Membership
Tour
Register
Log in
Multilayer substrates
Follow
Industry
CPC
H01L21/4857
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/4857
Multilayer substrates
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device package
Patent number
12,315,785
Issue date
May 27, 2025
Advanced Semiconductor Engineering, Inc.
Yu-Ying Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming RDLs and structure formed thereof
Patent number
12,315,819
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded semiconductor packages and methods thereof
Patent number
12,315,787
Issue date
May 27, 2025
Georgia Tech Research Corporation
Nobuo Ogura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate, electronic device package and method for manufac...
Patent number
12,315,828
Issue date
May 27, 2025
Advanced Semiconductor Engineering, Inc.
Wu Chou Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,315,831
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring structure including low- and high-density conductive structures
Patent number
12,315,820
Issue date
May 27, 2025
Advanced Semiconductor Engineering, Inc.
Wen Hung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
Patent number
12,315,822
Issue date
May 27, 2025
Samsung Electronics Co., Ltd.
Jeongho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,315,786
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and manufacturing method thereof
Patent number
12,315,806
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
Patent number
12,315,741
Issue date
May 27, 2025
Innolux Corporation
Chuan-Ming Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer, manufacturing method therefor, and circuit board assembly
Patent number
12,308,252
Issue date
May 20, 2025
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Man-Zhi Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
12,308,329
Issue date
May 20, 2025
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic device
Patent number
12,308,289
Issue date
May 20, 2025
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrating and accessing passive components in wafer-level packages
Patent number
12,308,335
Issue date
May 20, 2025
Intel Corporation
Gianni Signorini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded product for semiconductor strip and method of manufacturing...
Patent number
12,308,253
Issue date
May 20, 2025
Samsung Electronics Co., Ltd.
Seunghwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package device
Patent number
12,308,323
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with die to die bridge solution and methods of forming t...
Patent number
12,300,619
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning bumps in fan-out packaging process
Patent number
12,300,659
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Jui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aluminum nitride multilayer power module interposer and method
Patent number
12,300,578
Issue date
May 13, 2025
TriPent Power LLC
Stephen P. Nootens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a heat dissipation structure connected...
Patent number
12,300,618
Issue date
May 13, 2025
Taiwna Semiconductor Manufacturing Company, Ltd.
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
12,300,509
Issue date
May 13, 2025
Samsung Electronics Co., Ltd.
Junyong Chung
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Package structure and method for forming same
Patent number
12,300,590
Issue date
May 13, 2025
JCET GROUP CO., LTD.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photonics integrated circuit package
Patent number
12,293,974
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-frequency module having a compartment shield structure
Patent number
12,293,975
Issue date
May 6, 2025
Murata Manufacturing Co., Ltd.
Yoshihito Otsubo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
Patent number
12,293,966
Issue date
May 6, 2025
Chun-Ming Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Package comprising discrete antenna device
Patent number
12,293,980
Issue date
May 6, 2025
QUALCOMM Incorporated
Jaehyun Yeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,293,988
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component carrier with partially metallized hole using anti-plating...
Patent number
12,295,108
Issue date
May 6, 2025
AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
Jiangfeng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor structure and method for forming the same
Patent number
12,295,149
Issue date
May 6, 2025
ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
Shuai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,288,752
Issue date
Apr 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...
Publication number
20250167169
Publication date
May 22, 2025
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
ZHI-YONG HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
Publication number
20250167142
Publication date
May 22, 2025
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE OXIDATION LAYER FOR METAL VOIDING REDUCTION
Publication number
20250167086
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Man-Yun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
Publication number
20250167087
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Dowan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES
Publication number
20250167125
Publication date
May 22, 2025
TEXAS INSTRUMENTS INCORPORATED
Sylvester ANKAMAH-KUSI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL PACKAGE STRUCTURE
Publication number
20250167131
Publication date
May 22, 2025
Advanced Semiconductor Engineering, Inc.
Hsun-Wei CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
Publication number
20250167138
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE
Publication number
20250167097
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Sunnyeong JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250167098
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Kyoung Lim Suk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD AND INSPECTION METHOD TH...
Publication number
20250157826
Publication date
May 15, 2025
InnoLux Corporation
Kuang-Ming FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20250157949
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Chen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
Publication number
20250157904
Publication date
May 15, 2025
InnoLux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
Publication number
20250157956
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250157947
Publication date
May 15, 2025
Advanced Semiconductor Engineering, Inc.
Wen Hung HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20250157910
Publication date
May 15, 2025
Samsung Electronics Co., Ltd.
Jongyoun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING SEMICONDUCTOR STRUCTURES FOR SEMICONDUCTOR PACKAGING
Publication number
20250157906
Publication date
May 15, 2025
Yangtze Memory Technologies Co., Ltd.
Hao ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
Publication number
20250149469
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD...
Publication number
20250149393
Publication date
May 8, 2025
ABSOLICS INC.
Hyejin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
Publication number
20250149400
Publication date
May 8, 2025
ABSOLICS INC.
Bongyeol LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250149401
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
Publication number
20250149454
Publication date
May 8, 2025
STATS ChipPAC Pte Ltd.
Linda Pei Ee Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
Publication number
20250149433
Publication date
May 8, 2025
Intel Corporation
Hongxia FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
Publication number
20250149431
Publication date
May 8, 2025
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
Publication number
20250149461
Publication date
May 8, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...
Publication number
20250140676
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Jeongrim SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
Publication number
20250140700
Publication date
May 1, 2025
QUALCOMM Incorporated
Joan Rey Villarba BUOT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
Publication number
20250140678
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Jihyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
Publication number
20250140707
Publication date
May 1, 2025
ABSOLICS INC.
Tae Kyoung KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
Publication number
20250140708
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS