plurality of write lines each carrying a current for writing to at least one of the plurality of magnetic memory cells.
- 2. The magnetic memory of claim 1 wherein the first plurality of write lines include a plurality of magnetic bit lines electrically connected to the plurality or magnetic memory cells.
- 3. The magnetic memory of claim 2 wherein the plurality of magnetic memory cells include a plurality of magnetic tunneling junction stacks, each of the plurality of magnetic tunneling junction stacks includes a free layer, an insulator layer and a pinned layer, the free layer and the pinned layer being ferromagnetic, the insulator layer residing between the free layer and a pinned layer and having a thickness that allows tunneling of charge carriers between the free layer and the pinned layer.
- 4. The magnetic memory of claim 3 wherein the plurality of magnetic bit lines are separated from the free layer by less than or equal to three hundred Angstroms.
- 5. The magnetic memory of claim 4 wherein each of the plurality of magnetic tunneling junction stacks includes a nonmagnetic spacer layer between the free layer and a corresponding magnetic bit line, the nonmagnetic spacer layer being conductive.
- 6. The magnetic memory of claim 1 wherein the nonmagnetic spacer layer is a high conductivity metal.
- 7. The magnetic memory of claim 1 wherein the high conductivity metal includes gold, copper, aluminum, rhodium, ruthenium, tantalum, and/or an alloy thereof.
- 8. The magnetic memory of claim 5 wherein the nonmagnetic spacer layer includes copper, and wherein the corresponding magnetic bit line includes a diffusion barrier between the copper and a remaining portion of the corresponding magnetic write line.
- 9. The magnetic memory of claim 8 wherein the free layer includes a second diffusion barrier between the copper and the free layer.
- 10. The magnetic memory of claim 9 wherein the diffusion barrier and the second diffusion barrier include cobalt-iron.
- 11. The magnetic memory of claim 3 wherein the magnetic bit line has a first thickness that is greater than a second thickness of the free layer.
- 12. The magnetic memory of claim 11 wherein the first thickness is ten times the second thickness.
- 13. The magnetic memory of claim 11 wherein the first thickness is at least three hundred Angstroms.
- 14. The magnetic memory of claim 1 wherein the plurality of magnetic write lines include soft magnetic materials.
- 15. The magnetic memory of claim 14 wherein the soft magnetic materials include cobalt, nickel, iron, and/or alloys thereof.
- 16. The magnetic memory of claim 1 wherein the plurality of magnetic write lines includes a plurality of composite of magnetic layers.
- 17. The magnetic memory of claim 1 wherein each of the plurality of magnetic write lines has an easy axis substantially oriented parallel to a lengthwise direction of each of the plurality of magnetic write lines.
- 18. The magnetic memory of claim 5 wherein the nonmagnetic spacer layer and the corresponding write line are placed above the magnetic tunneling junction stack, and wherein the second plurality of write lines is placed above the plurality of magnetic write lines and oriented substantially orthogonal to the plurality of magnetic write lines.
- 19. The magnetic memory of claim 18 wherein the plurality of magnetic write lines has a thickness between three hundred Angstroms and three thousand angstroms, thereby minimizing a separation between the second plurality of write lines and the free layer.
- 20. The magnetic memory of claim 5 wherein the magnetic tunneling junction stack further includes a second insulator layer and a second pinned layer, the free layer sandwiched in between the insulator layer and the second insulator layer, the second insulator layer residing between the free layer and the second pinned layer.
- 21. The magnetic memory of claim 1 further comprising a plurality of selection devices, one of the plurality of selection devices corresponding to each of the plurality of magnetic memory cells, wherein each of the plurality of selection devices is a FET including a gate, the gate being connected to an additional read word line.
- 22. The magnetic memory of claim 1 further comprising a plurality of selection devices, each of the plurality of selection devices corresponding to each of the plurality of magnetic memory cells, wherein each of the plurality of selection devices is a diode.
- 23. The magnetic memory of claim 1 wherein the second plurality of write lines are a second plurality of magnetic write lines.
- 24. A method for utilizing a magnetic memory comprising the steps of:
(a) in a write mode, writing to a first portion of a plurality of memory cells, the plurality of memory cells being coupled to a first plurality of write lines and a second plurality of write lines, the first plurality of write lines being a plurality of magnetic write lines, at least one of the plurality of magnetic lines and at least one of the second plurality of write lines each carrying a current for writing to at least one of the plurality of magnetic memory cells. (b) in a read mode, reading from a second portion of the plurality of memory cells.
- 25. The method of claim 24 wherein the first plurality of write lines include a plurality of magnetic bit lines electrically connected to the plurality or magnetic memory cells.
- 26. The method of claim 25 wherein the plurality of magnetic memory cells include a plurality of magnetic tunneling junction stacks, each of the plurality of magnetic tunneling junction stacks includes a free layer, an insulator layer and a pinned layer, the free layer and the pinned layer being ferromagnetic, the insulator layer residing between the free layer and a pinned layer and having a thickness that allows tunneling of charge carriers between the free layer and the pinned layer.
- 27. The method of claim 26 wherein the plurality of magnetic bit lines are separated from the free layer by less than or equal to three hundred Angstroms.
- 28. The method of claim 27 wherein each of the plurality of magnetic tunneling junction stacks includes a nonmagnetic spacer layer between the free layer and a corresponding magnetic bit line, the nonmagnetic spacer layer being conductive.
- 29. The method of claim 24 wherein the nonmagnetic spacer layer is a high conductivity metal.
- 30. The method of claim 28 wherein the nonmagnetic spacer layer includes copper, and wherein the corresponding magnetic bit line includes a diffusion barrier between the copper and a remaining portion of the corresponding magnetic write line.
- 31. The method of claim 30 wherein the free layer includes a second diffusion barrier between the copper and the free layer.
- 32. The method of claim 26 wherein the magnetic bit line has a first thickness that is greater than a second thickness of the free layer.
- 33. The method of claim 32 wherein the first thickness is at least three hundred Angstroms.
- 34. The method of claim 24 wherein the plurality of magnetic write lines include soft magnetic materials.
- 35. The method of claim 24 wherein the plurality of magnetic write lines includes a plurality of composite of magnetic layers.
- 36. The method of claim 24 wherein each of the plurality of magnetic write lines has an easy axis substantially oriented parallel to a lengthwise direction of each of the plurality of magnetic write lines.
- 37. The method of claim 24 wherein the second plurality of write lines is a second plurality of magnetic write lines.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is claiming under 35 USC 19(e) the benefit of provisional patent application serial No. 60/431,742 filed on Dec. 9, 2002.
[0002] The present application is related to co-pending U.S. patent application Ser. No. 60/444,881 (2817P), entitled HIGH DENSITY AND HIGH PROGRAMMING EFFICIENCY MRAM DESIGN, filed on Feb. 5, 2003, and assigned to the assignee of the present application. The present application is related to co-pending U.S. patent application Ser. No. ______ (2818P), entitled MRAM ARCHITECTURE AND A METHOD AND SYSTEM FOR FABRICATING MRAM MEMORIES UTILIZING THE ARCHITECTURE, filed on ______, and assigned to the assignee of the present application. The present application is related to co-pending U.S. patent application Ser. No. ______ (2780P), entitled MRAM ARRAY WITH MAGNETIC WRITE LINES, filed on ______, and assigned to the assignee of the present application.
Provisional Applications (1)
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Number |
Date |
Country |
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60431742 |
Dec 2002 |
US |