Claims
- 1. A laminate comprising a layer of conductive metal and a plurality of layers of a cured prepreg, said prepreg comprising a reinforcing material impregnated with a curable material, said curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer wherein said cyanate is a monomer having the structure
- N.ident.C--O--R--[R.sup.1 ].sub.n --O--C.ident.N
- said fluorine containing arylene ether polymer has the structure
- X--R--[R.sup.1 ].sub.m --X
- wherein X is any group capable of reacting with a --C.ident.N group;
- R is an aliphatic or aromatic group which may or may not be fluorosubstituted;
- R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;
- n is 0-10; and
- m is 0-100;
- said dielectric material in the cured state comprising a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
- 2. The laminate of claim 1 wherein said curable material further comprises a nonfluorine-containing cyanate having the structure
- N.ident.C--O--R.sup.2 --[R.sup.3 ].sub.n --O--C.ident.N
- wherein R.sup.2 is an aliphatic or aromatic group;
- R.sup.3 is an aliphatic or aromatic group or R.sup.3 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide; and
- n is 0-10.
- 3. The laminate of claim 2 wherein said curable material further comprises a thermosetting monomer or prepolymer selected from the group consisting of epoxy, bismaleimide, benzocyclobutene, bisnadimide and diacetylene resins.
- 4. The laminate of claim 1 wherein said curable material is heat curable.
- 5. The laminate of claim 1 wherein said curable material is curable within a temperature range of from about 180.degree. C. to 325.degree. C.
- 6. The laminate of claim 1 wherein said curable material is curable within a temperature range of from about 200.degree. C. to 325.degree. C.
- 7. The laminate of claim 1 wherein said reinforcing material is selected from the group consisting of woven fabric and fibers.
- 8. The laminate of claim 7 wherein said reinforcing material is a woven glass fabric.
- 9. The laminate of claim 8 wherein said woven fabric comprises E-glass fibers.
- 10. The laminate of claim 8 wherein said woven fabric comprises K-glass fibers.
- 11. The laminate of claim 8 wherein said woven fabric comprises S-glass fibers.
- 12. The laminate of claim 8 wherein said woven fabric comprises D-glass fibers.
- 13. The laminate of claim 1 wherein said reinforcing material is a non-woven aramid fiber mat.
- 14. The laminate of claim 1 wherein said reinforcing material is a mat of expanded polytetrafluoroethylene.
- 15. The laminate of claim 1 wherein said reinforcing material is a woven carbon fabric or unidirectional carbon fibers.
- 16. The laminate of claim 8 wherein said prepreg has a dielectric constant between about 3.1 and 3.4 and a coefficient of thermal expansion between about 12 and 20.
- 17. The laminate of claim 13 wherein said prepreg has a dielectric constant between about 3.1 and 3.4 and a coefficient of thermal expansion between about 4 and 10.
- 18. The laminate of claim 14 wherein said prepreg has a dielectric constant between about 2.3 and 2.5.
Parent Case Info
This application is a division of application Ser. No. 07/923,723 filed Jul. 31, 1992, now pending.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4745215 |
Cox et al. |
May 1988 |
|
4902752 |
Shimp |
Feb 1990 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
923723 |
Jul 1992 |
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