Claims
- 1. An assembly comprising:a transparent optical element adhered to a mount made of material selected from metal and ceramic/glass ceramic by a UV-hardenable adhesive in which said transparent optical element bears in a region of said adhesive, a thin layer that transmits more than 60% at a Hg-1 line and transmits less than 5% at wavelengths below 250 nm.
- 2. The assembly according to claim 1, in which said thin layer transmits less than 2% at wavelengths below 250 nm.
- 3. An assembly, comprising:a holder made of material selected from metal and ceramic/glass ceramic, a transparent optical component that is transparent in the ultraviolet (UV) wavelength region of light, which has functional faces serving for transmission, and adhesive that is hardenable by UV light of a given long wavelength region, a layer applied by thin film technology and fixed to said holder by said adhesive, in which said layer is provided only outside said functional faces and to a high degree at least reflects or absorbs radiated light in a predetermined UV wavelength region within said UV wavelength region transmitted by said transparent optical component, and is transparent in said given long wavelength region to harden said adhesive by UV light irradiation that passes through said transparent optical component and said layer.
- 4. A process for producing a transparent optical component attached to a mount by means of UV-hardenable adhesive, comprising:selecting a thin layer to transmit light in a given spectral region suitable for hardening said adhesive and to a high degree obstruct transmission of UV light in a predetermined spectral region by at least absorption or reflection, within a spectral region transmitted by said optical component, and covering said optical component with said thin layer in a region of said adhesive by thin film technology.
- 5. The process according to claim 4, in which said selecting step comprises selecting a thin layer to obstruct transmission of UV light in said predetermined spectral region that is of shorter wavelength than said given spectral region.
- 6. The process according to claim 4, in which said selecting step comprises selecting a single thin layer.
- 7. The process according to claim 4, in which said covering step is selected from the group consisting of vapor deposition, sputtering with ion support, sputtering without ion support, physical vapor deposition (PVD) and chemical vapor deposition (CVD).
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 33 490 |
Aug 1997 |
DE |
|
Parent Case Info
This application is a divisional of prior application Ser. No. 09/126,693, filed Jul. 30, 1998. Now U.S. Pat. No. 6,097,536.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5493442 |
Buchholz et al. |
Feb 1996 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
62184079 |
Aug 1987 |
JP |
09184917 |
Aug 1987 |
JP |