The present disclosure relates to finned heat exchangers and heat sinks.
This section provides background information related to the present disclosure which is not necessarily prior art.
Heat sinks having multiple cooling fins can be used where heat exchange is required to remove heat generated by electrical components. Examples of electrical components requiring heat removal in applications such as utility vehicles include power converters, voltage regulators, and/or devices which handle current flow or voltage change for components such as electric motors and the like. A size (length and/or height) and density (spacing between fins) are commonly uniformly set which is generally a function of manufacturing efficiency and having ample space for arranging the cooling fins. Uniform size and density fins are practical when heat distribution is uniform, but can result in localized overheating when, for example, approximately 70% or more of the generated heat flow is concentrated in local areas of the heat sink, and particularly when only non-forced convective cooling flow is available.
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
According to several embodiments, a heat sink includes a heat sink plate and at least one heat generating electrical component mounted to a first side of the heat sink plate. A plurality of fins is connected and oriented perpendicular to a second side of the heat sink plate. The plurality of fins includes a maximum height fin positioned proximate to a position of the electrical component, and a minimum height fin spatially separated from the maximum height fin and the electrical component. A first group of fins is positioned between the maximum height fin and the minimum height fin. Each fin of the first group of fins progressively decreases in height from a height of the maximum height fin to a height of the minimum height fin. A first spacing between the maximum height fin and a proximate one of the fins of the first group of fins is less than a second spacing between any two consecutive ones of the first group of fins.
According to other embodiments, a heat sink includes a heat sink plate and an electrical component support directly connected to a first side of the heat sink plate having at least one heat generating electrical component mounted to the electrical component support. A plurality of fins is connected and oriented perpendicular to a second side of the heat sink plate. The plurality of fins includes at least one maximum height fin positioned proximate to the electrical component. First and second minimum height fins are each oppositely positioned with respect to the at least one maximum height fin and spatially separated from the electrical component. A first group of fins is positioned between the at least one maximum height fin and the first minimum height fin. Each fin of the first group of fins progressively decreases in height from a height of the at least one maximum height fin to a height of the first minimum height fin. A second group of fins is positioned between the at least one maximum height fin and the second minimum height fin. Each fin of the second group of fins progressively decreases in height from the height of the at least one maximum height fin to a height of the second minimum height fin.
According to still other embodiments, a heat sink assembly includes a cover box releasably connected to the heat sink plate. The cover box is adapted to enclose the at least one heat generating electrical component and the first side of the heat sink plate.
According to still further embodiments, a method for arranging a plurality of cooling fins of a heat sink includes mounting the at least one heat generating electrical component to a first side of the heat sink plate; extending the plurality of fins perpendicular to a second side of the heat sink plate; positioning the maximum height fin proximate to the electrical component; spatially separating the minimum height fin from the maximum height fin and the electrical component; interposing the first group of fins between the maximum height fin and the minimum height fin; and progressively decreasing a height of each fin of the first group of fins from a height of the maximum height fin to a height of the minimum height fin.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
Example embodiments will now be described more fully with reference to the accompanying drawings.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on”, “engaged to”, “connected to” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to”, “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
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A plurality of heat generating components such as first, second, third, and fourth heat sources 34, 36, 38, 40 can be fixed to a support face 42 of electrical component support 32. Heat generated by any of the first, second, third, or fourth heat sources 34-40 is substantially removed via a conductive transfer path from electrical component support 32 to heat sink plate 16 in each of a first heat transfer path “A” and a second heat transfer path “B”. From first and second heat transfer paths “A” and “B” heat energy is conductively transferred through the plurality of fins 22 and the first and second end walls 18, 20 for convective transfer to air surrounding the fins 22 or forced over the fins 22. To enhance the conductive transfer of heat from electrical component support 32 to heat sink plate 16, a structural reinforcement/connection 44 is created after electrical component support 32 is slidably received within receiving slot 28″. Structural reinforcement/connection 44 can be formed in a plurality of ways including but not limited to the use of a thermally conductive adhesive or by soldering or welding electrical component support 32 to heat sink plate 16. According to additional embodiments, additional heat sources such as heat source 40′ can be directly attached to component attachment side 30 of heat sink plate 16 by fastening and/or adhesive bonding to component attachment side 30.
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It has been determined that in addition to positioning the maximum height fins 46, 48, 50, 52, 54 proximate to electrical component support 32, each of the maximum height fins 46, 48, 50, 52, 54 are also commonly spaced at a maximum height fin spacing “D” which is minimized with respect to the spacing of any other ones of the fins 22. For example, a first reduced height fin 56 positioned to the right as viewed in
Each of the fins 22 beginning at first reduced height fin 56 has a sequentially reduced height from each fin to a proximate fin outward to a first minimum height fin 60 positioned proximate to first end wall 18. Similarly, each of the fins 22 starting at second reduced height fin 58 extending toward the left as viewed in
To structurally account for the removal of material of heat sink plate 16 proximate to the receiving slots 28, a plate reinforcement portion 68 can be provided proximate to any one of the receiving slots 28. A height of an intermediate height fin 66 associated with one of the plate reinforcement portions 68 can be adjusted accordingly to maintain the sequentially decreasing height of fins 22 as they extend away from electrical component support 32. The height of each of the fins 22 can be measured with respect to a plane 70 centrally disposed through heat sink plate 16. The fin geometry shown in
According to several embodiments and for exemplary purposes only, maximum fin height “C” can be approximately 573 mm (2.25 in), and minimum fin height “F” can be 3.43 cm (1.35 in). Maximum height fin spacing “D” can be approximately 7.2 mm (0.28 in), and minimum height fin spacing “G” can be approximately 12.0 mm (0.47 in). The above exemplary dimensions have been found to maintain a maximum temperature differential of approximately 26° C. between third maximum height fin 50 and each of first minimum height fin 60 and second minimum height fin 64 when the maximum temperature is approximately 108° C. due to the heat load from electrical component support 32, operating in an ambient temperature of 50° C.
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A heat sink of the present disclosure offers several advantages. By predetermining a total number of fins, a maximum height of each of fin, a quantity of ribs or waves and the orientation of those ribs or waves created on each of the fins, and varying both the height and spacing of the fins, the overall heat transfer efficiency of the heat sink is improved by maximizing the temperature of each of the fins during operation including those furthest from the heat source. Fins having a maximum height are positioned approximate to the source of heat and each fin positioned away from those maximum height fins steadily decreases in height outward to a minimum height fin. At the same time, the spacing between the maximum height fins is minimized and the spacing between each consecutive fin extending away from the maximum height fin or fins can be increased. The use of ribs or waves on the fins of the present disclosure also maximizes an efficiency of the fins while minimizing the fin height required for achieving maximum efficiency. Although a metal such as aluminum is disclosed for certain embodiments of the present disclosure the present disclosure is not limited to the use of metal for the heat sink material. Other materials capable of conductive to convective heat transfer can be used for the fin designs of the present disclosure.
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the invention, and all such modifications are intended to be included within the scope of the invention.
The present application claims priority from U.S. provisional patent application Ser. No. 61/226,306, filed Jul. 17, 2009, the entire contents of which is hereby incorporated by reference into the present application.
Number | Date | Country | |
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61226306 | Jul 2009 | US |