The present invention relates to drawing heat away from electronics.
Currently, other products provide liquid cooling, but can be serviced only by those trained to disassemble electronic hardware. Such other products may use liquid cooling but do not provide protection or ease of disassembly/re-assembly.
The invention may provide a way to easily cool high-power electronics by circulating liquid through the assembly. There may be a modular enclosure for each printed circuit board (PCB) assembly that is to be cooled. The enclosure may provide mechanical protection for the PCB components and a way to conduct heat to the cold box. The modular enclosures may be installed by sliding them in the cold box where they are pressed against the cooling surface of the cold box by a spring mechanism contained in the cold box. Multiple modular enclosures can be installed in the cold box. The cold box may provide channels for liquid coolant to flow through the walls of the cold box. The cold box can have multiple cooling areas for each modular enclosure.
The invention may enable the easy replacement of modular enclosures while providing a way to conduct heat away from electronics without removing liquid coolant. The invention may be serviced by the end customer who may not have experience with sensitive electronics.
The invention comprises, in one form thereof, a cooling arrangement for electronics, including a plurality of modular electronics enclosures. Each modular electronics enclosure includes at least one electronic component, and a heat sink engaging the electronic component. The cooling arrangement also includes a cold box having a plurality of recesses. Each of the recesses is at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant. Each of the recesses receives a respective one of the modular electronics enclosures. The cold box includes a plurality of springs each biasing a respective heat sink of a respective modular electronics enclosure against a corresponding one of the walls.
The invention comprises, in another form thereof, a cooling arrangement for electronics, including two modular electronics enclosures. Each modular electronics enclosure includes at least one electronic component, and a heat sink engaging the electronic component. A cold box has two recesses. Each of the recesses is at least partially defined by a common wall disposed between the two recesses. The common wall has at least one channel therein carrying liquid coolant. Each of the recesses receives a respective one of the modular electronics enclosures. The cold box includes two springs each biasing a respective heat sink of a respective modular electronics enclosure against a respective side of the common wall.
The invention comprises, in yet another form thereof, a cooling arrangement for electronics, including a plurality of modular electronics enclosures. Each modular electronics enclosure includes at least one electronic component, and a heat sink engaging the electronic component. A cold box has a plurality of recesses. Each of the recesses is at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant. Each of the recesses receives a respective one of the modular electronics enclosures. The cold box includes a plurality of springs each biasing a respective heat sink of a respective modular electronics enclosure against a respective wall. A radiator is in fluid communication with the channel. A pump is in fluid communication with the channel and the radiator. The pump circulates the liquid coolant through the channel and the radiator.
The above-mentioned and other features and objects of this invention, and the manner of attaining them, will become more apparent and the invention itself will be better understood by reference to the following description of embodiments of the invention taken in conjunction with the accompanying drawings, wherein:
The embodiments hereinafter disclosed are not intended to be exhaustive or limit the invention to the precise forms disclosed in the following description. Rather the embodiments are chosen and described so that others skilled in the art may utilize its teachings.
Cold box assembly 12 includes a rear cover 22 (
Each PCB modular enclosure 14 includes a heat sink 34 (
The coolant flow path through channels 30 is shown in
During use, pump 844 circulates liquid coolant through conduits 846 and channels 830 in the directions indicated by arrows 846. The liquid coolant absorbs heat while in channels 830, and expels heat while in conduits 846 and particularly while in radiator 842.
The coolant may circulate repeatedly through the wall by operation of a pump (not shown) in a closed circulation path. Included in the closed circulation path may be a radiator (not shown) where the heat carried by the coolant is absorbed by ambient air.
While this invention has been described as having an exemplary design, the present invention may be further modified within the spirit and scope of this disclosure. This application is therefore intended to cover any variations, uses, or adaptations of the invention using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains.
This application claims benefit of U.S. Provisional Application No. 63/413,889, filed on Oct. 6, 2022, the disclosure of which is hereby incorporated by reference in its entirety for all purposes.
Number | Date | Country | |
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63413889 | Oct 2022 | US |