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H01L21/4857
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4857
Multilayer substrates
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Patents Grants
last 30 patents
Information
Patent Grant
Photonics integrated circuit package
Patent number
12,293,974
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-frequency module having a compartment shield structure
Patent number
12,293,975
Issue date
May 6, 2025
Murata Manufacturing Co., Ltd.
Yoshihito Otsubo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
Patent number
12,293,966
Issue date
May 6, 2025
Chun-Ming Lin
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Package comprising discrete antenna device
Patent number
12,293,980
Issue date
May 6, 2025
QUALCOMM Incorporated
Jaehyun Yeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,293,988
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component carrier with partially metallized hole using anti-plating...
Patent number
12,295,108
Issue date
May 6, 2025
AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
Jiangfeng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor structure and method for forming the same
Patent number
12,295,149
Issue date
May 6, 2025
ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
Shuai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,288,752
Issue date
Apr 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having conductive structures with differ...
Patent number
12,288,744
Issue date
Apr 29, 2025
Intel Corporation
Ji Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating same
Patent number
12,283,578
Issue date
Apr 22, 2025
Samsung Electronics Co., Ltd.
Jeong Hyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic device package and method of manufacturing the same
Patent number
12,283,585
Issue date
Apr 22, 2025
Advanced Semiconductor Engineering, Inc.
Chi-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,278,189
Issue date
Apr 15, 2025
Siliconware Precision Industries Co., Ltd.
Yu-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,278,196
Issue date
Apr 15, 2025
Amkor Technology Singapore Holding Pte Ltd.
Tae Ki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
Patent number
12,278,227
Issue date
Apr 15, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
12,278,214
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
12,272,656
Issue date
Apr 8, 2025
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging substrate and manufacturing method thereof
Patent number
12,272,653
Issue date
Apr 8, 2025
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chao-Tsung Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having an integrated device positioned within...
Patent number
12,272,629
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Monsen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for forming a chip package having first and...
Patent number
12,272,712
Issue date
Apr 8, 2025
Xintec Inc.
Tsang-Yu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer and semiconductor package including same
Patent number
12,272,630
Issue date
Apr 8, 2025
Samsung Electronics Co., Ltd.
Ungcheon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna apparatus and fabrication method
Patent number
12,272,862
Issue date
Apr 8, 2025
Infineon Technologies AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dense via pitch interconnect to increase wiring density
Patent number
12,266,598
Issue date
Apr 1, 2025
International Business Machines Corporation
Francesco Preda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded component package structure and manufacturing method thereof
Patent number
12,267,961
Issue date
Apr 1, 2025
Advanced Semiconductor Engineering, Inc.
Chien-Fan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated devices in semiconductor packages and methods of forming...
Patent number
12,266,619
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,266,673
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
Patent number
12,265,330
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Sih-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilevel package substrate with stair shaped substrate traces
Patent number
12,266,597
Issue date
Apr 1, 2025
Texas Instruments Incorporated
Jaimal Mallory Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing component carrier and component carrier int...
Patent number
12,262,482
Issue date
Mar 25, 2025
AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
Marco Gavagnin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,261,126
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Hsien Chiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
Publication number
20250149469
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD...
Publication number
20250149393
Publication date
May 8, 2025
ABSOLICS INC.
Hyejin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
Publication number
20250149400
Publication date
May 8, 2025
ABSOLICS INC.
Bongyeol LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250149401
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
Publication number
20250149454
Publication date
May 8, 2025
STATS ChipPAC Pte Ltd.
Linda Pei Ee Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
Publication number
20250149433
Publication date
May 8, 2025
Intel Corporation
Hongxia FENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
Publication number
20250149431
Publication date
May 8, 2025
VIA TECHNOLOGIES, INC.
Wen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
Publication number
20250149461
Publication date
May 8, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...
Publication number
20250140676
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Jeongrim SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
Publication number
20250140700
Publication date
May 1, 2025
QUALCOMM Incorporated
Joan Rey Villarba BUOT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
Publication number
20250140678
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Jihyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
Publication number
20250140707
Publication date
May 1, 2025
ABSOLICS INC.
Tae Kyoung KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
Publication number
20250140708
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250140749
Publication date
May 1, 2025
NANYA TECHNOLOGY CORPORATION
Ping HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
Publication number
20250140642
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ming Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...
Publication number
20250142716
Publication date
May 1, 2025
Astera Labs, Inc.
Long YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250140747
Publication date
May 1, 2025
NANYA TECHNOLOGY CORPORATION
Ping HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
Publication number
20250140757
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20250140709
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Junghoon Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
Publication number
20250132236
Publication date
Apr 24, 2025
Siliconware Precision Industries Co., Ltd.
Pao-Hung TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20250132268
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Ming Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE
Publication number
20250132169
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
Publication number
20250132262
Publication date
Apr 24, 2025
QUALCOMM Incorporated
Joan Rey Villarba BUOT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250133653
Publication date
Apr 24, 2025
Siliconware Precision Industries Co., Ltd.
Tsung-Lung SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250133656
Publication date
Apr 24, 2025
LG Innotek Co., Ltd.
Sang Il KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package And Method Of Fabricating The Same
Publication number
20250132263
Publication date
Apr 24, 2025
Samsung Electronics Co., Ltd.
Hae-Jung YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
Publication number
20250125240
Publication date
Apr 17, 2025
LG Innotek Co., Ltd.
Se Woong NA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
Publication number
20250125234
Publication date
Apr 17, 2025
QUALCOMM Incorporated
Manuel ALDRETE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
Publication number
20250125241
Publication date
Apr 17, 2025
iCometrue Company Ltd.
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...
Publication number
20250125247
Publication date
Apr 17, 2025
Samsung Electronics Co., Ltd.
Jaeean Lee
H01 - BASIC ELECTRIC ELEMENTS