Claims
- 1. A method of manufacturing an offset printing plate, comprising:
- providing a hard, hydrophilic supporting base material of steel;
- depositing a layer of dull, porous, ink-rejecting chromium directly onto the surface of the steel base material, said chromium layer having a thickness no greater than one micron and being sufficiently thin and porous to permit the desirable properties of hardness and hydrophilicity of the subjacent steel base material to manifest themselves through the chromium layer during printing, and sufficiently thin to permit removal of the chromium layer from a selected area of the offset printing plate by scraping to expose the subjacent surface of the steel base material; the step of depositing comprising the steps of:
- immersing the hydrophilic steel base material in an electrolytic chromium plating solution for an initial period of time without applying a plating current;
- maintaining the temperature of the plating solution at a temperature between 25.degree. and 35.degree. C.;
- subsequently applying a plating current; and
- cutting the current to produce the dull and porous chromium deposit having a thickness no greater than one micron; and
- applying a layer of photosensitive resist material to the plate, said photosensitive resist material being hydrophobic and ink-receptive after insolation and being of sufficient thickness to substantially prevent oxidation of the steel base material through the porous chromium layer during the normal storage period of the offset printing plate prior to use.
- 2. A method of manufacturing an offset printing plate according to claim 1 wherein the steel plate is first roughened to form a dull surface.
- 3. A method of manufacturing an offset printing plate according to claim 2 wherein the roughening of the printing plate is accomplished by anode scouring.
- 4. A method of manufacturing an offset printing plate according to claim 2 wherein the roughening of the printing plate is accomplished by mechanical abrasion.
- 5. A method of manufacturing an offset printing plate according to claim 1 wherein the plating current is cut to produce a chromium deposit having a thickness no greater than 0.3 microns.
- 6. A method of manufacturing an offset printing plate according to claim 8 wherein the steel base material is immersed in the electrolytic chromium plating solution for an initial period of approximately 15 minutes or less without applying a plating current.
- 7. A method of manufacturing an offset printing plate according to claim 1 wherein the temperature of the plating solution is maintained at a temperature of approximately 28.degree. C.
- 8. A method of manufacturing an offset printing plate according to claim 8 wherein the plating is accomplished at a current density of approximately 30 amperes per square decimeter (A/dcm.sup.2) or less.
- 9. A method of manufacturing an offset printing plate according to claim 8 wherein the plating is accomplished at a current density of approximately 15 amperes per square decimeter (A/dcm.sup.2).
- 10. A method of manufacturing an offset printing plate according to claim 1 wherein the plating current is cut after approximately 15 seconds.
- 11. An offset printing plate manufactured according to claim 1.
- 12. A method of manufacturing an offset printing plate, comprising:
- providing a hard, hydrophilic supporting base material of steel;
- depositing a layer of dull, porous, ink-rejecting chromium directly onto the surface of the steel base material, said chromium layer having a thickness no greater than one micron and being sufficiently thin and porous to permit the desirable properties of hardness and hydrophilicity of the subjacent steel base material to manifest themselves through the chromium layer during printing, and sufficiently thin to permit removal of the chromium layer from a selected area of the offset printing plate by scraping to expose the subjacent surface of the steel base material; the step of depositing comprising the steps of:
- immersing the hydrophilic steel base material in an electrolytic chromium plating solution;
- maintaining the temperature of the plating solution at a temperature of between 5.degree. and 8.degree. C.; and
- applying a plating current to produce the chromium deposit having a thickness no greater than 1.0 micron; and
- applying a layer of photosensitive resist material to the plate, said photosensitive resist material being hydrophobic and ink-receptive after insolation and being of sufficient thickness to substantially prevent oxidation of the steel base material through the porous chromium layer during the normal storage period of the offset printing plate prior to use.
- 13. A method of manufacturing an offset printing plate according to claim 12 wherein the plating current is applied until the thickness of the chromium deposit reaches a thickness no greater than 0.5 microns.
- 14. An offset printing plate manufactured according to claim 12.
- 15. An offset printing plate comprising:
- a supporting base material of steel having a hard hydrophilic surface;
- a layer of dull, porous, ink-rejecting chromium plated onto the hard surface of the base material, said chromium layer being of thickness no greater than one micron and being sufficiently thin and porous to permit the desirable properties of hardness and hydrophilicity of the subjacent surface to manifest themselves through the chromium layer during printing, and sufficiently thin to permit removal of the chromium layer from a selected area of the offset printing plate by scraping to expose the subjacent hydrophilic surface; and
- a layer of photosensitive resist material applied directly to the chromium, said photosensitive resist material being hydrophobic and ink-receptive after insolation and being of sufficient thickness to substantially prevent oxidation of the steel base material through the porous chromium layer during the normal storage period of the offset printing plate prior to use.
- 16. An offset printing plate according to claim 15 wherein the layer of chromium is less than 0.5 microns thick.
Parent Case Info
This is a continuation of co-pending application Ser. No. 245,658 filed Sept. 15, 1988, now U.S. Pat. No. 4,857,436, issued Aug. 15, 1989, which is a continuation of abandoned application Ser. No. 138,289 filed Dec. 28, 1987 which is a continuation of abandoned application Ser. No. 481,766 filed Apr. 4, 1983 which is a continuation of abandoned application Ser. No. 168,003 filed Jul. 14, 1980.
US Referenced Citations (19)
Foreign Referenced Citations (6)
Number |
Date |
Country |
98776 |
Jan 1984 |
EPX |
475902 |
Nov 1937 |
GBX |
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May 1963 |
GBX |
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Sep 1963 |
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Non-Patent Literature Citations (1)
Entry |
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Continuations (4)
|
Number |
Date |
Country |
Parent |
245658 |
Sep 1988 |
|
Parent |
138289 |
Dec 1987 |
|
Parent |
481766 |
Apr 1983 |
|
Parent |
168003 |
Jul 1980 |
|