The present invention relates generally to plastic substrates which may be useful in products including, but not limited to, visual display devices, and more particularly to multilayer plastic substrates having improved light transmittance.
As used herein, the term “(meth)acrylic” is defined as “acrylic or methacrylic.” Also, (meth)acrylate is defined as “acrylate or methacrylate.”
As used herein, the term “average visible light transmittance” means the average light transmittance over the visible range from 400 to 800 nm.
As used herein, the term “peak visible light transmittance” means the peak light transmittance over the visible range from 400 to 800 nm.
As used herein, the term “polymer precursor” includes monomers, oligomers, and resins, and combinations thereof. As used herein, the term “monomer” is defined as a molecule of simple structure and low molecular weight that is capable of combining with a number of like or unlike molecules to form a polymer. Examples include, but are not limited to, simple acrylate molecules, for example, hexanedioldiacrylate, or tetraethyleneglycoldiacrylate, styrene, methyl styrene, and combinations thereof. The molecular weight of monomers is generally less than 1000, while for fluorinated monomers, it is generally less than 2000. Monomers may be combined to form oligomers and resins but do not combine to form other monomers.
As used herein, the term “oligomer” is defined as a compound molecule of at least two monomers that maybe cured by radiation, such as ultraviolet, electron beam, or x-ray, glow discharge ionization, and spontaneous thermally induced curing. Oligomers include low molecular weight resins. Low molecular weight is defined herein as about 1000 to about 20,000 exclusive of fluorinated monomers. Oligomers are usually liquid or easily liquifiable. Oligomers do not combine to form monomers.
As used herein, the term “resin” is defined as a compound having a higher molecular weight (generally greater than 20,000) which is generally solid with no definite melting point. Examples include, but are not limited to, polystyrene resins, epoxy polyamine resins, phenolic resins, and acrylic resins (for example, polymethylmethacrylate), and combinations thereof.
There is a need for versatile visual display devices for electronic products of many different types. Although many current displays use glass substrates, manufacturers have attempted to produce commercial products, primarily liquid crystal display devices, using unbreakable plastic substrates. These attempts have not been completely successful to date because of the quality, temperature, and permeation limitations of polymeric materials. Flexible plastic substrates, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyether sulfone (PES), have been used in thicknesses from about 0.004 inches to 0.007 inches. However, the surface quality of these substrates is often poor, with the surface having large numbers of scratches, digs, pits, and other defects.
In addition, many polymers exhibit poor oxygen and water vapor permeation resistance, often several orders of magnitude below what is required for product performance. For example, the oxygen transmission rates for materials such polyethylene terephthalate (PET) are as high as 1550 cc/m2/day/micron of thickness (or 8.7 cc/m2/day for 7 mil thickness PET), and the water vapor transmission rates are also in this range. Certain display applications, such as those using organic light emitting devices (OLEDs), require encapsulation that has a maximum oxygen transmission rate of 10−4 to 10−2 cc/m2/day, and a maximum water vapor transmission rate of 10−5 to 10−6 g/m2/day.
Barrier coatings have been applied to plastic substrates to decrease their gas and liquid permeability. Barrier coatings typically consist of single layer thin film inorganic materials, such as Al, SiOx, AlOx, and Si3N4 vacuum deposited on polymeric substrates. A single layer coating on PET reduces oxygen permeability to levels of about 0.1 to 1.0 cc/m2/day, and water vapor permeability of about 0.1 to 1.0 g/m2/day. However, those levels are still insufficient for many display devices.
Additionally, many processes used in the manufacture of displays require relatively high temperatures that most polymer substrates cannot tolerate. For example, the recrystallization of amorphous Si to poly-Si in thin film transistors requires substrate temperatures of at least 160°-250° C., even with pulsed excimer laser anneals. The conductivity of a transparent electrode, which is typically made of indium tin oxide (ITO), is greatly improved if deposition occurs above 220° C. Polyimide curing generally requires temperatures of 250° C. In addition, many of the photolithographic process steps for patterning electrodes are operated in excess of 120° C. to enhance processing speeds in the fabrication. These processes are used extensively in the manufacture of display devices, and they have been optimized on glass and silicon substrates. The high temperatures needed for such processes can deform and damage a plastic substrate, and subsequently destroy the display. If displays are to be manufactured on flexible plastic materials, the plastic must be able to withstand the necessary processing conditions, including high temperatures over 100° C., harsh chemicals, and mechanical damage.
Thus, there is a need for an improved plastic substrate for visual display devices, and for a method of making such a substrate.
The present invention meets this need by providing a multilayer plastic substrate. The substrate consists essentially of a plurality of thin film layers of at least one polymer, the plurality of thin films layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%. The average visible light transmittance is typically greater than about 85%, and it can be greater than about 90%. The peak visible transmittance is typically greater than about 85% and it can be greater than about 90%.
There are typically at least about 50 thin film layers. The number of layers depends on the thickness of the thin film layers and the desired overall thickness of the multilayer plastic substrate. The multilayer plastic substrate is typically at least about 0.001 inches thick, and generally at least about 0.004 inches thick. Each thin film layer is typically less than about 50 μm thick.
Polymers include, but are not limited to (meth)acrylate-containing polymers, styrene containing polymers, methyl styrene containing polymers, and fluorinated polymers, and combinations thereof. The glass transition temperature of the at least one polymer is generally greater than about 150° C., and it may be greater than about 200° C.
The surface roughness of the multilayer plastic substrate is generally less than about 10 nm, and it may be less than about 5 nm, or less than about 2 nm.
The multilayer plastic substrate can have a refractive index of greater than about 1.4 or greater than about 1.5.
The multilayer plastic substrate can include additional layers, including, but not limited to, scratch resistant layers, antireflective coatings, antifingerprint coatings, antistatic coatings, conductive coatings, transparent conductive coatings, and barrier coatings, to provide functionality to the substrate if desired.
Another aspect of the invention involves a method of making the multilayer plastic substrate. The method includes providing a support, depositing a plurality of thin film layers of at least one polymer on the support so that the plurality of thin film layers have sufficient strength to be self-supporting to form the multilayer substrate, and removing the support from the multilayer substrate, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.
The thin film layers can be deposited in a vacuum. One example of a vacuum deposition process is flash evaporation. In this method, depositing the plurality of thin film layers includes flash evaporating a polymer precursor, condensing the polymer precursor as a liquid film, and cross-linking the polymer precursor to form the polymer. The polymer precursor can be cross-linked by any suitable method, including, but not limited to, radiation curing, such as ultraviolet, electron beam, or x-ray, glow discharge ionization, and spontaneous thermally induced curing.
Alternatively, the plurality of thin film layers can be deposited by extruding or casting a layer of polymer precursor, and cross-linking the polymer precursor to form the polymer using any suitable cross-linking method.
Accordingly, it is an object of the present invention to provide an improved, multilayer plastic substrate and to provide a method of making such a substrate.
The multilayer plastic substrate of the present invention consists essentially of a plurality of thin film layers 120 of at least one polymer adjacent to one another. By adjacent, we mean next to, but not necessarily directly next to. In most of the multilayer plastic substrate, the polymer thin film layers will be directly next to one another. However, there can be additional layers intervening between some adjacent layers in order to provide additional functionality to the multilayer plastic substrate, as shown in FIG. 1 and described below.
The plurality of thin film layers have sufficient strength to be self-supporting after they are formed. The exact number of thin film layers is not critical. It depends on the thickness of each of the individual thin film layers and the desired overall thickness of the multilayer plastic substrate. There must be enough thin film layers so that the plurality of thin film layers have sufficient strength to be self-supporting. As used herein, the term self-supporting means the substrate can be handled and processed without the need for an underlying support once the plurality of thin film layers have been deposited. There are typically at least about 50 thin film layers, more typically at least about 100 thin film layers. There are generally in the range of about 500 thin film layers to about 1000 thin film layers or more. Each thin film layer is typically between about 0.05 to about 2 μm thick, generally between about 0.2 to about 0.3 μm. If the thin film layers are extruded, they are usually thicker, typically up to about 50 μm thick, in that case. The multilayer plastic substrate is typically at least about 0.001 inches thick, and generally at least about 0.004 inches thick. A 0.007 inch thick substrate would require about 90 to 350 passes of the web past the polymer precursor sources. The multilayer plastic substrate can be flexible or rigid.
The average visible light transmittance of the multilayer plastic substrate is greater than about 80%, generally greater than 85%, and it may be greater than 90%. The peak visible light transmittance is generally greater than 85%, and it may be greater than 90%.
The at least one polymer can be any suitable polymer, including, but not limited to, polymers made from styrene polymer precursors, polymers made from methyl styrene polymer precursors, polymers made from (meth)acrylate polymer precursors, for example, polymers made from hexanedioldiacrylate or tetraethyleneglycoldiacrylate polymer precursors, and fluorinated polymers, and combinations thereof. Polymers made from (meth)acrylate polymer precursors work well.
The multilayer plastic substrate can be flexible or rigid. Multilayer plastic substrates made from polymers including, but not limited to, (meth)acrylate polymer precursors will be flexible. One advantage of multilayer laminated materials is that they typically have greater strength and flexibility than comparable single layer substrates. A multilayer plastic substrate of the present invention generally has hundreds of cross-linked layers that provide mechanical strength and sufficient rigidity to support the circuitry and devices on the display.
A multilayer plastic substrate made from (meth)acrylate polymer precursors will have excellent transmission at visible wavelengths. Because polymers made from (meth) acrylate polymer precursors have very low optical absorption, a multilayer plastic substrate made entirely from such polymers will have high optical transparency, typically an average visible light transmittance of greater than about 90%. Multilayer substrates made entirely from fluorinated polymers will also have an average visible light transmittance of greater than 90%. Substrates made from styrene and methyl styrene polymers would have an average visible light transmittance of about 89%.
The birefringence present in many flexible substrates can be reduced or eliminated with the present invention because the multilayer plastic substrate is not mechanically stressed during deposition.
Fully cured layers of polymers made from (meth)acrylate polymer precursors generally have a refractive index of greater than about 1.5, while fully cured fluorinated polymers generally have a refractive index of greater than about 1.4. Styrene containing polymers would have a refractive index of about 1.6.
Many optical applications, such as mirrors and reflectors, and display applications, such as organic light emitting devices, require substrates with a surface roughness of less than 2 nm. Surface roughness is the root mean square of peak-to-valley measurement over a specified distance, usually 1 nm. It can be measured using an atomic force microscope or back reflection distribution function. Many substrates do not have the necessary surface smoothness. For example, the surface roughness of PET is about 20-50 nm with 100 nm spikes. In contrast, flash evaporated polymer coatings have a very low surface roughness, generally less than about 10 nm, and it may be less than 5 nm, or less than about 2 nm. Surface roughness on the order of 1 nm has been demonstrated. The surface of the multilayer plastic substrate is specular because of the exceptional smoothness of the polymer layers.
Because the polymer material is highly cross-linked, the multilayer plastic substrate can have a high glass transition temperature and excellent chemical resistance. The glass transition temperature of the at least one polymer is generally greater than about 150° C., and may be greatr than about 200° C.
Polymers including, but not limited to, (meth)acrylates, polycarbonates, polysulfones, polyethersulfones, polymides, polyamides, and polyether napthteates have demonstrated excellent resistance to solvents. This provides protection from processing chemicals, ultraviolet light exposure, and photoresists during lithography processes used to manufacture flat panel displays and their devices.
The thin film layers that form the multilayer substrate can be deposited by any suitable method, including vacuum flash evaporation, extrusion, or casting. With vacuum flash evaporation, deposition can be performed using a rotating drum or strap configuration. The polymer precursor is degassed and metered into a hot tube where it flash evaporates and exits through a nozzle as a polymer precursor gas.
The flash evaporating may be performed by supplying a continuous liquid flow of the polymer precursor into a vacuum environment at a temperature below both the decomposition temperature and the polymerization temperature of the polymer precursor, continuously atomizing the polymer precursor into a continuous flow of droplets, and continuously vaporizing the droplets by continuously contacting the droplets on a heated surface having a temperature at or above a boiling point of the liquid polymer precursor, but below a pyrolysis temperature, forming the evaporate. The droplets typically range in size from about 1 micrometer to about 50 micrometers, by they could be smaller or larger.
Alteratively, the flash evaporating may be performed by supplying a continuous liquid flow of the polymer precursor into a vacuum environment at a temperature below both the decomposition temperature and the polymerization temperature of the polymer precursor, and continuously directly vaporizing the liquid flow of the polymer precursor by continuously contacting the liquid polymer precursor on a heated surface having a temperature at or above the boiling point of the liquid polymer precursor, but below the pyrolysis temperature, forming the evaporate. This may be done using the vaporizer disclosed in U.S. Pat. Nos. 5,402,314, 5,536,323, and 5,711,816, which are incorporated herein by reference.
The polymer precursor then condenses on the support as a liquid film which is subsequently cross-linked to form a polymer by any suitable method, including, but not limited to, radiation, such as ultraviolet, electron beam, or x-ray, glow discharge ionization, and spontaneous thermally induced curing. This process is capable of depositing thousands of polymer layers at web speeds up to 100 m/min.
Alteratively, after degassing, the polymer precursor can be deposited by extruding, spraying, or casting layers of polymer precursor on the support. The polymer precursor is then cross-linked using any suitable method, such as those described above.
The functionality of the multilayer plastic substrate can be increased by the incorporation of functional layers 130, 140, and 150 during the deposition process. These functional layers 130, 140, and 150 can be deposited at any time during the deposition process. They can be deposited below, 130, in between, 140, or on top of, 150, the plurality of thin film layers 120 of the multilayer plastic substrate, as shown in FIG. 1. As used herein, depositing a coating adjacent to the multilayer plastic substrate includes: depositing the coating on the top layer of the multilayer plastic coating; depositing the coating on the multilayer plastic substrate and then depositing additional layers of the multilayer plastic substrate over the coating so that the coating is between the layers of the multilayer plastic substrate; and depositing the coating first and then depositing the layers of the multilayer plastic substrate, and combinations thereof. Functional layers 130, 140, and 150 include, but are not limited to, scratch resistant coatings, antirefelctive coatings, antifingerprint coatings, antistatic coatings, conductive coatings, transparent conductive coatings, and barrier coatings, and other functional layers. Depositing these additional layers allows the multilayer plastic substrate to be specifically tailored to different applications. Little or no surface modification is necessary for deposition of other layers because of the very smooth surface of the multilayer plastic substrate. Interfaces can be graded to bond all integrated functional layers firmly during the same coating run and pumpdown.
For some applications, it may be important that the presence of functional layers not reduce the average visible light transmittance below 80%, for others, not below 85%, and still others, not below 90%. In others, it may be important that the peak visible light transmittance not drop below 85%, and for others, not below 90%. In others, it may be important that the functional layers not increase the surface roughness to greater than about 10 nm, for others, not greater than about 5 nm, and for others, not greater than 2 nm.
One type of functional layer that can be included is a barrier coating. One example of a barrier coating is described in application Ser. No. 09/427,138, filed Oct. 25, 1999, entitled “Environmental Barrier Material for Organic Light Emitting Device and Method of Making,” which is incorporated herein by reference. The barrier coating can be a barrier stack having one or more barrier layers and one or more polymer layers. There could be one polymer layer and one barrier layer, there could be one or more polymer layers on one side of one or more barrier layers, or there could be one or more polymer layers on both sides of one or more barrier layers. The important feature is that the barrier stack have at least one polymer layer and at least one barrier layer. The barrier layers and polymer layers in the barrier stack can be made of the same material or of a different material. The barrier layers are typically in the range of about 100-400 Å thick, and the polymer layers are typically in the range of about 1000-10,000 Å thick.
The number of barrier stacks is not limited. The number of barrier stacks needed depends on the material used for the polymer of the substrate and the level of permeation resistance needed for the particular application. One or two barrier stacks should provide sufficient barrier properties for some applications. The most stringent applications may require five or more barrier stacks.
The barrier layers should be transparent. Transparent barrier materials include, but are not limited to, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof. The metal oxides include, but are not limited to, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof. The metal carbides include, but are not limited to, boron carbide, tungsten carbide, silicon carbide, and combinations thereof. The metal nitrides include, but are not limited to, aluminum nitride, silicon nitride, boron nitride, and combinations thereof. The metal oxynitrides include, but are not limited to, aluminum oxynitride, silicon oxynitride, boron oxynitride, and combinations thereof. The metal oxyborides include, but are not limited to, zirconium oxyboride, titanium oxyboride, and combinations thereof.
The polymer layers of the barrier stacks can be made from (meth)acrylate polymer precursors. The polymer layers in the barrier stacks can be the same or different.
The barrier stacks can be made by vacuum deposition. The barrier layer can be vacuum deposited onto, or into, the multilayer plastic substrate, or another functional layer. The polymer layer is then deposited on the barrier layer, preferably by flash evaporating (meth)acrylate polymer precursors, condensing on the barrier layer, and polymerizing in situ in a vacuum chamber. U.S. Pat. Nos. 5,440,446 and 5,725,909, which are incorporated herein by reference, describe methods of depositing thin film, barrier stacks.
Vacuum deposition includes flash evaporation of (meth) acrylate polymer precursors with in situ polymerization under vacuum, plasma deposition and polymerization of (meth)acrylate polymer precursors, as well as vacuum deposition of the barrier layers by sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma enhanced vapor deposition (ECR-PECVD), and combinations thereof.
In order to protect the integrity of the barrier layer, the formation of defects and/or microcracks in the deposited layer subsequent to deposition and prior to downstream processing should be avoided. The multilayer plastic substrate is preferably manufactured so that the barrier layers are not directly contacted by any equipment, such as rollers in a web coating system, to avoid defects that may be caused by abrasion over a roll or roller. This can be accomplished by designing the deposition system such that the barrier layers are always covered by polymer layers prior to contacting or touching any handling equipment.
While certain representative embodiments and details have been shown for purposes of illustrating the invention, it will be apparent to those skilled in the art that various changes in the compositions and methods disclosed herein may be made without departing from the scope of the invention, which is defined in the appended claims.
This application is a continuation-in-part of U.S. patent application Ser. No. 09/427,138, filed Oct. 25, 1999, entitled “Environmental Barrier Material For Organic Light Emitting Device and Method Of Making,” now U.S. Pat. No. 6,522,067, issued Feb. 18, 2003.
Number | Name | Date | Kind |
---|---|---|---|
2382432 | McManus et al. | Aug 1945 | A |
2384500 | Stoll | Sep 1945 | A |
3475307 | Karl-Heinz et al. | Oct 1969 | A |
3607365 | Lindlof | Sep 1971 | A |
3941630 | Larrabee | Mar 1976 | A |
4061835 | Poppe et al. | Dec 1977 | A |
4098965 | Kinsman | Jul 1978 | A |
4266223 | Frame | May 1981 | A |
4283482 | Hattori et al. | Aug 1981 | A |
4313254 | Feldman et al. | Feb 1982 | A |
4426275 | Meckel et al. | Jan 1984 | A |
4521458 | Nelson | Jun 1985 | A |
4537814 | Itoh et al. | Aug 1985 | A |
4555274 | Kitajima et al. | Nov 1985 | A |
4557978 | Mason | Dec 1985 | A |
4572845 | Christen | Feb 1986 | A |
4581337 | Frey et al. | Apr 1986 | A |
4624867 | Iijima et al. | Nov 1986 | A |
4695618 | Mowrer | Sep 1987 | A |
4710426 | Stephens | Dec 1987 | A |
4722515 | Ham | Feb 1988 | A |
4768666 | Kessler | Sep 1988 | A |
4842893 | Yializis et al. | Jun 1989 | A |
4843036 | Schmidt et al. | Jun 1989 | A |
4854186 | Grolig et al. | Aug 1989 | A |
4855186 | Grolig et at. | Aug 1989 | A |
4889609 | Cannella | Dec 1989 | A |
4913090 | Harada et al. | Apr 1990 | A |
4931158 | Bunshah et al. | Jun 1990 | A |
4934315 | Linnebach et al. | Jun 1990 | A |
4954371 | Yializis | Sep 1990 | A |
4977013 | Ritchie et al. | Dec 1990 | A |
5032461 | Shaw et al. | Jul 1991 | A |
5036249 | Pike-Biegunski et al. | Jul 1991 | A |
5047131 | Wolfe et al. | Sep 1991 | A |
5059861 | Littman et al. | Oct 1991 | A |
5124204 | Yamashita et al. | Jun 1992 | A |
5189405 | Yamashita et al. | Feb 1993 | A |
5203898 | Carpenter et al. | Apr 1993 | A |
5204314 | Kirlin et al. | Apr 1993 | A |
5237439 | Misono et al. | Aug 1993 | A |
5260095 | Affinito | Nov 1993 | A |
5336324 | Stall et al. | Aug 1994 | A |
5354497 | Fukuchi et al. | Oct 1994 | A |
5356947 | Ali et al. | Oct 1994 | A |
5376467 | Abe et al. | Dec 1994 | A |
5393607 | Kawasaki et al. | Feb 1995 | A |
5395644 | Affinito | Mar 1995 | A |
5402314 | Amago et al. | Mar 1995 | A |
5427638 | Goetz et al. | Jun 1995 | A |
5440446 | Shaw et al. | Aug 1995 | A |
5451449 | Shetty et al. | Sep 1995 | A |
5461545 | Leroy et al. | Oct 1995 | A |
5464667 | Kohler et al. | Nov 1995 | A |
5510173 | Pass et al. | Apr 1996 | A |
5512320 | Turner et al. | Apr 1996 | A |
5536323 | Kirlin et al. | Jul 1996 | A |
5547508 | Affinito | Aug 1996 | A |
5554220 | Forrest et al. | Sep 1996 | A |
5576101 | Saitoh et al. | Nov 1996 | A |
5578141 | Mori et al. | Nov 1996 | A |
5607789 | Treger et al. | Mar 1997 | A |
5620524 | Fan et al. | Apr 1997 | A |
5629389 | Roitman et al. | May 1997 | A |
5652192 | Matson et al. | Jul 1997 | A |
5654084 | Egert | Aug 1997 | A |
5660961 | Yu | Aug 1997 | A |
5665280 | Tropsha | Sep 1997 | A |
5681615 | Affinito et al. | Oct 1997 | A |
5681666 | Treger et al. | Oct 1997 | A |
5684084 | Lewin et al. | Nov 1997 | A |
5686360 | Harvey, III et al. | Nov 1997 | A |
5693956 | Shi et al. | Dec 1997 | A |
5695564 | Imahashi | Dec 1997 | A |
5711816 | Kirlin et al. | Jan 1998 | A |
5725909 | Shaw et al. | Mar 1998 | A |
5731661 | So et al. | Mar 1998 | A |
5736207 | Walther et al. | Apr 1998 | A |
5747182 | Friend et al. | May 1998 | A |
5757126 | Harvey, et al. | May 1998 | A |
5759329 | Krause et al. | Jun 1998 | A |
5771177 | Tada et al. | Jun 1998 | A |
5771562 | Harvey, III et al. | Jun 1998 | A |
5782355 | Katagiri et al. | Jul 1998 | A |
5792550 | Phillips et al. | Aug 1998 | A |
5795399 | Hasegawa et al. | Aug 1998 | A |
5811177 | Shi et al. | Sep 1998 | A |
5811183 | Shaw et al. | Sep 1998 | A |
5821138 | Yamazaki et al. | Oct 1998 | A |
5821692 | Rogers et al. | Oct 1998 | A |
5844363 | Gu et al. | Dec 1998 | A |
5869791 | Young | Feb 1999 | A |
5872355 | Hueschen | Feb 1999 | A |
5891554 | Hosokawa et al. | Apr 1999 | A |
5895228 | Biebuyck et al. | Apr 1999 | A |
5902641 | Affinito et al. | May 1999 | A |
5902688 | Antoniadis et al. | May 1999 | A |
5904958 | Dick et al. | May 1999 | A |
5912069 | Yializis et al. | Jun 1999 | A |
5919328 | Tropsha et al. | Jul 1999 | A |
5920080 | Jones | Jul 1999 | A |
5922161 | Wu et al. | Jul 1999 | A |
5929562 | Pichler | Jul 1999 | A |
5934856 | Asakawa et al. | Aug 1999 | A |
5945174 | Shaw et al. | Aug 1999 | A |
5948552 | Antoniadis et al. | Sep 1999 | A |
5952778 | Haskal et al. | Sep 1999 | A |
5955161 | Tropsha | Sep 1999 | A |
5965907 | Huang et al. | Oct 1999 | A |
5968620 | Harvey et al. | Oct 1999 | A |
5994174 | Carey et al. | Nov 1999 | A |
5996498 | Lewis | Dec 1999 | A |
6013337 | Knors | Jan 2000 | A |
6040017 | Mikhael et al. | Mar 2000 | A |
6045864 | Lyons et al. | Apr 2000 | A |
6066826 | Yializis | May 2000 | A |
6083313 | Venkatraman et al. | Jul 2000 | A |
6083628 | Yializis | Jul 2000 | A |
6084702 | Byker et al. | Jul 2000 | A |
6087007 | Fujii et al. | Jul 2000 | A |
6092269 | Yializis et al. | Jul 2000 | A |
6106627 | Yializis | Aug 2000 | A |
6117266 | Horzel et al. | Sep 2000 | A |
6118218 | Yializis et al. | Sep 2000 | A |
6146225 | Sheats et al. | Nov 2000 | A |
6146462 | Yializis et al. | Nov 2000 | A |
6150187 | Zyung et al. | Nov 2000 | A |
6165566 | Tropsha | Dec 2000 | A |
6178082 | Farooq et al. | Jan 2001 | B1 |
6195142 | Gyotoku et al. | Feb 2001 | B1 |
6198217 | Suzuki et al. | Mar 2001 | B1 |
6198220 | Jones et al. | Mar 2001 | B1 |
6203898 | Kohler et al. | Mar 2001 | B1 |
6207238 | Affinito | Mar 2001 | B1 |
6207239 | Affinito | Mar 2001 | B1 |
6214422 | Yializis | Apr 2001 | B1 |
6217947 | Affinito | Apr 2001 | B1 |
6224948 | Affinito | May 2001 | B1 |
6228434 | Affinito | May 2001 | B1 |
6228436 | Affinito | May 2001 | B1 |
6231939 | Shaw et al. | May 2001 | B1 |
6264747 | Shaw et al. | Jul 2001 | B1 |
6268695 | Affinito | Jul 2001 | B1 |
6274204 | Affinito | Aug 2001 | B1 |
6322860 | Stein et al. | Nov 2001 | B1 |
6333065 | Arai et al. | Dec 2001 | B1 |
6348237 | Kohler et al. | Feb 2002 | B2 |
6350034 | Fleming et al. | Feb 2002 | B1 |
6352777 | Bulovic et al. | Mar 2002 | B1 |
6358570 | Affinito | Mar 2002 | B1 |
6361885 | Chou | Mar 2002 | B1 |
6397776 | Yang et al. | Jun 2002 | B1 |
6413645 | Graff et al. | Jul 2002 | B1 |
6416872 | Maschwitz | Jul 2002 | B1 |
6420003 | Shaw et al. | Jul 2002 | B2 |
6436544 | Veyrat et al. | Aug 2002 | B1 |
6460369 | Hosokawa | Oct 2002 | B2 |
6465953 | Duggal | Oct 2002 | B1 |
6468595 | Mikhael et al. | Oct 2002 | B1 |
6469437 | Parthasarathy et al. | Oct 2002 | B1 |
6492026 | Graff et al. | Dec 2002 | B1 |
6497598 | Affinito | Dec 2002 | B2 |
6497924 | Affinito et al. | Dec 2002 | B2 |
6509065 | Affinito | Jan 2003 | B2 |
6512561 | Terashiat et al. | Jan 2003 | B1 |
6522067 | Graff et al. | Feb 2003 | B1 |
6537688 | Silvernail et al. | Mar 2003 | B2 |
6544600 | Affinito et al. | Apr 2003 | B2 |
6548912 | Graff et al. | Apr 2003 | B1 |
6569515 | Hebrink et al. | May 2003 | B2 |
6570325 | Graff et al. | May 2003 | B2 |
6573652 | Graff et al. | Jun 2003 | B1 |
6576351 | Silvernail | Jun 2003 | B2 |
6592969 | Burroughes et al. | Jul 2003 | B1 |
6597111 | Silvernail et al. | Jul 2003 | B2 |
6613395 | Affinito et al. | Sep 2003 | B2 |
6614057 | Silvernail et al. | Sep 2003 | B2 |
6624568 | Silvernail et al. | Sep 2003 | B2 |
6627267 | Affinito | Sep 2003 | B2 |
6628071 | Su | Sep 2003 | B1 |
6653780 | Sugimoto et al. | Nov 2003 | B2 |
6656537 | Affinito et al. | Dec 2003 | B2 |
6660409 | Komatsu et al. | Dec 2003 | B1 |
6664137 | Weaver | Dec 2003 | B2 |
6681716 | Schaepkens | Jan 2004 | B2 |
6720203 | Carcia et al. | Apr 2004 | B2 |
6734625 | Vong et al. | May 2004 | B2 |
6737753 | Kumar et al. | May 2004 | B2 |
6743524 | Schaepkens | Jun 2004 | B2 |
6749940 | Terasaki et al. | Jun 2004 | B1 |
6765351 | Forrest et al. | Jul 2004 | B2 |
6803245 | Auch et al. | Oct 2004 | B2 |
6811829 | Affinito et al. | Nov 2004 | B2 |
6815887 | Lee et al. | Nov 2004 | B2 |
6818291 | Funkenbusch et al. | Nov 2004 | B2 |
6835950 | Brown et al. | Dec 2004 | B2 |
6836070 | Chung et al. | Dec 2004 | B2 |
6837950 | Berard | Jan 2005 | B1 |
6864629 | Miyaguchi et al. | Mar 2005 | B2 |
6866901 | Burrows et al. | Mar 2005 | B2 |
6867539 | McCormick et al. | Mar 2005 | B1 |
6872114 | Chung et al. | Mar 2005 | B2 |
6872248 | Mizutani et al. | Mar 2005 | B2 |
6872428 | Yang et al. | Mar 2005 | B2 |
6878467 | Chung et al. | Apr 2005 | B2 |
6888305 | Weaver | May 2005 | B2 |
6888307 | Silvernail et al. | May 2005 | B2 |
6891330 | Duggal et al. | May 2005 | B2 |
6897474 | Brown et al. | May 2005 | B2 |
6897607 | Sugimoto et al. | May 2005 | B2 |
6905769 | Komada | Jun 2005 | B2 |
6923702 | Graff et al. | Aug 2005 | B2 |
6936131 | McCormick et al. | Aug 2005 | B2 |
6975067 | McCormick et al. | Dec 2005 | B2 |
6994933 | Bates | Feb 2006 | B1 |
6998648 | Silvernail | Feb 2006 | B2 |
7002294 | Forrest et al. | Feb 2006 | B2 |
7012363 | Weaver et al. | Mar 2006 | B2 |
7015640 | Schaepkens et al. | Mar 2006 | B2 |
7018713 | Padiyath et al. | Mar 2006 | B2 |
7029765 | Kwong et al. | Apr 2006 | B2 |
7033850 | Tyan et al. | Apr 2006 | B2 |
7056584 | Iacovangelo | Jun 2006 | B2 |
7086918 | Hsiao et al. | Aug 2006 | B2 |
7122418 | Su et al. | Oct 2006 | B2 |
7156942 | McCormick et al. | Jan 2007 | B2 |
7166007 | Auch et al. | Jan 2007 | B2 |
7183197 | Won et al. | Feb 2007 | B2 |
7186465 | Bright | Mar 2007 | B2 |
7221093 | Auch et al. | May 2007 | B2 |
7255823 | Guenther et al. | Aug 2007 | B1 |
20010015074 | Hosokawa | Aug 2001 | A1 |
20010015620 | Affinito | Aug 2001 | A1 |
20020022156 | Bright | Feb 2002 | A1 |
20020025444 | Hebgrink et al. | Feb 2002 | A1 |
20020068143 | Silvernail et al. | Jun 2002 | A1 |
20020069826 | Hunt et al. | Jun 2002 | A1 |
20020102363 | Affinitio et al. | Aug 2002 | A1 |
20020102818 | Sandhu et al. | Aug 2002 | A1 |
20020125822 | Graff et al. | Sep 2002 | A1 |
20020139303 | Yamazaki et al. | Oct 2002 | A1 |
20020140347 | Weaver | Oct 2002 | A1 |
20030038590 | Silvernail et al. | Feb 2003 | A1 |
20030045021 | Akai | Mar 2003 | A1 |
20030085652 | Weaver | May 2003 | A1 |
20030098647 | Silvernail | May 2003 | A1 |
20030117068 | Forrest et al. | Jun 2003 | A1 |
20030124392 | Bright | Jul 2003 | A1 |
20030127973 | Weaver et al. | Jul 2003 | A1 |
20030134487 | Breen et al. | Jul 2003 | A1 |
20030184222 | Nilsson et al. | Oct 2003 | A1 |
20030197197 | Brown et al. | Oct 2003 | A1 |
20030218422 | Park et al. | Nov 2003 | A1 |
20030235648 | Affinito et al. | Dec 2003 | A1 |
20040029334 | Bijker et al. | Feb 2004 | A1 |
20040046497 | Schaepkens et al. | Mar 2004 | A1 |
20040071971 | Lacovangelo | Apr 2004 | A1 |
20040113542 | Hslao et al. | Jun 2004 | A1 |
20040115402 | Schaepkens | Jun 2004 | A1 |
20040115859 | Murayama et al. | Jun 2004 | A1 |
20040119028 | McCormick et al. | Jun 2004 | A1 |
20040175512 | Schaepkens | Sep 2004 | A1 |
20040175580 | Schaepkens | Sep 2004 | A1 |
20040209090 | Iwanaga | Oct 2004 | A1 |
20040219380 | Naruse et al. | Nov 2004 | A1 |
20040229051 | Schaepkens et al. | Nov 2004 | A1 |
20040241454 | Shaw et al. | Dec 2004 | A1 |
20040263038 | Ribotzi et al. | Dec 2004 | A1 |
20050003098 | Kohler et al. | Jan 2005 | A1 |
20050006786 | Sawada | Jan 2005 | A1 |
20050051094 | Schaepkens et al. | Mar 2005 | A1 |
20050079295 | Schaepkens | Apr 2005 | A1 |
20050079380 | Iwanaga | Apr 2005 | A1 |
20050093001 | Liu et al. | May 2005 | A1 |
20050093437 | Ouyang | May 2005 | A1 |
20050094394 | Padiyath et al. | May 2005 | A1 |
20050095422 | Sager et al. | May 2005 | A1 |
20050095736 | Padiyath et al. | May 2005 | A1 |
20050112378 | Naruse et al. | May 2005 | A1 |
20050115603 | Yoshida et al. | Jun 2005 | A1 |
20050122039 | Satani | Jun 2005 | A1 |
20050129841 | McCormick et al. | Jun 2005 | A1 |
20050133781 | Yan et al. | Jun 2005 | A1 |
20050140291 | Hirakata et al. | Jun 2005 | A1 |
20050146267 | Lee et al. | Jul 2005 | A1 |
20050174045 | Lee et al. | Aug 2005 | A1 |
20050202646 | Burrows et al. | Sep 2005 | A1 |
20050212419 | Vazan et al. | Sep 2005 | A1 |
20050224935 | Schaepkens et al. | Oct 2005 | A1 |
20050238846 | Arakatsu et al. | Oct 2005 | A1 |
20060001040 | Kim et al. | Jan 2006 | A1 |
20060003474 | Tyan et al. | Jan 2006 | A1 |
20060028128 | Ohkubo | Feb 2006 | A1 |
20060061272 | McCormick et al. | Mar 2006 | A1 |
20060062937 | Padiyath et al. | Mar 2006 | A1 |
20060063015 | McCormick et al. | Mar 2006 | A1 |
20060132461 | Furukawa et al. | Jun 2006 | A1 |
20060246811 | Winters et al. | Nov 2006 | A1 |
20060250084 | Cok et al. | Nov 2006 | A1 |
20060291034 | Patry et al. | Dec 2006 | A1 |
20070009674 | Okubo et al. | Jan 2007 | A1 |
20070281089 | Heller et al. | Dec 2007 | A1 |
Number | Date | Country |
---|---|---|
704297 | Feb 1968 | BE |
2353506 | May 2000 | CA |
196 03 746 | Apr 1997 | DE |
696 15 510 | May 2002 | DE |
0 147 696 | Jul 1985 | EP |
0 299 753 | Jan 1989 | EP |
0 299 753 | Jan 1989 | EP |
0 340 935 | Nov 1989 | EP |
0 340 935 | Nov 1989 | EP |
0 390 540 | Mar 1990 | EP |
0 390 540 | Oct 1990 | EP |
0 468 440 | Jan 1992 | EP |
0 547 550 | Jun 1993 | EP |
0 547 550 | Jun 1993 | EP |
0 590 467 | Apr 1994 | EP |
0 590 467 | Apr 1994 | EP |
0 722 787 | Jul 1996 | EP |
0 722 787 | Jul 1996 | EP |
0 777 280 | Jun 1997 | EP |
0 777 280 | Jun 1997 | EP |
0 777 281 | Jun 1997 | EP |
0 787 824 | Aug 1997 | EP |
0 787 826 | Aug 1997 | EP |
0 787 826 | Aug 1997 | EP |
0 915 105 | May 1999 | EP |
0 916 394 | May 1999 | EP |
0 916 394 | May 1999 | EP |
0 931 850 | Jul 1999 | EP |
0 931 850 | Jul 1999 | EP |
0 977 469 | Feb 2000 | EP |
0 977 469 | Feb 2000 | EP |
1 021 070 | Jul 2000 | EP |
1127 381 | Aug 2001 | EP |
1 130 420 | Sep 2001 | EP |
1 278 244 | Jan 2003 | EP |
1 426 813 | Jun 2004 | EP |
1 514 317 | Mar 2005 | EP |
2 210 826 | Jun 1989 | GB |
S63-96895 | Apr 1988 | JP |
63136316 | Aug 1988 | JP |
64-18441 | Jan 1989 | JP |
S64-41192 | Feb 1989 | JP |
2-183230 | Jul 1990 | JP |
3-183759 | Aug 1991 | JP |
3-290375 | Dec 1991 | JP |
4-14440 | Jan 1992 | JP |
4-48515 | Feb 1992 | JP |
4-1440 | Apr 1992 | JP |
H4-267097 | Sep 1992 | JP |
05-217158 | Jan 1993 | JP |
5-147678 | Jun 1993 | JP |
H5-182759 | Jul 1993 | JP |
61-36159 | May 1994 | JP |
06158305 | Jun 1994 | JP |
61-79644 | Jun 1994 | JP |
6-234186 | Aug 1994 | JP |
07-074378 | Mar 1995 | JP |
H07-147189 | Jun 1995 | JP |
H7-192868 | Jul 1995 | JP |
8-72188 | Mar 1996 | JP |
H8-171988 | Jul 1996 | JP |
8-179292 | Jul 1996 | JP |
08325713 | Oct 1996 | JP |
8-318590 | Dec 1996 | JP |
09059763 | Apr 1997 | JP |
H9-132774 | May 1997 | JP |
09-161967 | Jun 1997 | JP |
9-161967 | Jun 1997 | JP |
9-201897 | Aug 1997 | JP |
09-232553 | Sep 1997 | JP |
10-725 | Jan 1998 | JP |
10-013083 | Jan 1998 | JP |
10-016150 | Jan 1998 | JP |
H10-41067 | Feb 1998 | JP |
10-334744 | Dec 1998 | JP |
11-017106 | Jan 1999 | JP |
11-040344 | Feb 1999 | JP |
11-149826 | Jun 1999 | JP |
11-255923 | Sep 1999 | JP |
2000-058258 | Feb 2000 | JP |
2002505969 | Feb 2002 | JP |
10312883 | Mar 2002 | JP |
2003282239 | Oct 2003 | JP |
3579556 | Oct 2004 | JP |
2006-294780 | Oct 2006 | JP |
WO 8707848 | Dec 1987 | WO |
WO 8900337 | Jan 1989 | WO |
WO 9510117 | May 1995 | WO |
WO 9623217 | Aug 1996 | WO |
WO 9704885 | Feb 1997 | WO |
WO 9716053 | May 1997 | WO |
WO 9722631 | Jun 1997 | WO |
WO 9810116 | Mar 1998 | WO |
WO 9818852 | May 1998 | WO |
WO 9916557 | Apr 1999 | WO |
WO 9916931 | Apr 1999 | WO |
WO 9946120 | Sep 1999 | WO |
WO 0026973 | May 2000 | WO |
WO 0035603 | Jun 2000 | WO |
WO 0035604 | Jun 2000 | WO |
WO 0035993 | Jun 2000 | WO |
WO 0036661 | Jun 2000 | WO |
WO 0036665 | Jun 2000 | WO |
0053423 | Sep 2000 | WO |
WO 01 68360 | Sep 2001 | WO |
WO 0168360 | Sep 2001 | WO |
WO 0181649 | Nov 2001 | WO |
WO 0182336 | Nov 2001 | WO |
WO 0182389 | Nov 2001 | WO |
WO 0187825 | Nov 2001 | WO |
WO 0189006 | Nov 2001 | WO |
WO 0226973 | Apr 2002 | WO |
WO 03016589 | Feb 2003 | WO |
WO 03098716 | Nov 2003 | WO |
WO 2004006199 | Jan 2004 | WO |
WO 2004016992 | Feb 2004 | WO |
WO 2004070840 | Aug 2004 | WO |
WO 2004089620 | Oct 2004 | WO |
2004112165 | Dec 2004 | WO |
WO 2005015655 | Feb 2005 | WO |
WO 2005045947 | May 2005 | WO |
WO 2005048368 | May 2005 | WO |
2005050754 | Jun 2005 | WO |
WO 2006036492 | Apr 2006 | WO |
2008140313 | Nov 2008 | WO |
2008142645 | Nov 2008 | WO |
Number | Date | Country | |
---|---|---|---|
Parent | 09427138 | Oct 1999 | US |
Child | 09835768 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 09835768 | Apr 2001 | US |
Child | 10889640 | US |