Number | Name | Date | Kind |
---|---|---|---|
3247573 | Noack | Apr 1966 | |
3423517 | Arrhenius | Jan 1969 | |
3723176 | Theobald et al. | Mar 1973 | |
3800020 | Parfet | Mar 1974 | |
3882059 | Elderbaum | May 1975 | |
4020234 | Gardner | Apr 1977 | |
4346516 | Yokouchi et al. | Aug 1982 | |
4510000 | Kumar | Apr 1985 | |
4552615 | Amendola | Nov 1985 | |
4572754 | Bloom | Feb 1986 | |
4586972 | Yokotani et al. | May 1986 | |
4614837 | Kane et al. | Sep 1986 | |
4649125 | Takeuchi et al. | Mar 1987 | |
4672152 | Shinohara | Jun 1987 | |
4696851 | Pryor | Sep 1987 |
Entry |
---|
Acosta et al., "Planarization of Copper Circuits for Multilevel Ceramic Package", IBM Technical Disclosure Bulletin, vol. 26, No. 10B, 5378 (Mar. 1984). |
Desai et al., "Screen Printing on Indented Ceramic Green Sheets", IBM Technical Disclosurre Bulletin, vol. 16, No. 11, 3561 (Apr. 1974). |
Desai et al., "Adhesion Promotion to Green Ceramic Sheets", IBM Technical Disclosure Bulletin, vol. 16, No. 11, 3563 (Apr. 1974). |