Claims
- 1. A substrate with a light emitting diode array comprising:
- electric lead patterns provided on a ceramic substrate,
- a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said ceramic substrate,
- a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said ceramic substrate, and
- an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a third portion of said electric lead patterns provided on said ceramic substrate.
- 2. A substrate with a light emitting diode array according to claim 1.
- wherein said electric conducting member is of coefficient of thermal expansion approximately equal to that of said ceramic substrate.
- 3. A substrate with a light emitting diode array according to claim 1,
- wherein said electric conducting member is of a composite metal member composed of three layers including copper, invar and copper.
- 4. A substrate with a light emitting diode array according to claim 1,
- wherein said composite metal member is soldered to said third portion of said electric lead patterns.
- 5. A substrate with a light emitting diode array according to claim 4,
- wherein said first portion of said electric lead patterns includes a common line pattern, and said second portion of said electric lead patterns includes a ground line pattern.
- 6. A substrate with a light emitting diode array according to claim 5,
- wherein said composite metal member is mounted on either one of said common and ground line patterns.
- 7. A substrate with a light emitting diode array according to claim 5,
- wherein said composite metal member includes two composite metal members which are mounted on both of said common and ground line patterns respectively.
- 8. A substrate with a light emitting diode array comprising,
- electric lead patterns provided on a first surface of a ceramic substrate,
- a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said first surface of said ceramic substrate,
- a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said first surface of said ceramic substrate, and
- an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a second surface of said ceramic substrate and connected through through-holes to said electric lead patterns.
Parent Case Info
This is a continuation of application Ser. No. 184,074, filed April 20, 1988, now U.S. Pat. No. 4,829,321.
US Referenced Citations (7)
Continuations (1)
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Number |
Date |
Country |
Parent |
184074 |
Apr 1988 |
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