Multilayer substrates

Industry

CPC
H01L21/4857

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4857Multilayer substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLs and structure formed thereof
- Patent number 12,315,819
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor packages and methods thereof
- Patent number 12,315,787
- Issue date May 27, 2025
- Georgia Tech Research Corporation
- Nobuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure including low- and high-density conductive structures
- Patent number 12,315,820
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,786
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,315,806
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
- Patent number 12,315,741
- Issue date May 27, 2025
- Innolux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, manufacturing method therefor, and circuit board assembly
- Patent number 12,308,252
- Issue date May 20, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,308,289
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 12,308,335
- Issue date May 20, 2025
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with die to die bridge solution and methods of forming t...
- Patent number 12,300,619
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 12,300,509
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Junyong Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module having a compartment shield structure
- Patent number 12,293,975
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,293,988
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...
- Publication number 20250167169
- Publication date May 22, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- ZHI-YONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
- Publication number 20250167142
- Publication date May 22, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE OXIDATION LAYER FOR METAL VOIDING REDUCTION
- Publication number 20250167086
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Man-Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES
- Publication number 20250167125
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester ANKAMAH-KUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20250167131
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20250167097
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sunnyeong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167098
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD AND INSPECTION METHOD TH...
- Publication number 20250157826
- Publication date May 15, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157947
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING SEMICONDUCTOR STRUCTURES FOR SEMICONDUCTOR PACKAGING
- Publication number 20250157906
- Publication date May 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Hao ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD...
- Publication number 20250149393
- Publication date May 8, 2025
- ABSOLICS INC.
- Hyejin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250149400
- Publication date May 8, 2025
- ABSOLICS INC.
- Bongyeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149401
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
- Publication number 20250149454
- Publication date May 8, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20250149431
- Publication date May 8, 2025
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
- Publication number 20250149461
- Publication date May 8, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...
- Publication number 20250140676
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jeongrim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
- Publication number 20250140700
- Publication date May 1, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20250140678
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jihyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250140707
- Publication date May 1, 2025
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20250140708
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package

Method of forming RDLs and structure formed thereof

Embedded semiconductor packages and methods thereof

Package substrate, electronic device package and method for manufac...

Package structure and manufacturing method thereof

Wiring structure including low- and high-density conductive structures

Methods of manufacturing a fan-out panel level semiconductor package

Semiconductor structure and manufacturing method thereof

Electronic device and manufacturing method thereof

Method of manufacturing electronic device with reduced substrate wa...

Interposer, manufacturing method therefor, and circuit board assembly

Chiplet first architecture for die tiling applications

Method for manufacturing an electronic device

Integrating and accessing passive components in wafer-level packages

Molded product for semiconductor strip and method of manufacturing...

Package-on-package device

Interposer with die to die bridge solution and methods of forming t...

Aligning bumps in fan-out packaging process

Aluminum nitride multilayer power module interposer and method

Semiconductor device having a heat dissipation structure connected...

Method of manufacturing semiconductor package

Package structure and method for forming same

Photonics integrated circuit package

High-frequency module having a compartment shield structure

Conductive structure including copper-phosphorous alloy and a metho...

Package comprising discrete antenna device

Semiconductor package and method of forming the same

Component carrier with partially metallized hole using anti-plating...

Capacitor structure and method for forming the same

Semiconductor packages

Patents Applicationslast 30 patents

METHOD OF PACKAGING CHIP, CHIP PACKAGING STRUCTURE, AND TERMINAL DE...

PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS

SURFACE OXIDATION LAYER FOR METAL VOIDING REDUCTION

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES

OPTICAL PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

STRIP SUBSTRATE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING METHOD AND INSPECTION METHOD TH...

PACKAGE STRUCTURE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

MANUFACTURING METHOD OF PACKAGE DEVICE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

FABRICATING SEMICONDUCTOR STRUCTURES FOR SEMICONDUCTOR PACKAGING

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD...

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Methods of Making and Using Pre-Molded Bri...

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...

WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...

SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE

SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE