Hereinafter, the present invention will be described in detail by way of embodiments.
The optical recording medium of the present invention is obtained by irradiating hardening resin with an energy line to form a hardening resin layer with an adhesive layer or a signal pattern surface. The optical recording medium of the present invention is characterized in that the hardening resin layer is formed by using hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges.
In the figures, numerical 1 denotes a first substrate (substrate 1); 2, a reflective layer; 3, a hardening resin layer; 4, a transparent stamper; 5, a reflective layer; 6, a protective layer (organic protective layer); 7, a second substrate (substrate 7); 8, a reflective layer; 9, a hardening resin layer (second hardening resin layer); and 10, a stamper.
An embodiment of the method of producing an optical recording medium of the present invention illustrated in
(1A) a first step of forming a first substrate (referred to as a substrate 1) having a first signal pattern surface (see
(1B) a second step of forming a first recording layer or reflective layer on the first signal pattern surface of the substrate 1 (see
(1C) a third step of coating the first recording layer or reflective layer with a first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and irradiating the first hardening resin with a first energy line, thereby forming a first hardening resin layer in a semi-hardened state (see
(1D) a fourth step of stacking a transparent stamper on the first hardening resin layer in a semi-hardened state, irradiating the first hardening resin layer with a second energy line via the transparent stamper to harden the first hardening resin layer in a semi-hardened state, thereby forming a first hardening resin layer having a second signal pattern surface (see
(1E) a fifth step of forming a second recording layer or reflective layer on the first hardening resin layer having the second signal pattern surface (see
(1F) a sixth step of forming a protective layer on the second recording layer or reflective layer (see
An embodiment of the method of producing an optical recording medium of the present invention illustrated in
(2A) a first step of forming a first substrate (substrate 1) having a first signal pattern surface;
(2B) a second step of forming a first recording layer or reflective layer on the first signal pattern surface of the substrate 1 (see
(2C) a third step of forming a second substrate (referred to as a substrate 7) having a second signal pattern surface;
(2D) a fourth step of forming a second recording layer or reflective layer on the second signal pattern surface of the substrate 7 (see
(2E) a fifth step of coating at least the recording layer or reflective layer of the substrate 1 or substrate 7 with a first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and irradiating the first hardening resin with a first energy line, thereby forming a first hardening resin layer in a semi-hardened state (see
(2F) a sixth step of stacking another substrate on the first hardening resin layer in a semi-hardened state so that a recording layer or reflective layer of the another substrate is opposed to the first hardening resin layer, and irradiating the first hardening resin layer with a second energy line, thereby hardening the first hardening resin in a semi-hardened state (see
(2G) a seventh step of peeling one of the substrates, if required, thereby forming a protective layer on the recording layer or reflective layer.
Further, an embodiment of the method of producing an optical recording medium of the present invention illustrated in
(3A) a first step of forming a first substrate (substrate 1) having a first signal pattern surface (see
(3B) a second step of forming a first recording layer or reflective layer on the first signal pattern surface of the substrate 1 (see
(3C) a third step of forming a second substrate (substrate 7) having a second signal pattern surface (see
(3D) a fourth step of forming a second recording layer or reflective layer on the second signal pattern surface of the substrate 7 (see
(3E) a fifth step of coating at least the recording layer or reflective layer of the substrate 1 or a back surface of the recording layer or reflective layer of the substrate 7 with a first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and irradiating the first hardening resin with a first energy line, thereby forming a first hardening resin layer in a semi-hardened state (see
(3F) a sixth step of stacking the substrate 1 and the substrate 7 on the first hardening resin layer in a semi-hardened state so that the recording layer or reflective layer of the substrate 1 is opposed to the surface of the substrate 7 without the recording layer or reflective layer, and irradiating the first hardening resin layer with a second energy line, thereby hardening the first hardening resin in a semi-hardened state (see
(3G) a seventh step of forming a protective layer on the second recording layer or reflective layer (see
Further, an embodiment of the method of producing an optical recording medium of the present invention illustrated in
(4A) a first step of forming a first substrate (substrate 1) having a first signal pattern surface (see
(4B) a second step of forming a first recording layer or reflective layer on the first signal pattern surface of the substrate 1 (see
(4C) a third step of forming a second substrate (substrate 7) having a second signal pattern surface, if required;
(4D) a fourth step of coating at least a stamper or the second signal pattern surface or a surface without a signal pattern of the substrate 7 with a second hardening resin containing at least three kinds of photopolymerization initiators having different absorbing wavelength ranges, and irradiating the second hardening resin with a first energy line, thereby forming a second hardening resin layer in a first semi-hardened state (see
(4E) a fifth step of stacking the substrate 7 on the second hardening resin layer in a first semi-hardened state formed by coating the stamper with the second hardening resin, stacking a stamper on the second hardening resin layer in a first semi-hardened state formed by coating the second signal pattern surface or the surface without a signal pattern of the substrate 7 with the second hardening resin so that the stamper is opposed to the second hardening resin layer in a first semi-hardened state, and irradiating the stack with a second energy line, thereby forming a second hardening resin layer in a second semi-hardened state (see
(4F) a sixth step of peeling the stamper and forming a second recording layer or reflective layer on the signal pattern surface of the second hardening resin layer in a second semi-hardened state (see
(4G) a seventh step of coating the first recording layer or reflective layer or the second recording layer or reflective layer with a first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and irradiating the first hardening resin with a third energy line, thereby forming a first hardening resin layer in a semi-hardened state (see
(4H) an eighth step of stacking the first hardening resin layer in a semi-hardened state and another substrate so that a recording layer or reflective layer of the another substrate is opposed to the first hardening resin layer, and irradiating the stack with a fourth energy line, thereby hardening the first and second hardening resin layers (see
(4I) a ninth step of peeling the substrate 7 (see
The substrate (e.g., substrates 1 and 7 illustrated in
The recording layer or reflective layer (e.g., recording layers or reflective layers 2, 5, and 8 described in
Examples of a material that can be used for forming the reflective layer include Al, an Al alloy, Si, SiN, Ag, and an Ag alloy. These materials are also used widely and have already been used in the known techniques.
The thickness of each of the above-mentioned recording layer or reflective layer can be set arbitrarily. However, light is attenuated in each recording layer and reflective layer from a light incident surface side, so it is desirable to set the thickness so as to increase the transmittance in a light wavelength to be used toward the incident surface side. It is preferable to form a structure in which there is no problem in recording, reproducing, and erasing in each layer by adjusting the composition and thickness of each recording layer and reflective layer.
By optimizing the composition, thickness or layer formation condition for each hardening resin layer or substrate, a recording layer and a reflective layer with an arbitrary transmittance and reflectivity can be formed. In the present invention, there is no particular limitation to the use of a material for forming a recording layer and a reflective layer suitable for an optical recording medium to be required.
In the present invention, by forming a hardening resin layer, a recording layer, and a reflective layer repeatedly, an optical recording medium with a predetermined multi-layer structure can be formed. In the case of a multi-layer structure, the following methods can be used. That is: a method of stacking a hardening resin layer, and a recording layer or a reflective layer on a substrate; and a method of stacking a plurality of thin substrates, a recording layer or a reflective layer, and a hardening resin layer on a substrate. Further, a method of stacking substrates having a plurality of recording layers or reflective layers and a hardening resin layer, respectively, to each other can also be used.
Next, the recording layer or reflective layer of the first substrate in the production method illustrated in
As the first hardening resin or second hardening resin used in the present invention, any resin can be used as long as the resin reacts with a photopolymerization initiator to effect a polymerization reaction when irradiated with an energy line. A polymerizable resin material such as epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylate, and silicon acrylate, and a material containing an additive such as a reactive diluent can be used. In the same way as in a photopolymerization initiator described later, it is desirable to use a resin having less absorption in a light wavelength range of recording, reproducing, and erasing.
The first hardening resin in the present invention only needs to contain at least two kinds of photopolymerization initiators having different absorbing wavelength ranges. The combination of the above-mentioned two kinds of photopolymerization initiators is not limited to a combination of photopolymerization initiators having respective absorbing wavelength ranges in a UV-light range and a visible light range, and may be a combination of photopolymerization initiators having absorbing wavelength ranges in UV-light ranges with a short wavelength and a long wavelength. Further, the second hardening resin may contain at least three kinds of photopolymerization initiators having different absorbing wavelength ranges. A combination of at least three kinds of photopolymerization initiators may include a combination of, for example, the following three kinds including a UV-light range of a short wavelength range, a UV-light range of a long wavelength range, and a visible light range.
As the photopolymerization initiator that can be used in the present invention, a general radical polymerization initiator and cation polymerization initiator can be used. However, a material with less absorption in a light wavelength range of recording, reproducing, and erasing is desirable. Specifically, there are acetophenone-based, benzoin-based, benzophenone-based, thioxanthene-based, dicarbonyl-based, and acylphosphineoxide-based photopolymerization initiators. Specific examples thereof include 1-hydroxy-cyclohexyl-phenylketone, 2-hydroxy-2-2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropane-1-one.
Further, regarding the first hardening resin, the concentration of the photopolymerization initiator is preferably set to be 0.01 to 10% by mass. When the concentration of the photopolymerization initiator is set to be 0.01% by mass or more, a polymerization reaction can proceed sufficiently. Further, when the concentration of the photopolymerization initiator is set to be 10% by mass or less, the first hardening resin is prevented from being hardened excessively and the photopolymerization initiator is prevented from remaining, whereby the adverse effect such as corrosion of the reflective layer or recording layer can be prevented. When the concentration of the photopolymerization initiator is set to be 0.01% by mass or more, the first hardening resin can be hardened sufficiently even with a light source of a low or high output. Further, the photopolymerization initiator to be used may have a large absorbing wavelength range and influence the light wavelength range of recording, reproducing, and erasing. Therefore, the concentration of the photopolymerization initiator is more preferably 0.1 to 5% by mass. In the case where the first hardening resin contains two kinds of photopolymerization initiators having different absorbing wavelength ranges, it is preferable to set the ratio (mass ratio) in a compounded amount of the photopolymerization initiator having an absorbing wavelength range of 200 to 400 nm to the photopolymerization initiator having an absorbing wavelength range of 400 to 600 nm is set to be 1/10 to 10/1.
Further, regarding the second hardening resin, the concentration of the photopolymerization initiator is preferably set to be 0.015 to 10% by mass. When the concentration of the photopolymerization initiator is 0.015% by mass or more, the hardened state can be controlled. Further, when the photopolymerization initiator is set to be 10% by mass or less, the inhibition of a polymerization reaction due to the excessive addition of a photopolymerization initiator can be prevented. Further, in the same way as in the first hardening resin, the amount of the photopolymerization initiator and a decomposed component remaining after the polymerization reaction can be reduced, whereby odor and an adverse effect on a human body can be prevented. In the case where the second hardening resin contains three kinds of photopolymerization initiators having different absorbing wavelength ranges, it is preferable that the compounded amounts of the photopolymerization initiator having an absorbing wavelength range of 200 to 300 nm, the photopolymerization initiator having an absorbing wavelength range of 300 to 400 nm, and the photopolymerization initiator having an absorbing wavelength range of 400 to 600 nm is preferably set to be 10 to 80% by mass, 10 to 80% by mass, and 10 to 80% by mass, respectively, with respect to the total mass of the photopolymerization initiators.
The method of preparing the first hardening resin and the second hardening resin is not particularly limited. The first hardening resin and second hardening resin may be prepared by a known preparation method, for example, a method of simultaneously mixing a polymerizable resin called an oligomer, a reactive diluent, a photopolymerization initiator, and an additive, and a method of mixing a polymerization resin, a reactive diluent, and a photopolymerization initiator in stages.
Further, the first hardening resin or second hardening resin may be applied by a coating method capable of setting the thickness distribution in which the thickness of a hardening resin layer to be finally formed is within an allowable value, and spin coating, slit coating, slit and spin coating, roll coating or screen printing can be used. Particularly, in the case of coating a substrate having a center hole with the first or second hardening resin, it is preferable to perform a method of enhancing a thickness such as spin coating of closing a center hole so as to enhance the uniformity of a thickness.
In the production methods illustrated in
Specifically, for example, 2% by mass of photopolymerization initiator, benzoin-based benzoinmethylether having an absorbing range in a UV-light range and 0.5% by mass of a photopolymerization initiator, dicarbonyl-based camphorquinone having an absorbing range in a long wavelength range of 400 nm or more are contained in the first hardening resin layer. The first hardening resin layer at 5° C. to 95° C. is irradiated with visible light in a wavelength range of 400 nm or more as the above-mentioned first energy line in the air, whereby a first hardening resin layer in a semi-hardened state is formed. In the irradiation of visible light in a wavelength range of 400 nm or more, for example, a halogen lamp, a light-emitting diode, or a mercury lamp with a UV-light range cut can be used. In this case, the radiation amount is preferably set to be 200 mJ/cm2 to 2000 mJ/cm2.
The first hardening resin layer in a semi-hardened state may be hardened to such an extent that the flowability thereof can be controlled. The extent of hardening may be adjusted in accordance with the composition and production method of the first hardening resin, and the first hardening resin may be generally hardened to such an extent that a gel fraction is 30 to 95%. Preferably, if the first hardening resin is set to be in a semi-hardened state in which a gel fraction is 50 to 90%, the flowability thereof can be controlled easily, and trouble in terms of production due to the shortage of hardening and complete hardening can be reduced. In the present invention, the percentage of a Soxhlet extracted residual with respect to the mass of a sample to be tested, which is used for Soxhlet extraction, is set to be a gel fraction.
Then, the first hardening resin layer in a semi-hardened state is completely hardened by irradiating UV-light in a wavelength range of 400 nm or less.
Specifically, for example, a transparent stamper or a recording layer or a reflective layer of another substrate is stacked on the first hardening resin layer in a semi-hardened state. Alternatively, the another substrate is stacked on the first hardening resin layer such that a surface thereof having no recording layer and reflective layer faces the first hardening resin layer. Then, the stack is irradiated with a second energy line, whereby a completely hardened hardening resin layer is formed. At this time, UV-light having a wavelength range of 400 nm or less is radiated as the second energy line at 5° C. to 95° C. in the air. In the irradiation of UV-light having a wavelength range of 400 nm or less, for example, a high-pressure mercury lamp or a metal halide lamp can be used. In this case, the radiation amount is preferably set to be 200 mJ/cm2 to 2000 mJ/cm2. The gel fraction of the completely hardened first hardening resin layer is preferably 30 to 95%. In this case, the semi-hardened state can be controlled easily, and trouble in terms of production due to insufficient hardening and excess hardening in an intermediate stage can be controlled.
The third or fifth process may be performed as follows. That is, a resin sheet is previously coated with a first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and the first hardening resin is irradiated with a first energy line, whereby a first hardening resin layer in a semi-hardened state is formed. Next, the first recording layer or reflective layer of the first substrate is stacked on the first hardening resin layer in a semi-hardened state, and the resin sheet is peeled. Then, a first hardening resin layer in a semi-hardened state is formed on the surface of the first recording layer or reflective layer of the first substrate.
A resin sheet is previously coated with first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and the first hardening resin is irradiated with a first energy line, whereby a first hardening resin layer in a semi-hardened state is formed. Next, the first recording layer or reflective layer of the first substrate, or the second recording layer or reflective layer of the second substrate is stacked on the first hardening resin layer in a semi-hardened state. Alternatively, the second substrate is stacked on the first hardening resin layer such that a surface thereof having no second recording layer and reflective layer faces the first hardening resin layer. Then, the resin sheet is peeled. Then, a first hardening resin layer in a semi-hardened state is formed on the surface of the first recording layer or reflective layer of the first substrate, the surface of the second recording layer or reflective layer of the second substrate, or the surface thereof having no second recording layer and reflective layer.
In the production method illustrated in
Specifically, for example, at least 0.5% by mass of camphorquinone having an absorbing range in a wavelength range of 400 to 600 nm, 0.5% by mass of a photopolymerization initiator, benzoinisopropylether having an absorbing range in a wavelength range of 300 to 400 nm, and 2.0% by mass of a photopolymerization initiator, benzoinmethylether having an absorbing range in a wavelength range of 200 to 300 nm are contained in the second hardening resin layer. The second hardening resin layer is irradiated with light in a wavelength range of 400 to 600 nm as the first energy line at 5° C. to 95° C. in the air, whereby a second hardening resin layer in a first semi-hardened state is formed. In the irradiation of light in a wavelength range of 400 to 600 nm, for example, a halogen lamp or a light-emitting diode can be used. In this case, the radiation amount is preferably set to be 200 mJ/cm2 to 2000 mJ/cm2.
The second hardening resin layer in a first semi-hardened state may be hardened to such an extent that the flowability thereof can be limited. The extent of hardening may be adjusted depending upon the composition and production method of the second hardening resin, and the second hardening resin is generally hardened to such an extent that a gel fraction is 10 to 95%. Preferably, if the second hardening resin is set to be in the first semi-hardened state in which a gel fraction is 50 to 90%, the second hardening resin can be controlled easily, and trouble in terms of production due to insufficient hardening and complete hardening can be reduced.
Then, the second hardening resin layer in a first semi-hardened state is irradiated with light having a wavelength range of 300 to 400 nm as the second energy line at 5° C. to 95° C. in the air, whereby a second hardening resin layer in a second semi-hardened state is formed. In the irradiation of light having a wavelength range of 300 to 400 nm, for example, a high-pressure mercury lamp or a metal halide lamp can be used. In this case, it is preferable that the radiation amount is set to be 200 mJ/cm2 to 2000 mJ/cm2.
The second hardening resin layer in a second semi-hardened state may be hardened, for example, to such an extent that a recording layer or a reflective layer can be formed stably. The extent of hardening may be adjusted in accordance with the composition and production method of the hardening resin, and generally, the second hardening resin may be hardened to such an extent that a gel fraction is 70 to 98%. Preferably, if the second hardening resin layer in a second semi-hardened state is formed in which a gel fraction is 90 to 97%, the hardened state can be controlled easily, whereby the productivity can be enhanced.
Next, the first hardening resin layer applied to the first recording layer or reflective layer, or the second recording layer or reflective layer is irradiated with a third energy line, whereby a semi-hardening first hardening resin layer is formed. The first hardening resin may be hardened in the same way as in the formation of the semi-hardening first hardening resin layer in the production methods illustrated in
Further, the semi-hardening first hardening resin layer may be formed as follows. That is, a resin sheet is previously coated with a first hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, and the first hardening resin is irradiated with a third energy line, whereby a first hardening resin layer in a semi-hardened state is formed. Next, the first recording layer or reflective layer of the first substrate or the second recording layer or reflective layer of the second substrate is stacked on the first hardening resin layer in a semi-hardened state. Then, the resin sheet is peeled, and a first hardening resin layer in a semi-hardened state is formed on the surface of the first recording layer or reflective layer of the first substrate, or the second recording layer or reflective layer of the second substrate.
Then, the above-mentioned semi-hardening first hardening resin layer is stacked on a recording layer or reflective layer of another substrate, followed by irradiation with a fourth energy line, whereby the first hardening resin layer in a semi-hardened state and the second hardening resin layer in a second semi-hardened state are hardened completely. In this case, light having a wavelength range of 200 to 300 nm is radiated as the fourth energy line at 5° C. to 95° C. in the air. In the irradiation of light in a wavelength range of 200 to 300 nm, for example, a high-pressure mercury lamp or a metal halide lamp can be used. It is preferable that the radiation amount is 200 mJ/cm2 to 2000 mJ/cm2. The gel fraction of the completely hardened second hardening resin layer is preferably 95 to 100%, whereby the hardness and strength required in the hardening resin layer can be obtained.
As described above, in the optical recording medium having a multi-layer structure in the present invention, in order to enhance the uniformity of thickness of the hardening resin layer having an adhesive layer or a signal pattern surface, the hardening resin layer is formed in a semi-hardened state. In the semi-hardened state, unlike the unhardened state, the flowability of the hardening resin constituting the hardening resin layer is limited, so the uniform thickness during coating can be retained. Consequently, a completely hardened hardening resin layer having a uniform thickness can be formed without being influenced by the flatness and parallelism of a substrate and a transparent stamper, and a stacking method.
Further, in the present invention, by setting the hardening resin layer in a semi-hardened state, the flowability of the hardening resin constituting the hardening resin layer is limited. Therefore, even if a method of applying a pressure, such as spreading with a roll, during stacking of a substrate and a stamper, the thickness of the layer is not fluctuated. Thus, various stacking methods, which are difficult in a conventional system with flowability, can be used.
Further, in the present invention, at least two kinds (at least three kinds in the production method illustrated in
A photopolymerization initiator used in a conventional general ultraviolet hardening resin generally has an absorbing range in a wavelength range of 200 to 400 nm, and hardens resin by irradiating an energy line in the above-mentioned wavelength range with an ultraviolet lamp such as a high-pressure mercury lamp or a metal halide lamp. However, in the present invention, the hardening resin contains a photopolymerization initiator having an absorbing range in a UV-light range and a photopolymerization initiator having an absorbing range in a wavelength range of 400 nm or more. A semi-hardened state is realized by irradiating the hardening resin layer with visible light having a wavelength range of 400 nm or more, and complete hardening is realized by irradiating the hardening resin layer with UV-light in a wavelength range of 400 nm or less. By selecting the composition of the hardening resin, and the kind and concentration of the photopolymerization initiator, even if visible light is radiated excessively, a hardening resin layer in a semi-hardened state, which is not hardened completely, can be formed easily. Further, the photopolymerization initiator having an absorbing range in a UV-light range does not react in a visible light range. Therefore, the photopolymerization initiator does not start a polymerization reaction until the irradiation of UV-light, which realizes complete hardening easily.
Further, the production method of the present invention is different from the method of controlling a semi-hardened state and a completely hardened state with a photopolymerization initiator as in the prior art. In the production method of the present invention, at least two kinds (at least three kinds in the production method illustrated in
Further, unlike a conventional thermal cross-linking system, according to the production method of the present invention, a hardened state can be realized within a short period of time, and an ordinary halogen lamp or the like can be used for a photopolymerization initiator that reacts with visible light, whereby an apparatus can be simplified.
Further, the protective layer to be formed on the recording layer or the reflective layer can be formed by stacking a resin sheet with an adhesive or applying hardening resin, followed by hardening. If required, a plurality of hardening resin layers can also be formed.
An adhesive layer can enhance the adhesion with respect to an adherend by combining, if required, various systems including the chemical adhesion such as chemical bonding, the physical adhesion such as Van der Waals' force, and the adhesion due to cohesion. If required, an additive and processing can be used so as to enhance the adhesion.
Specifically, most of the hardening resin that reacts with the photopolymerization initiator has a high adhesion with polycarbonate resin or acrylic resin, and can function as an adhesive layer with sufficiently high adhesion by completely hardening the hardening resin under the condition that the adhesive layer in a semi-hardened state is in contact with an adherend such as polycarbonate resin or acrylic resin. Further, by subjecting the surface of an adherend to UV ozone treatment or plasma treatment, the cleanness of the surface can be enhanced, and the adhesion can also be enhanced by refining the surface state. In the case where the adherend is glass or metal, silane coupling agent treatment or primer treatment can also be performed. The above-mentioned treatments include a method of forming a thin film layer on an adherend. However, the thin film layer does not influence the thickness distribution of the hardening resin layer because the thickness of the thin film layer is extremely small.
Hereinafter, the present invention will be described further by way of examples.
A polycarbonate resin substrate (referred to as substrate 1) (thickness: 1.1 mm, outer diameter: 80 mm, inner diameter: 15 mm) having a signal pattern on one surface was formed by injection molding (see
Next, the reflective layer 2 was coated with a first hardening resin (thickness: 25 μm) containing 0.5% by mass of a first photopolymerization initiator including epoxyacrylate and dicarbonyl-based camphorquinone and 2% by mass of a second photopolymerization initiator including benzoin-based benzoinmethylether, whereby a first hardening resin layer 3 was formed (see
On the first hardening resin layer 3 in a semi-hardened state, a transparent stamper 4 formed by injection molding was stacked in vacuum with the signal pattern surface of the transparent stamper 4 opposed to the first hardening resin layer 3, in the same way as in the substrate 1 (see
Next, an SiN layer was formed in a thickness of 10 nm by sputtering on the signal pattern surface of the first hardening resin layer 3 with the signal pattern formed thereon, whereby a reflective layer 5 was formed (see
Further, the optical recording medium was reproduced with laser light of 405 nm, whereby signal characteristics of high quality with a jitter of 4 to 6% and a signal noise of −70 to −80 dB were obtained. It is considered from the result that a signal pattern was transferred satisfactorily in the above-mentioned optical recording medium.
As a first substrate, a polycarbonate resin substrate (referred to as substrate) (thickness: 1.1 mm, outer diameter: 80 mm, inner diameter: 15 mm) having a signal pattern on one surface was formed by injection molding. Next, a reflective layer 2 was formed by a sputtering film formation apparatus on the surface of the substrate 1 where the signal pattern was formed (see
A stamper was stacked on a thermoplastic resin sheet formed of a polycarbonate resin (thickness: 75 μm), followed by pressing and heating, whereby a second substrate (referred to as substrate 7) having a signal pattern was formed. An SiN layer (thickness: 10 nm) was formed by sputtering on the surface of the substrate 7 where the signal pattern was formed, whereby a reflective layer 8 was formed (see
The reflective layer 2 of the substrate 1 was coated with a first hardening resin (thickness: 25 μm) in the same way as in Example 1, whereby a first hardening resin layer 3 was formed (see
In this example, although the transmission amount of UV-light was attenuated by the reflective layer 8, there was no problem in hardening the first hardening resin layer 3. Further, the optical recording medium was reproduced with laser light of 405 nm, whereby signal characteristics of high quality with a jitter of 4 to 6% and a signal noise of −70 to −80 dB were obtained. It is considered from the result that a signal pattern was transferred satisfactorily in the above-mentioned optical recording medium.
In the optical recording medium produced in this example, the substrate 7 functions as the organic protective layer. Therefore, it is not necessary to form an organic protective layer on the reflective layer 8, whereby the productivity was enhanced with processes simplified. Further, the substrates on which the reflective layers 2 and 8 are formed are different. Therefore, the same substrate does not need to be input repeatedly in a film formation process, and consequently, an optical recording medium of high quality can be produced with enhanced productivity and without being influenced by heat during film formation of the reflective layer.
In this example, an optical recording medium is produced by attaching the first hardening resin layer 3 through hardening. However, if desired, the substrate 7 may be peeled off, and the hardening resin layer and the reflective layer may be formed repeatedly, or the organic protective layer may be formed on the reflective layer.
A polycarbonate resin substrate (referred to as substrate 1) (thickness: 1.1 mm, outer diameter: 80 mm, inner diameter: 15 mm) having a signal pattern on one surface was formed by injection molding (see
Next, a reflective layer 2 was formed by a sputtering film formation apparatus on the surface of the substrate 1 where the signal pattern was formed (see
As a second substrate, a stamper 10 was stacked on a thermoplastic resin sheet formed of a polycarbonate resin (thickness: 20 μm), followed by pressing and heating (see
The reflective layer 2 of the substrate 1 was coated with a first hardening resin (thickness: 5 μm) in the same way as in Example 1, whereby a first hardening resin layer 3 was formed (see
Although the thickness uniformity decreased slightly due to the fluctuation of each thickness of the first hardening resin layer 3 and the organic protective layer 6, there was no problem in recording, reproducing, and erasing. Further, the optical recording medium was reproduced with laser light of 405 nm, whereby signal characteristics of high quality with a jitter of 4 to 6% and a signal noise of −70 to −80 dB were obtained. It is considered from the result that a signal pattern was transferred satisfactorily in the above-mentioned optical recording medium.
In this example, the substrate 7 having the reflective layer 8 was attached with a highly precise thickness. Further, if desired, a plurality of the substrates 7 having a recording layer can be attached repeatedly to simplify a method of producing an optical recording medium with a multi-layer structure.
As a first substrate, a polycarbonate resin substrate (referred to as substrate 1) (thickness: 1.1 mm, outer diameter: 80 mm, inner diameter: 15 mm) having a signal pattern on one surface was formed by injection molding (see
A glass substrate 7 (thickness: 1.1 mm) without a signal pattern was prepared. The glass substrate 7 was coated with a hardening resin (thickness: 75 μm) containing, as a second hardening resin 9, 0.5% of first photopolymerization initiator including urethaneacrylate and dicarbonyl-based camphorquinone, 0.5% of second photopolymerization initiator including benzoin-based benzoinisopropylether, and 2.0% of third photopolymerization initiator including benzoin-based benzoinmethylether, whereby a second hardening resin layer 9 was formed (see
Then, the second hardening resin layer 9 was irradiated with UV-light via a filter transmitting only light of a wavelength range of 350 to 360 nm, whereby the second hardening resin layer 9 was set to a second semi-hardened state. In addition, the stamper 10 was peeled off, whereby a signal pattern was formed on the second hardening resin layer 9 on the glass substrate 7 (see
Next, an SiN layer was stacked in a thickness of 10 nm by sputtering on the signal pattern surface of the second hardening resin layer 9 with the signal pattern formed thereon, whereby a reflective layer 8 was formed (see
Further, the reflective layer 2 of the substrate 1 was coated with the first hardening resin in the same way as in Example 1, whereby a first hardening resin layer 3 was formed (see
By allowing the second hardening resin for forming the second hardening resin layer 9 to contain three kinds of photopolymerization initiators, the first semi-hardened state without flowability, the second semi-hardened state in which a signal pattern can be formed and which has adhesiveness because of incomplete hardening, and a completely hardened state can be controlled easily. This enables the peeling property between the glass substrate 7 and the second hardening resin layer 9 to be controlled, and if desired, the second hardening resin layer 9 can be made difficult to be peeled off from the glass substrate 7 or can be made easy to be peeled off in a later process. Further, a hardening resin layer with a uniform thickness can be formed on a substrate. More specifically, by allowing the substrate to hold the hardening resin layer with a small thickness, the problems such as difficulty in layer formation and transportation in dealing with sheet resins can be solved, and by controlling the hardened state of the hardening resin layer step-wise, the substrate can be peeled off in an arbitrary process. Further, this enables the productivity of the optical recording medium with a multi-layer structure to be enhanced. Regarding the second hardening resin layer 9 on the glass substrate 7, signal patterns can be formed on both surfaces by forming a signal pattern on the glass substrate 7, whereby the productivity can be enhanced in production of an optical recording medium with a multi-layer structure of three layers or more.
Further, the optical recording medium was reproduced with laser light of 405 nm, whereby signal characteristics of high quality with a jitter of 4 to 6% and a signal noise of −70 to −80 dB were obtained. It is considered from the result that a signal pattern was transferred satisfactorily in the above-mentioned optical recording medium.
A polyethyleneterephthalate film (thickness: 100 μm) containing a release agent was coated with a hardening resin by slit coating to form a first hardening resin layer 3. Then, the first hardening resin layer 3 was irradiated with visible light using a halogen lamp, whereby a first hardening resin layer 3 was semi-hardened.
An optical recording medium was produced in the same way as in Examples 1 to 4, except that: the first hardening resin layer 3 and a signal pattern surface of the substrate 1 with the reflective layer 2 formed thereon were arranged so as to oppose each other and were stacked, and the polyethyleneterephthalate film was peeled off, whereby the first hardening resin layer 3 in a semi-hardened state was formed on the substrate 1. The thickness of the first hardening resin layer 3 was 25±0.5 μm. Further, the optical recording medium was reproduced with laser light of 405 nm, whereby signal characteristics of high quality with a jitter of 4 to 6% and a signal noise of −70 to −80 dB were obtained. It is considered from the result that a signal pattern was transferred satisfactorily in the above-mentioned optical recording medium.
According to Examples 5 to 8, the first hardening resin layer excellent in thickness uniformity can be formed without using a thickness enhancing method such as sealing a center hole by spin coating, whereby the productivity can be enhanced. Further, the process of coating the reflective layer or the recording layer with an unhardened resin is not required, so the influence such as degradation of the reflective layer or the recording layer by the unhardened resin can be prevented, which enables production of an optical recording medium of high quality.
As described above, according to the present invention, an adhesive layer or a hardening resin layer with a signal pattern surface is formed using a hardening resin containing at least two kinds of photopolymerization initiators having different absorbing wavelength ranges, whereby the hardened state of the adhesive layer or the hardening resin layer can be controlled step-wise. Thus, a hardening resin layer in a semi-hardened state with limited flowability can be formed, and the thickness uniformity of the hardening resin layer to be formed finally can be enhanced. By performing complete hardening in a later process, an optical recording medium of high quality can be produced easily without defects such as spreading of a resin or contamination of air bubbles. Further, the hardened state of the hardening resin is controlled, whereby the hardening resin layer in a semi-hardened state with a signal pattern formed thereon is attached to a substrate and is then peeled off easily from the substrate by being completely hardened, leading to enhancement of productivity of an optical recording medium with a multi-layer structure. Further, since the hardened state can be controlled, the adhesive layer can be brought into contact with the substrate, the recording layer, or the reflective layer to be an adherend in a semi-hardened state. This can prevent the reduction in adhesion of an adherend with the adhesive layer caused by the formation of a semi-hardened state.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2006-128398, filed May 2, 2006, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2006-128398 | May 2006 | JP | national |