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H01L28/10

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Current Industry

H01L28/10Inductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component module
- Patent number 12,232,269
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-Q switch inductor
- Patent number 12,232,264
- Issue date Feb 18, 2025
- Acacia Communications, Inc.
- Ian Dedic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with airgap electrical isolation
- Patent number 12,211,886
- Issue date Jan 28, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Prateek Kumar Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,205,889
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D MIS-FO hybrid for embedded inductor package structure
- Patent number 12,205,750
- Issue date Jan 21, 2025
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,136
- Issue date Jan 14, 2025
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric 8-shaped inductor and corresponding switched capacitor a...
- Patent number 12,191,342
- Issue date Jan 7, 2025
- Mediatek Inc.
- Ruey-Bo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,191,343
- Issue date Jan 7, 2025
- LAPIS SEMICONDUCTOR CO., LTD.
- Takamitsu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 12,183,774
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- Shiro Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for enhancing quality factor of inductor and m...
- Patent number 12,176,385
- Issue date Dec 24, 2024
- Richwave Technology Corp.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor/core assemblies for integrated circuits
- Patent number 12,156,473
- Issue date Nov 26, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication stack for high integration density superconducting digi...
- Patent number 12,156,484
- Issue date Nov 26, 2024
- Trading Technologies International, Inc.
- Anna Yurievna Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor devices and stacked power supply topologies
- Patent number 12,154,937
- Issue date Nov 26, 2024
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon transformer integrated chip
- Patent number 12,148,693
- Issue date Nov 19, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with TSV inductor
- Patent number 12,142,633
- Issue date Nov 12, 2024
- Mediatek Inc.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,142,561
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 12,136,644
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,132,006
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure and manufacturing method for the same
- Patent number 12,131,863
- Issue date Oct 29, 2024
- Macronix International Co., Ltd.
- Erh-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ferromagnetic-dielectric composite material
- Patent number 12,125,713
- Issue date Oct 22, 2024
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250063746
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250063745
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250054877
- Publication date Feb 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250054867
- Publication date Feb 13, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250046773
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE
- Publication number 20250038157
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Takami MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PLANAR TRANSFORMERS
- Publication number 20250022646
- Publication date Jan 16, 2025
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS
- Publication number 20250022654
- Publication date Jan 16, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015065
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE GATE DRIVER INTEGRATED CIRCUIT USING GALVANIC ISOLATOR
- Publication number 20250015077
- Publication date Jan 9, 2025
- WELLANG CO., LTD.
- Jong Tae HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH GROUP III NITRIDE-BASED AMPLIFIER CIRCUITS
- Publication number 20250015076
- Publication date Jan 9, 2025
- MACOM Technology Solutions Holdings, Inc.
- Simon Maurice Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER
- Publication number 20250006631
- Publication date Jan 2, 2025
- QUALCOMM Incorporated
- Jui-Yi CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250006775
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND
- Publication number 20250006575
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20250006706
- Publication date Jan 2, 2025
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT, MEMORY SYSTEM, AND INFORMATION PROCESSING DE...
- Publication number 20240429266
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Takashi TOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240429216
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS SOLENOID TRANSFORMER AND MANUFACTURING METHOD THEREOF
- Publication number 20240428990
- Publication date Dec 26, 2024
- Tiantong XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429159
- Publication date Dec 26, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SPIRAL COILS
- Publication number 20240429265
- Publication date Dec 26, 2024
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240404967
- Publication date Dec 5, 2024
- ENKRIS SEMICONDUCTOR (WUXI), LTD.
- Guoqiao TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Amplifier System in a Package
- Publication number 20240395645
- Publication date Nov 28, 2024
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures with Compact Copper Conductive Features
- Publication number 20240387604
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387362
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC MATERIAL BASED INTEGRATED INDUCTOR IN SILICON
- Publication number 20240379731
- Publication date Nov 14, 2024
- NVIDIA Corp.
- Padam Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component module

Electronic package and manufacturing method thereof

High-Q switch inductor

Magnetic inductor device and method

Semiconductor structure and method for forming the same

Inductors with airgap electrical isolation

Semiconductor device and method of fabricating the same

3D MIS-FO hybrid for embedded inductor package structure

Semiconductor device

Extended via semiconductor structure and device

Asymmetric 8-shaped inductor and corresponding switched capacitor a...

Semiconductor device and method of manufacturing semiconductor device

Power converter

Integrated magnetic assembly with conductive field plates

Semiconductor device for enhancing quality factor of inductor and m...

Flat no-lead package with surface mounted structure

Inductor/core assemblies for integrated circuits

Fabrication stack for high integration density superconducting digi...

Inductor devices and stacked power supply topologies

Semiconductor device with patterned ground shielding

Silicon transformer integrated chip

Organic interposer including a dual-layer inductor structure and me...

Semiconductor package with TSV inductor

Integrated device and integrated passive device comprising magnetic...

Through electrode substrate and semiconductor device

Process for tuning via profile in dielectric material

Semiconductor package structure

Package

Inductor structure and manufacturing method for the same

Method for manufacturing ferromagnetic-dielectric composite material

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...

INSULATION CHIP AND SEMICONDUCTOR DEVICE

POWER SUPPLY MODULE

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PLANAR TRANSFORMERS

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS

SEMICONDUCTOR PACKAGE

HIGH-VOLTAGE GATE DRIVER INTEGRATED CIRCUIT USING GALVANIC ISOLATOR

SEMICONDUCTOR DIE WITH GROUP III NITRIDE-BASED AMPLIFIER CIRCUITS

INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND

Backside Integrated Voltage Regulator For Integrated Circuits

SEMICONDUCTOR CIRCUIT, MEMORY SYSTEM, AND INFORMATION PROCESSING DE...

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

MEMS SOLENOID TRANSFORMER AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

TRANSFORMER-BASED ISOLATOR WITH SPIRAL COILS

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE

Power Amplifier System in a Package

Semiconductor Structures with Compact Copper Conductive Features

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

FERROMAGNETIC MATERIAL BASED INTEGRATED INDUCTOR IN SILICON

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

FILTER AND MANUFACTURING METHOD THEREFOR

PACKAGE