Patent Application
20230317348
Distributed active transformers are used in power combining to efficiently increase signal power in radio frequency systems. For some target output signal powers, power amplifiers may require output networks with high transformer ratios such as a one to three transformation. However, the quality factor and coupling coefficients of output transformer combiners degrade with the increased turn ratio and reduced coil size needed to provide such high transformer ratios, decreasing the efficiency.
An apparatus includes a first primary coil, a second primary coil, and a secondary coil. The first and second primary coils each include a first, second, and third portion. The secondary coil includes a first and second portion in a first wafer layer, which are coupled together by a bridge in a second wafer layer. The second portion of the first primary coil is nested inside the first portion of the secondary coil in the first wafer layer. The second portion of the second primary coil is nested inside the second portion of the secondary coil in the first wafer layer. At least parts of the first and third portions of the first primary coil are adjacent the second portion of the secondary coil, and at least parts of the first and third portions of the second primary coil are adjacent the first portion of the secondary coil.
In some implementations, the first and third portions of the first primary coil are in the first wafer layer, and the parts of the first and third portions of the first primary coil are nested outside the second portion of the secondary coil. The first and third portions of the second primary coil are in the first wafer layer, and the parts of the first and third portions of the second primary coil are nested outside the first portion of the secondary coil. The first and second portions of the second primary coil are coupled together in the first wafer layer by a first joiner, and the second and third portions of the second primary coil are coupled together in the first wafer layer by a second joiner, in some implementations.
The first and second portions of the first primary coil are coupled together by a third joiner in the second wafer layer, and the second and third portions of the first primary coil are coupled together by a fourth joiner in the second wafer layer, in some implementations. In other implementations, the first and second portions of the first primary coil are coupled together by a third joiner in a third wafer layer and the second and third portions of the first primary coil are coupled together by a fourth joiner in the third wafer layer. The second wafer layer is above the first wafer layer, and the third wafer layer is below the first wafer layer, in some implementations.
The apparatus can further comprise a first lead coupled to the first portion of the secondary coil and a second lead coupled to the second portion of the secondary coil. The first and second leads provide a differential output signal. In some implementations, the first and second leads are in the second wafer layer. In some implementations, the first and third portions of the first primary coil receive a first differential input signal, and the first and third portions of the second primary coil receive a second differential input signal.
For a detailed description of various examples, reference will now be made to the accompanying drawings in which:
The same reference number is used in the drawings for the same or similar (either by function and/or structure) features.
The described multi-turn distributed active transformer (DAT) power combiners include first and second primary coils having three portions each and a secondary coil with two portions. The first and second portions of the secondary coil are in a first wafer layer and coupled together by a bridge in a second wafer layer adjacent the first wafer layer. The second portions of the first and second primary coils are nested inside the first and second portions of the secondary coil in the first wafer layer. At least parts of the first and third portions of the first primary coil are adjacent the second portion of the secondary coil, and at least parts of the first and third portions of the second primary coil are adjacent the first portion of the secondary coil.
The second portion 120B and the third portion 120C of the first primary coil 120 in layer 160 are coupled together by a second S-shaped joiner 125B in the layer 180. A first via connects the second portion 120B in layer 160 to the second joiner 125B in layer 180, and a second via connects the third portion 120C in layer 160 to the second joiner 125B in layer 180. The third portion 120C of the first primary coil 120 forms a quarter circle around the outside of the first portion 140A of the secondary coil 140 in layer 160 and receives a negative input INM 105B of IN 105. In this example, the layer 180 including the first and second joiners 125A-B is placed below the layer 160 including the first primary coil 120, but in other implementations, the layer 180 is placed in a layer above the layer 160 such as in implementations in which the layer 170 including the bridge 145 and leads 155A-B is placed below the layer 160.
The third portion 130C of the second primary coil 130 forms a quarter circle around the outside of the second portion 140B of the secondary coil 140 in layer 160 and receives a negative input INM 110B of IN 110. In this example, the first and second joiners 125A-B are placed in a different layer 180, and the first and second joiners 135A-B are placed in the same layer 160. In other implementations, the first and second joiners 125A-B are placed in the same layer 160, and the first and second joiners 135A-B are placed in the different layer 180. In some implementations, the layer 170 and the layer 180 are the same layer, such that the bridge 145, the leads 155A-B, and the joiners 125A-B and 135A-B are in a same layer.
Similarly in path 220, the current directions between the outer, first portion 130A of the second primary coil 130 to the inner, second portion 130B of the second primary coil 130 are the same, and the current directions between the inner, second portion 130B to the outer, third portion 130C of the second primary coil 130 are the same. The same current direction throughout path 220 increases the mutual inductance of the second primary coil 130. In addition, the same widths of the portions 120A-C of the first primary coil 120 cause the input signal IN 105 to have a same signal strength and phase throughout the portions 120A-C. The same widths of the portions 130A-C of the second primary coil 130 cause the input signal IN 110 to have a same signal strength and phase throughout the portions 130A-C.
The first primary coil 320 is described further with respect to
The second portion 320B of the first primary coil 320 nests on the inside the first portion 340A of the secondary coil 340 in layer 370. The shape of the third portion 320C of the first primary coil 320 in layer 380 is arranged such that the via 325B couples the second portion 320B in layer 370 to the third portion 320C in layer 380. The third portion 320C receives a negative input INM 305B of the first input signal IN 305. The layer 380 is placed below the layer 370 in this example, but in other implementations, the layer 380 is placed above the layer 370.
The second portion 330B of the second primary coil 330 nests on the inside the second portion 340B of the secondary coil 340 in layer 370. The shape of the third portion 330C of the second primary coil 330 in layer 380 is arranged such that the via 335B couples the second portion 330B in layer 370 to the third portion 330C in layer 380. The third portion 330C receives a negative input INM 310B of the second input signal IN 310. The layer 380 is placed below the layer 370 in this example, but in other implementations, the layer 380 is placed above the layer 370.
In this example, the first portion 320A and the third portion 320C of the first primary coil 320 and the first portion 330A and the third portion 330C of the second primary coil 330 are placed in a layer 380 that is different from the layer 375 including the second portion 340B of the secondary coil 340. In other implementations, the first portion 320A and the third portion 320C of the first primary coil 320 and the first portion 330A and the third portion 330C of the second primary coil 330 are placed in the same layer 375 including the second portion 340B of the secondary coil 340.
The second portion 420B forms a half circle along the inside of the secondary coil 440 in the same first layer as the first portion 420A. The second portion 420B and the third portion 420C of the first primary coil 420 in the first layer are coupled together by a second joiner 425B in the same or the different layer of the DAT power combiner 400. The second joiner 425B is in a same layer as the first joiner 425A. The third portion 420C of the first primary coil 420 forms a quarter circle and receives a negative input INM 405B of IN 405.
The first portion 430A of the second primary coil 430 receives a positive input INP 410A of a second differential input signal IN 410 and forms a quarter circle in the first layer of DAT power combiner 400. The first portion 430A and the second portion 430B of the second primary coil 430 are coupled together by a first joiner 435A in the same layer or a different, second layer of the DAT power combiner 400 as the first and second portions 430A and 430B, respectively. In implementations in which the joiners 425A-B are in the same, first layer as the first, second, and third portions 420A-C of the first primary coil 420 and the first and second portions 430A-B of the second primary coil 430, the joiner 435A is in the second layer. In implementations in which the joiners 425A-B are in the different, second layer of the DAT power combiner 400 as the first, second, and third portions 420A-C of the first primary coil 420 and the first and second portions 430A-B of the second primary coil 430, the joiner 435A can be in the same, first layer as the first, second, and third portions 420A-C of the first primary coil 420 and the first and second portions 430A-B of the second primary coil 430 or a different, third layer from both the first layer and the different, second layer.
The second portion 430B of the second primary coil 430 forms a half circle along the inside of the secondary coil 440. The second portion 430B and the third portion 430C of the second primary coil 430 are coupled together by a second joiner 435B in the same layer as the first joiner 435A. The third portion 430C of the second primary coil 430 forms a quarter circle and receives a negative input INM 410B of IN 410.
The second portion 440B of the secondary coil 440 forms a circle inside the half circle of the first portion 440A in the first layer. The first and second portions 440A and 440B of the secondary coil 440 are coupled together by a first joiner 445A, which may be in the same or the different second or third layers. The third portion 440C of the secondary coil 440 forms a half circle on the outside of the inner portion 440B and is coupled to the second lead 455B.
The second portion 520B forms a quarter circle in the same first layer as the first portion 520A. The second portion 520B and the third portion 520C of the first primary coil 520 in the first layer are coupled together by a second joiner 525B in the same or the different layer of the DAT power combiner 500. The second joiner 525B is in a same layer as the first joiner 525A. The third portion 520C of the first primary coil 520 forms a half circle and is coupled to the fourth portion 520D by a third joiner 525C in the same layer as the first and second joiners 525A and 525B. The fourth portion 520D forms a quarter circle on the inside of the first portion 520A and is coupled to the fifth portion 520E by a fourth joiner 525D in the same layer as the first, second, and third joiners 525A-C. The fifth portion 520E forms a quarter circle on the outside of the second portion 520B and receives a negative input INM 505B of the first differential input signal IN 505.
The first portion 530A of the second primary coil 530 receives a positive input INP 510A of a second differential input signal IN 510 and forms a quarter circle in the first layer of DAT power combiner 500. The first portion 530A and the second portion 530B of the second primary coil 530 are coupled together by a first joiner 535A in the same layer or a different, third layer of the DAT power combiner 500 as the first and second portions 530A and 530B, respectively. In implementations in which the joiners 525 are in the same, first layer as the first primary coil 520 and the first and second portions 530A-B of the second primary coil 530, the joiner 535A is in the different layer. In implementations in which the joiners 525 are in the different, second layer as the first primary coil 520 and the first and second portions 530A-B of the second primary coil 530, the joiner 535A can be in the same, first layer as the first primary coil 520 and the first and second portions 530A-B of the second primary coil 530 or a different, third layer from both the first layer and the different, second layer.
The second portion 530B of the second primary coil 530 forms a quarter circle along the inside of the secondary coil 540. The second portion 530B and the third portion 530C of the second primary coil 530 are coupled together by a second joiner 535B in the same layer as the first joiner 535A. The third portion 530C of the second primary coil 530 forms a half circle and is coupled to the fourth portion 530D by a third joiner 535C in the same layer as the first and second joiners 535A and 535B. The fourth portion 530D forms a quarter circle on the inside of the first portion 530A and is coupled to the fifth portion 530E by a fourth joiner 535D in the same layer as the first, second, and third joiners 535A-C. The fifth portion 530E forms a quarter circle on the outside of the second portion 530B, and receives a negative input INM 510B of the first differential input signal IN 510.
The second portion 540B of the secondary coil 540 forms a circle inside the half circle of the first portion 540A in the first layer. The first and second portions 540A and 540B of the secondary coil 540 are coupled together by a first joiner 545A, which may be in the same or the different second or third layers. The third portion 540C of the secondary coil 540 forms a half circle on the outside of the inner portion 540B and is coupled to the second lead 555B.
The second portion 620B forms a quarter circle in the same first layer as the first portion 620A. The second portion 620B and the third portion 620C of the first primary coil 620 in the first layer are coupled together by a second joiner 625B in the same or the different layer of the DAT power combiner 600. The second joiner 625B is in a same layer as the first joiner 625A. The third portion 620C of the first primary coil 620 forms a half circle and is coupled to the fourth portion 620D by a third joiner 625C in the same layer as the first and second joiners 625A and 625B. The fourth portion 620D forms a quarter circle on the inside of the first portion 620A and is coupled to the fifth portion 620E by a fourth joiner 625D in the same layer as the first, second, and third joiners 625A-C. The fifth portion 620E forms a quarter circle on the outside of the second portion 620B, and receives a negative input INM 605B of the first differential input signal IN 605.
The first portion 630A of the second primary coil 630 receives a positive input INP 610A of a second differential input signal IN 610 and forms a quarter circle in the first layer of DAT power combiner 600. The first portion 630A and the second portion 630B of the second primary coil 630 are coupled together by a first joiner 635A in the same layer or a different, third layer of the DAT power combiner 600 as the first and second portions 630A and 630B, respectively. In implementations in which the joiners 625 are in the same, first layer as the first primary coil 620 and the first and second portions 630A-B of the second primary coil 630, the joiner 635A is in the different layer. In implementations in which the joiners 625 are in the different, second layer as the first primary coil 620 and the first and second portions 630A-B of the second primary coil 630, the joiner 635A can be in the same, first layer as the first primary coil 620 and the first and second portions 630A-B of the second primary coil 630 or a different, third layer from both the first layer and the different, second layer.
The second portion 630B of the second primary coil 630 forms a quarter circle along the inside of the secondary coil 640. The second portion 630B and the third portion 630C of the second primary coil 630 are coupled together by a second joiner 635B in the same layer as the first joiner 635A. The third portion 630C of the second primary coil 630 forms a half circle and is coupled to the fourth portion 630D by a third joiner 635C in the same layer as the first and second joiners 635A and 635B. The fourth portion 630D forms a quarter circle on the inside of the first portion 630A and is coupled to the fifth portion 630E by a fourth joiner 635D in the same layer as the first, second, and third joiners 635A-C. The fifth portion 630E forms a quarter circle on the outside of the second portion 630B, and receives a negative input INM 610B of the first differential input signal IN 610.
The second portion 640B of the secondary coil 640 forms a smaller half circle opposite the half circle of the first portion 640A in the first layer. The first and second portions 640A and 640B of the secondary coil 640 are coupled together by a first joiner 645A, which may be in the same first layer or the different second or third layers. In implementations in which the joiners 625 or 635 are in the first layer, the joiner 645A is in the different second or third layers. In implementations in which the joiners 625 and 635 are in the different second or third layers, the joiner 645A is in the same first layer.
The third portion 640C of the secondary coil 640 forms a circle inside the half circles of portions 640A and 640B, and is coupled to the portion 640B by a second joiner 645B in the same layer as the first joiner 645A. The fourth portion 640D of the secondary coil 640 forms a half circle between the third portion 640C and the first portion 640A and is coupled to the third portion 640C by a third joiner 645C in the same layer as joiners 645A-B. The fifth portion 640E of the secondary coil 640 forms a half circle outside the second portion 640B and is coupled to the fourth portion 640D by a fourth joiner 645D in the same layer as joiners 645A-C. The fifth portion 640E is further coupled to the second lead 655B.
The two-to-one, two-to-two, three-to-two, and three-to-three turn ratios are shown herein to illustrate the extension of the principled described herein to a variety of turn ratios and layer configurations. Other turn ratios and layer configurations are possible within the scope of this description.
In this description, the term “couple” may cover connections, communications, or signal paths that enable a functional relationship consistent with this description. For example, if device A generates a signal to control device B to perform an action: (a) in a first example, device A is coupled to device B by direct connection; or (b) in a second example, device A is coupled to device B through intervening component C if intervening component C does not alter the functional relationship between device A and device B, such that device B is controlled by device A via the control signal generated by device A.
A device that is “configured to” perform a task or function may be configured (e.g., programmed and/or hardwired) at a time of manufacturing by a manufacturer to perform the function and/or may be configurable (or reconfigurable) by a user after manufacturing to perform the function and/or other additional or alternative functions. The configuring may be through firmware and/or software programming of the device, through a construction and/or layout of hardware components and interconnections of the device, or a combination thereof.
As used herein, the terms “terminal”, “node”, “interconnection”, “pin” and “lead” are used interchangeably. Unless specifically stated to the contrary, these terms are generally used to mean an interconnection between or a terminus of a device element, a circuit element, an integrated circuit, a device or other electronics or semiconductor component.
A circuit or device that is described herein as including certain components may instead be adapted to be coupled to those components to form the described circuitry or device. For example, a structure described as including one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors, and/or inductors), and/or one or more sources (such as voltage and/or current sources) may instead include only the semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, for example, by an end-user and/or a third-party.
Uses of the phrase “ground” in the foregoing description include a chassis ground, an Earth ground, a floating ground, a virtual ground, a digital ground, a common ground, and/or any other form of ground connection applicable to, or suitable for, the teachings of this description. In this description, unless otherwise stated, “about,” “approximately” or “substantially” preceding a parameter means being within +/−10 percent of that parameter.
Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.
