Claims
- 1. A cooling device for an electronic component having a heat-emitting surface; said cooling device comprising:
- a heat sink including:
- a base plate including:
- a bottom including:
- a surface adapted for substantial surface contact with the heat-emitting surface the electronic component;
- a top including:
- a surface; and
- at least three fans mounted to said heat sink above said surface of said top; each fan being operable for generating a flow of air such that the flow impinges on said surface of said top beneath said fan for cooling said surface; should a said fan fail, the other said fans still being operable.
- 2. The cooling device of claim 1, wherein should one fan fail, the other said fans still being operable for generating a flow of air that impinges on said surface of said top beneath said failed fan for cooling said surface of said top beneath said failed fan.
- 3. The cooling device of claim 2, wherein:
- said heat sink includes:
- a left end; and
- a right end; and
- said heat sink top includes:
- fins projecting upward from said top surface defining a central channel means between said left end and said right end of said top for providing a path for air impinging on said top surface in said central channel from an operating fan to impinge on said top surface under an inoperative fan.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of applications: Ser. No. 29/064,341 filed Dec. 30, 1996 titled "Cooling Device" now U.S. Pat. No. D.389,807 and Ser. No. 08/621,448 filed Dec. 30, 1996 titled "Twin Fan Cooling Device" now U.S. Pat. No. 5,638,895 filed Mar. 5, 1996.
US Referenced Citations (15)
Foreign Referenced Citations (2)
Number |
Date |
Country |
3-268394 |
Nov 1991 |
JPX |
5-206668 |
Aug 1993 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
621448 |
Mar 1996 |
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